the first connecting process involving a layer connector

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/92142the first connecting process involving a layer connector

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Patents Grantslast 30 patents

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the first connecting process involving a layer connector

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Packaged multi-chip semiconductor devices and methods of fabricatin...

Semiconductor packages using package in package systems and related...

Integrated circuit package and method

Packaged multi-chip semiconductor devices and methods of fabricatin...

Semiconductor wafer and method of manufacturing the same

Integrated circuit package and method

Semiconductor device production method

Semiconductor-on-insulator with back side heat dissipation

Semiconductor arrangement, semiconductor system and method of formi...

Microelectronic element with bond elements to encapsulation surface

Semiconductor-on-insulator with back side strain inducing material

Methods of forming integrated circuitry

Semiconductor-on-insulator with back side strain topology

Conductor strip with contact areas having cutouts

Electronic device package and fabrication method thereof

Electronic device package and fabrication method thereof

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGES USING PACKAGE IN PACKAGE SYSTEMS AND RELATED...

Integrated Circuit Package and Method

PACKAGED MULTI-CHIP SEMICONDUCTOR DEVICES AND METHODS OF FABRICATIN...

SEMICONDUCTOR DEVICE, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

Integrated Circuit Package and Method

MICRO LED DISPLAY AND MANUFACTURING METHOD THEREFOR

PACKAGED MULTI-CHIP SEMICONDUCTOR DEVICES AND METHODS OF FABRICATIN...

INTEGRATED CIRCUIT PACKAGE AND METHOD

SEMICONDUCTOR PACKAGES USING PACKAGE IN PACKAGE SYSTEMS AND RELATED...

SEMICONDUCTOR DEVICE PRODUCTION METHOD

SEMICONDUCTOR CIRCUIT AND METHOD FOR PRODUCING THE SEMICONDUCTOR CI...

ELECTRONIC DEVICE PACKAGE AND FABRICATION METHOD THEREOF

COPPER WIRE BONDING STRUCTURE IN SEMICONDUCTOR DEVICE AND FABRICATI...

Method of Fabricating a Semiconductor Device with a Strain Inducing...

ELECTRONIC DEVICE PACKAGE AND FABRICATION METHOD THEREOF

SEMICONDUCTOR-ON-INSULATOR WITH BACK SIDE HEAT DISSIPATION