the die mounting substrate comprising an aperture

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CPC
H01L2924/15151

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

Current Industry

H01L2924/15151the die mounting substrate comprising an aperture

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package using a polymer substrate
- Patent number 12,187,603
- Issue date Jan 7, 2025
- Amkor Technology Singapore Holding Pte Ltd.
- Yung Woo Lee
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Memory bandwidth aggregation using simultaneous access of stacked s...
- Patent number 12,131,796
- Issue date Oct 29, 2024
- RAMBUS INC.
- Yohan Frans
- G11 - INFORMATION STORAGE
Information Patent Grant
High density substrate routing in package
- Patent number 12,051,667
- Issue date Jul 30, 2024
- Intel Corporation
- Weng Hong Teh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package substrate and method of forming the same, package structure...
- Patent number 12,027,379
- Issue date Jul 2, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Ping-Heng Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic element mounting substrate, and electronic device
- Patent number 11,996,339
- Issue date May 28, 2024
- Kyocera Corporation
- Kenichi Ura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package and a method of manufacturing the same
- Patent number 11,862,525
- Issue date Jan 2, 2024
- Advanced Semiconductor Engineering, Inc.
- Tsung-Yu Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming a 3D interposer system-i...
- Patent number 11,842,991
- Issue date Dec 12, 2023
- STATS ChipPAC Pte. Ltd.
- DeokKyung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High density substrate routing in package
- Patent number 11,810,884
- Issue date Nov 7, 2023
- Intel Corporation
- Weng Hong Teh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display apparatus
- Patent number 11,705,546
- Issue date Jul 18, 2023
- Samsung Display Co., Ltd.
- Junhee Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming interposer with opening...
- Patent number 11,688,612
- Issue date Jun 27, 2023
- STATS ChipPAC Pte. Ltd.
- Reza A. Pagaila
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory bandwidth aggregation using simultaneous access of stacked s...
- Patent number 11,651,801
- Issue date May 16, 2023
- RAMBUS INC.
- Yohan Frans
- G11 - INFORMATION STORAGE
Information Patent Grant
Device package with reduced radio frequency losses
- Patent number 11,574,879
- Issue date Feb 7, 2023
- Infineon Technologies AG
- Pedro Augusto Borrego Lambin Torres Amaral
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor package using a polymer substrate
- Patent number 11,572,269
- Issue date Feb 7, 2023
- Amkor Technology Singapore Holding Pte Ltd.
- Yung Woo Lee
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Double-sided hermetic multichip module
- Patent number 11,532,526
- Issue date Dec 20, 2022
- Schlumberger Technology Corporation
- Cleverson Souza Chaves
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electro-optical device and electronic apparatus
- Patent number 11,495,774
- Issue date Nov 8, 2022
- Seiko Epson Corporation
- Yoshitaka Hama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure having a dielectric layer edge covering cir...
- Patent number 11,410,897
- Issue date Aug 9, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Wei Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packages and methods of forming same
- Patent number 11,387,118
- Issue date Jul 12, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Underfill method for semiconductor package
- Patent number 11,355,360
- Issue date Jun 7, 2022
- Enjet Co., Ltd.
- Do Young Byun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming MEMS package
- Patent number 11,319,207
- Issue date May 3, 2022
- STATS ChipPAC Pte. Ltd.
- Yaojian Lin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor device package and a method of manufacturing the same
- Patent number 11,276,616
- Issue date Mar 15, 2022
- Advanced Semiconductor Engineering, Inc.
- Tsung-Yu Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High density substrate routing in package
- Patent number 11,251,150
- Issue date Feb 15, 2022
- Intel Corporation
- Weng Hong Teh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System and method for a mems transducer
- Patent number 11,225,408
- Issue date Jan 18, 2022
- Infineon Technologies AG
- Andreas Wiesbauer
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Thermal performance structure for semiconductor packages and method...
- Patent number 11,158,614
- Issue date Oct 26, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jung Wei Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 11,133,296
- Issue date Sep 28, 2021
- Samsung Electronics Co., Ltd.
- Chanhee Jeong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming double-sided fan-out waf...
- Patent number 11,127,668
- Issue date Sep 21, 2021
- JCET Semiconductor (Shaoxing) Co., Ltd.
- Il Kwon Shim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,107,761
- Issue date Aug 31, 2021
- Denso Corporation
- Takanori Kawashima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Shielded package assemblies with integrated capacitor
- Patent number 11,049,819
- Issue date Jun 29, 2021
- International Business Machines Corporation
- Mark C. Lamorey
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Electronic device having an under-fill element, a mounting method o...
- Patent number 10,910,338
- Issue date Feb 2, 2021
- Samsung Display Co., Ltd.
- Jeonghun Go
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory bandwidth aggregation using simultaneous access of stacked s...
- Patent number 10,885,949
- Issue date Jan 5, 2021
- RAMBUS INC.
- Yohan Frans
