the encapsulation having a cavity

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H01L23/315

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

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H01L23/315the encapsulation having a cavity

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor apparatuses with radio-frequency line elements, and a...
- Patent number 12,368,111
- Issue date Jul 22, 2025
- Infineon Technologies AG
- Walter Hartner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package and method of fabricating the same
- Patent number 12,362,263
- Issue date Jul 15, 2025
- Siliconware Precision Industries Co., Ltd.
- Pin-Jing Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Laser ablation-based surface property modification and contaminatio...
- Patent number 12,362,340
- Issue date Jul 15, 2025
- Intel Corporation
- Denis Myasishchev
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of fabricating the same
- Patent number 12,362,328
- Issue date Jul 15, 2025
- Samsung Electronics Co., Ltd.
- Jaekyung Yoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a sealed cavity embedded in a semiconductor wafer
- Patent number 12,356,698
- Issue date Jul 8, 2025
- Analog Devices, Inc.
- Yingqi Jiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Double-sided stacked DTC structure
- Patent number 12,356,639
- Issue date Jul 8, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ming Chyi Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure and method for forming the same
- Patent number 12,355,001
- Issue date Jul 8, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yen-Chu Tu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of fabricating package structure
- Patent number 12,355,008
- Issue date Jul 8, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sensor package cavities with polymer films
- Patent number 12,347,738
- Issue date Jul 1, 2025
- Texas Instruments Incorporated
- Sreenivasan Kalyani Koduri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure
- Patent number 12,347,739
- Issue date Jul 1, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Wei Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and semiconductor device
- Patent number 12,347,814
- Issue date Jul 1, 2025
- Mitsubishi Electric Corporation
- Yosuke Nakata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package and manufacturing method thereof
- Patent number 12,334,425
- Issue date Jun 17, 2025
- Siliconware Precision Industries Co., Ltd.
- Ho-Chuan Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Forming recesses in molding compound of wafer to reduce stress
- Patent number 12,334,474
- Issue date Jun 17, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Hung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic devices including vent openings and associated methods
- Patent number 12,334,405
- Issue date Jun 17, 2025
- Infineon Technologies AG
- Michael Stadler
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor package having composite seed-barrier layer and metho...
- Patent number 12,322,682
- Issue date Jun 3, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wei-Chung Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package using a coreless signal distribution structure
- Patent number 12,322,731
- Issue date Jun 3, 2025
- Amkor Technology Singapore Holding Pte Ltd.
- Do Hyung Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual-mode wireless charging device
- Patent number 12,322,696
- Issue date Jun 3, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shih-Wei Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Underfill vacuum process
- Patent number 12,315,775
- Issue date May 27, 2025
- International Business Machines Corporation
- Toyohiro Aoki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated device package with an integrated heat sink
- Patent number 12,315,776
- Issue date May 27, 2025
- Analog Devices, Inc.
- Michael John Anderson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip package having stress relief structure
- Patent number 12,308,344
- Issue date May 20, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jen-Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit assembly with hybrid bonding
- Patent number 12,300,655
- Issue date May 13, 2025
- QUALCOMM Incorporated
- Jonghae Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming an optical semiconductor...
- Patent number 12,302,657
- Issue date May 13, 2025
- UTAC HEADQUARTERS PTE. LTD.
- Emmanuel Espiritu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a heat dissipation structure connected...
- Patent number 12,300,618
- Issue date May 13, 2025
- Taiwna Semiconductor Manufacturing Company, Ltd.
- Po-Yuan Teng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package including stress buffering layer
- Patent number 12,300,677
- Issue date May 13, 2025
- Advanced Semiconductor Engineering, Inc.
- Chien-Mei Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adhesive and thermal interface material on a plurality of dies cove...
- Patent number 12,300,574
- Issue date May 13, 2025
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Chih-Hao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module and semiconductor apparatus
- Patent number 12,300,562
- Issue date May 13, 2025
- Fuji Electric Co., Ltd.
- Yushi Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package and method
- Patent number 12,288,729
- Issue date Apr 29, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Tzu-Sung Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 12,288,764
- Issue date Apr 29, 2025
- Amkor Technology Singapore Holding Pte Ltd.
- Gyu Wan Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages
- Patent number 12,283,543
- Issue date Apr 22, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jie Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package including electronic structure and electronic bo...
