the first connecting process involving a bump connector

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H01L2224/92222

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/92222the first connecting process involving a bump connector

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Patents Grantslast 30 patents

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Information Patent Grant
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Die encapsulation in oxide bonded wafer stack
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Test probe head for full wafer testing
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Information Patent Grant
Die encapsulation in oxide bonded wafer stack
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Information Patent Grant
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Information Patent Grant
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Patents Applicationslast 30 patents

Information Patent Application
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METHODS RELATED TO RADIO-FREQUENCY FILTERS ON SILICON-ON-INSULATOR...
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- H04 - ELECTRIC COMMUNICATION TECHNIQUE
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DEVICES AND METHODS RELATED TO RADIO-FREQUENCY FILTERS ON SILICON-O...
- Publication number 20200321996
- Publication date Oct 8, 2020
- SKYWORKS SOLUTIONS, INC.
- James Phillip YOUNG
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DIE ENCAPSULATION IN OXIDE BONDED WAFER STACK
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MAKING AN INTEGTATED CIRCUIT MODULE WITH DUAL LEADFRAMES
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Method of Forming Stacked Dies
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- H01 - BASIC ELECTRIC ELEMENTS

the first connecting process involving a bump connector

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Methods related to radio-frequency filters on silicon-on-insulator...

Devices and methods related to radio-frequency filters on silicon-o...

Semiconductor structure and manufacturing method thereof

Die encapsulation in oxide bonded wafer stack

Semiconductor structure and manufacturing method thereof

Devices and methods related to radio-frequency filters on silicon-o...

Test probe head for full wafer testing

Die encapsulation in oxide bonded wafer stack

Semiconductor package structure with polymeric layer and manufactur...

Methods of processing substrates

Wafer carrier having cavity

Wafer-level device packaging

Making an integrated circuit module with dual leadframes

Method of forming stacked dies

Patents Applicationslast 30 patents

DEVICES AND METHODS RELATED TO RADIO-FREQUENCY FILTERS ON SILICON-O...

SEMICONDUCTOR PACKAGE

METHODS RELATED TO RADIO-FREQUENCY FILTERS ON SILICON-ON-INSULATOR...

DEVICES AND METHODS RELATED TO RADIO-FREQUENCY FILTERS ON SILICON-O...

DIE ENCAPSULATION IN OXIDE BONDED WAFER STACK

MAKING AN INTEGTATED CIRCUIT MODULE WITH DUAL LEADFRAMES

METHODS OF PROCESSING SUBSTRATES

Semiconductor Device and Method of Forming Through-Silicon-Via with...

INTEGRATED CIRCUIT MODULE WITH DUAL LEADFRAME

Wafer Carrier Having Cavity

WAFER-LEVEL DEVICE PACKAGING

Method of Forming Stacked Dies