- G11 - INFORMATION STORAGE
Information Patent Grant
Substrate design for semiconductor packages and method of forming same
- Patent number 10,867,949
- Issue date Dec 15, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jung Wei Cheng
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
HIGH-FREQUENCY MODULE
- Publication number 20250022817
- Publication date Jan 16, 2025
- MURATA MANUFACTURING CO., LTD.
- Tetsurou ASHIDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE DEVICES AND MEMORY SYSTEMS
- Publication number 20240363588
- Publication date Oct 31, 2024
- Yangtze Memory Technologies Co., Ltd.
- XuHui Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH DENSITY SUBSTRATE ROUTING IN PACKAGE
- Publication number 20240339428
- Publication date Oct 10, 2024
- Intel Corporation
- Weng Hong TEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR APPARATUS AND MANUFACTURING METHOD
- Publication number 20240290741
- Publication date Aug 29, 2024
- Advantest Corporation
- Shinji SUGATANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20240178082
- Publication date May 30, 2024
- NANYA TECHNOLOGY CORPORATION
- Wu-Der Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20240178083
- Publication date May 30, 2024
- NANYA TECHNOLOGY CORPORATION
- Wu-Der Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE
- Publication number 20240170437
- Publication date May 23, 2024
- Advanced Semiconductor Engineering, Inc.
- Chun Fu KUO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD OF FORMING THEREOF
- Publication number 20240153833
- Publication date May 9, 2024
- NANYA TECHNOLOGY CORPORATION
- Wu-Der Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND A METHOD OF MANUFACTURING THE SAME
- Publication number 20240145319
- Publication date May 2, 2024
- Advanced Semiconductor Engineering, Inc.
- Tsung-Yu LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND FABRICATION METHOD THEREOF
- Publication number 20240120306
- Publication date Apr 11, 2024
- UNITED MICROELECTRONICS CORP.
- Kai-Kuang Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH A POROUS AIR VENT
- Publication number 20240063067
- Publication date Feb 22, 2024
- Micron Technology, Inc.
- Jong Sik Paek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WINDOW BALL GRID ARRAY (WBGA) PACKAGE AND METHOD FOR MANUFACTURING...
- Publication number 20240047331
- Publication date Feb 8, 2024
- NANYA TECHNOLOGY CORPORATION
- Wu-Der Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WINDOW BALL GRID ARRAY (WBGA) PACKAGE AND METHOD FOR MANUFACTURING...
- Publication number 20240047333
- Publication date Feb 8, 2024
- NANYA TECHNOLOGY CORPORATION
- Wu-Der Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE
- Publication number 20240038607
- Publication date Feb 1, 2024
- STMicroelectronics (Grenoble 2) SAS
- Fanny LAPORTE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING PAD STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20240021550
- Publication date Jan 18, 2024
- NANYA TECHNOLOGY CORPORATION
- Wu-Der Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING PAD STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20240021551
- Publication date Jan 18, 2024
- NANYA TECHNOLOGY CORPORATION
- Wu-Der Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND CIRCUIT BOARD THEREOF
- Publication number 20240008171
- Publication date Jan 4, 2024
- Chipbond Technology Corporation
- Wei-Teng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANCHOR-CONTAINING UNDERFILL STRUCTURES FOR A CHIP PACKAGE AND METHO...
- Publication number 20230420314
- Publication date Dec 28, 2023
- Taiwan Semiconductor Manufacturing Company Limited
- Chin-Hua Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH SUBSTRATE FOR ELECTRICAL CONNECTION
- Publication number 20230369280
- Publication date Nov 16, 2023
- NANYA TECHNOLOGY CORPORATION
- Wu-Der Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FILM PACKAGE AND PACKAGE MODULE INCLUDING THE SAME
- Publication number 20230369265
- Publication date Nov 16, 2023
- Samsung Electronics Co., Ltd.
- Narae SHIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING WINDOW BALL GRID ARRAY (WBGA) PACKAGE
- Publication number 20230361073
- Publication date Nov 9, 2023
- NANYA TECHNOLOGY CORPORATION
- Wu-Der Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WINDOW BALL GRID ARRAY (WBGA) PACKAGE
- Publication number 20230361012
- Publication date Nov 9, 2023
- NANYA TECHNOLOGY CORPORATION
- Wu-Der Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE
- Publication number 20230260866
- Publication date Aug 17, 2023
- MEDIATEK INC.
- Yin-Fa CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE USING A POLYMER SUBSTRATE
- Publication number 20230257257
- Publication date Aug 17, 2023
- Amkor Technology Singapore Holding Pte. Ltd.
- Yung Woo Lee
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20230260887
- Publication date Aug 17, 2023
- Samsung Electronics Co., Ltd.
- Se-Ho YOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20230170267
- Publication date Jun 1, 2023
- JCET MANAGEMENT CO., LTD.
- CHENG YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20230170274
- Publication date Jun 1, 2023
- JCET MANAGEMENT CO., LTD.
- CHENG YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE, METHOD OF FORMING THE PACKAGE AND ELECTRONIC...
- Publication number 20230135498
- Publication date May 4, 2023
- STMicroelectronics S.r.l.
- Yi Ming LIANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20230107554
- Publication date Apr 6, 2023
- Korea Electronics Technology Institute
- Jong Min YOOK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE HAVING WIREBONDED MULTI-DIE STACK
- Publication number 20230023328
- Publication date Jan 26, 2023
- Intel Corporation
- Thorsten Meyer
- H01 - BASIC ELECTRIC ELEMENTS