- Patent number 12,283,560
- Issue date Apr 22, 2025
- Siliconware Precision Industries Co., Ltd.
- Feng Kao
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
CAVITY TAPE FOR PACKAGE PROTECTION
- Publication number 20250239497
- Publication date Jul 24, 2025
- Western Digital Technologies, Inc.
- Ankit Kumar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING A HEAT DISSIPATION STRUCTURE CONNECTED...
- Publication number 20250239528
- Publication date Jul 24, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Po-Yuan Teng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20250239569
- Publication date Jul 24, 2025
- Advanced Semiconductor Engineering, Inc.
- Chih-Ming HUNG
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
CAVITY INTEGRATED CIRCUIT
- Publication number 20250233037
- Publication date Jul 17, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Masamitsu Matsuura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING STRUCTURE OF RF FRONT-END MODULE
- Publication number 20250226350
- Publication date Jul 10, 2025
- RADROCK (CHONGQING) MICROELECTRONICS CO., LTD.
- Jianxing Ni
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE WITH CARRIER HAVING PLATED BOTTOM SURFACE AND SIDEWALL
- Publication number 20250226297
- Publication date Jul 10, 2025
- INFINEON TECHNOLOGIES AG
- Kok Yau CHUA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER SUBSTRATES, POWER MODULES, AND ELECTRICAL SYSTEMS
- Publication number 20250226301
- Publication date Jul 10, 2025
- Shenzhen STS Microelectronics Co., Ltd.
- Qiao CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
- Publication number 20250218887
- Publication date Jul 3, 2025
- Fuji Electric Co., Ltd.
- Kohei YAMAUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICES IN SEMICONDUCTOR PACKAGE CAVITIES
- Publication number 20250218886
- Publication date Jul 3, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Christopher Daniel MANACK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250216625
- Publication date Jul 3, 2025
- Samsung Electronics Co., Ltd.
- Juhyeon Oh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PATTERNED MOLD UNDERFILL (MUF) FILMS FOR DEEP TRENCH FILLING
- Publication number 20250218885
- Publication date Jul 3, 2025
- Intel Corporation
- Hong Seung YEON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FORMING SAME
- Publication number 20250219030
- Publication date Jul 3, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wensen Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE AND METHOD OF PRODUCING SEMICONDUCTOR MODULE
- Publication number 20250210435
- Publication date Jun 26, 2025
- Murata Manufacturing Co., Ltd.
- Akira FUJIHARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTROL UNIT
- Publication number 20250210454
- Publication date Jun 26, 2025
- ROBERT BOSCH GmbH
- Maximilian Amberger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250210434
- Publication date Jun 26, 2025
- Samsung Electronics Co., Ltd.
- Sang Ho SHIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250210563
- Publication date Jun 26, 2025
- Shinko Electric Industries Co., Ltd.
- Shinichiro Sekijima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE COMPRISING INTEGRATED DEVICES AND A PASSIVE DEVICE
- Publication number 20250201786
- Publication date Jun 19, 2025
- QUALCOMM Incorporated
- Yue LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM AND METHODS FOR AN EMBEDDED BRIDGING PACKAGE ARCHITECTURE
- Publication number 20250201690
- Publication date Jun 19, 2025
- Samsung Electronics Co., Ltd.
- Jin YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING
- Publication number 20250191939
- Publication date Jun 12, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Po-Chen Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250192060
- Publication date Jun 12, 2025
- Samsung Electronics Co., Ltd.
- Eunsu Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACK CHIP PACKAGE
- Publication number 20250183238
- Publication date Jun 5, 2025
- SK HYNIX INC.
- Dong Sop LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW PROFILE SENSOR PACKAGES
- Publication number 20250174616
- Publication date May 29, 2025
- STMicroelectronics Pte Ltd
- Jing-En LUAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NESTED ARCHITECTURES FOR ENHANCED HETEROGENEOUS INTEGRATION
- Publication number 20250174523
- Publication date May 29, 2025
- Intel Corporation
- Ravindranath MAHAJAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE
- Publication number 20250174508
- Publication date May 29, 2025
- Advanced Semiconductor Engineering, Inc.
- Wei-Tung CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING SEMICONDUCTOR DEVICE WITH FIN ISOLATION
- Publication number 20250174463
- Publication date May 29, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chang-Yin Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE
- Publication number 20250174589
- Publication date May 29, 2025
- Innolux Corporation
- Ying-Jen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING DUMMY PADS AND MANUFACTURING METHOD...
- Publication number 20250157962
- Publication date May 15, 2025
- Samsung Electronics Co., Ltd.
- HANSUNG RYU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250149518
- Publication date May 8, 2025
- Samsung Electronics Co., Ltd.
- Yejin LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COVERS FOR SEMICONDUCTOR PACKAGE COMPONENTS
- Publication number 20250149394
- Publication date May 8, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Sreenivasan Kalyani KODURI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE
- Publication number 20250149396
- Publication date May 8, 2025
- Advanced Semiconductor Engineering, Inc.
- Po-Jen CHENG
- H01 - BASIC ELECTRIC ELEMENTS