the die mounting substrate comprising an aperture

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor package using a polymer substrate

Memory bandwidth aggregation using simultaneous access of stacked s...

High density substrate routing in package

Package substrate and method of forming the same, package structure...

Electronic element mounting substrate, and electronic device

Semiconductor device package and a method of manufacturing the same

Semiconductor device and method of forming a 3D interposer system-i...

High density substrate routing in package

Display apparatus

Semiconductor device and method of forming interposer with opening...

Memory bandwidth aggregation using simultaneous access of stacked s...

Device package with reduced radio frequency losses

Semiconductor package using a polymer substrate

Double-sided hermetic multichip module

Electro-optical device and electronic apparatus

Semiconductor structure having a dielectric layer edge covering cir...

Integrated circuit packages and methods of forming same

Underfill method for semiconductor package

Semiconductor device and method of forming MEMS package

Semiconductor device package and a method of manufacturing the same

High density substrate routing in package

System and method for a mems transducer

Thermal performance structure for semiconductor packages and method...

Semiconductor package

Semiconductor device and method of forming double-sided fan-out waf...

Semiconductor device

Shielded package assemblies with integrated capacitor

Electronic device having an under-fill element, a mounting method o...

Memory bandwidth aggregation using simultaneous access of stacked s...

Substrate design for semiconductor packages and method of forming same

Patents Applicationslast 30 patents

HIGH-FREQUENCY MODULE

CHIP PACKAGE DEVICES AND MEMORY SYSTEMS

HIGH DENSITY SUBSTRATE ROUTING IN PACKAGE

SEMICONDUCTOR APPARATUS AND MANUFACTURING METHOD

PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME

PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME

PACKAGE STRUCTURE

PACKAGE STRUCTURE AND METHOD OF FORMING THEREOF

SEMICONDUCTOR DEVICE PACKAGE AND A METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE AND FABRICATION METHOD THEREOF

SEMICONDUCTOR DEVICE WITH A POROUS AIR VENT

WINDOW BALL GRID ARRAY (WBGA) PACKAGE AND METHOD FOR MANUFACTURING...

WINDOW BALL GRID ARRAY (WBGA) PACKAGE AND METHOD FOR MANUFACTURING...

INTEGRATED CIRCUIT PACKAGE

BONDING PAD STRUCTURE AND METHOD FOR MANUFACTURING THE SAME

BONDING PAD STRUCTURE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE AND CIRCUIT BOARD THEREOF

ANCHOR-CONTAINING UNDERFILL STRUCTURES FOR A CHIP PACKAGE AND METHO...

SEMICONDUCTOR DEVICE WITH SUBSTRATE FOR ELECTRICAL CONNECTION

FILM PACKAGE AND PACKAGE MODULE INCLUDING THE SAME

METHOD FOR MANUFACTURING WINDOW BALL GRID ARRAY (WBGA) PACKAGE

WINDOW BALL GRID ARRAY (WBGA) PACKAGE

SEMICONDUCTOR PACKAGE STRUCTURE

SEMICONDUCTOR PACKAGE USING A POLYMER SUBSTRATE

SEMICONDUCTOR PACKAGE

PACKAGING STRUCTURE AND MANUFACTURING METHOD THEREOF

PACKAGING STRUCTURE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR PACKAGE, METHOD OF FORMING THE PACKAGE AND ELECTRONIC...

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

INTEGRATED CIRCUIT PACKAGE HAVING WIREBONDED MULTI-DIE STACK