the encapsulation having a cavity

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor apparatuses with radio-frequency line elements, and a...

Electronic package and method of fabricating the same

Laser ablation-based surface property modification and contaminatio...

Semiconductor package and method of fabricating the same

Method of forming a sealed cavity embedded in a semiconductor wafer

Double-sided stacked DTC structure

Semiconductor package structure and method for forming the same

Methods of fabricating package structure

Sensor package cavities with polymer films

Package structure

Semiconductor package and semiconductor device

Electronic package and manufacturing method thereof

Forming recesses in molding compound of wafer to reduce stress

Electronic devices including vent openings and associated methods

Semiconductor package having composite seed-barrier layer and metho...

Semiconductor package using a coreless signal distribution structure

Dual-mode wireless charging device

Underfill vacuum process

Integrated device package with an integrated heat sink

Multi-chip package having stress relief structure

Integrated circuit assembly with hybrid bonding

Semiconductor device and method of forming an optical semiconductor...

Semiconductor device having a heat dissipation structure connected...

Semiconductor device package including stress buffering layer

Adhesive and thermal interface material on a plurality of dies cove...

Semiconductor module and semiconductor apparatus

Integrated circuit package and method

Semiconductor device and manufacturing method thereof

Semiconductor packages

Electronic package including electronic structure and electronic bo...

Patents Applicationslast 30 patents

CAVITY TAPE FOR PACKAGE PROTECTION

SEMICONDUCTOR DEVICE HAVING A HEAT DISSIPATION STRUCTURE CONNECTED...

SEMICONDUCTOR DEVICE PACKAGE AND METHOD FOR MANUFACTURING THE SAME

CAVITY INTEGRATED CIRCUIT

PACKAGING STRUCTURE OF RF FRONT-END MODULE

PACKAGE WITH CARRIER HAVING PLATED BOTTOM SURFACE AND SIDEWALL

MULTILAYER SUBSTRATES, POWER MODULES, AND ELECTRICAL SYSTEMS

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE

ELECTRONIC DEVICES IN SEMICONDUCTOR PACKAGE CAVITIES

SEMICONDUCTOR PACKAGE

PATTERNED MOLD UNDERFILL (MUF) FILMS FOR DEEP TRENCH FILLING

SEMICONDUCTOR DEVICE AND METHOD OF FORMING SAME

SEMICONDUCTOR MODULE AND METHOD OF PRODUCING SEMICONDUCTOR MODULE

CONTROL UNIT

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR DEVICE

PACKAGE COMPRISING INTEGRATED DEVICES AND A PASSIVE DEVICE

SYSTEM AND METHODS FOR AN EMBEDDED BRIDGING PACKAGE ARCHITECTURE

SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING

SEMICONDUCTOR PACKAGE

STACK CHIP PACKAGE

LOW PROFILE SENSOR PACKAGES

NESTED ARCHITECTURES FOR ENHANCED HETEROGENEOUS INTEGRATION

SEMICONDUCTOR DEVICE PACKAGE

METHOD FOR FORMING SEMICONDUCTOR DEVICE WITH FIN ISOLATION

PACKAGE STRUCTURE

SEMICONDUCTOR PACKAGE INCLUDING DUMMY PADS AND MANUFACTURING METHOD...

SEMICONDUCTOR PACKAGE

COVERS FOR SEMICONDUCTOR PACKAGE COMPONENTS

PACKAGE STRUCTURE