-
-
PACKAGED INTERCONNECT STRUCTURES
-
Publication number 20240113032
-
Publication date Apr 4, 2024
-
Taiwan Semiconductor Manufacturing Company, Ltd.
-
Kai-Fung CHANG
-
H01 - BASIC ELECTRIC ELEMENTS
-
-
-
-
-
-
-
-
-
-
-
-
-
-
ELECTRONIC PACKAGE
-
Publication number 20230064355
-
Publication date Mar 2, 2023
-
PHOENIX PIONEER TECHNOLOGY CO., LTD.
-
Che-Wei Hsu
-
H01 - BASIC ELECTRIC ELEMENTS
-
-
-
-
STACKED VIA STRUCTURE
-
Publication number 20220352060
-
Publication date Nov 3, 2022
-
Taiwan Semiconductor Manufacturing Company, Ltd.
-
Che-Yu Yeh
-
H01 - BASIC ELECTRIC ELEMENTS
-
-
-
ELECTRONIC CIRCUIT DEVICE
-
Publication number 20220084974
-
Publication date Mar 17, 2022
-
RISING TECHNOLOGIES CO., LTD.
-
Shuzo AKEJIMA
-
H01 - BASIC ELECTRIC ELEMENTS
-
-
-
SEMICONDUCTOR PACKAGE
-
Publication number 20220068730
-
Publication date Mar 3, 2022
-
Samsung Electronics Co., Ltd.
-
Joonsung KIM
-
H01 - BASIC ELECTRIC ELEMENTS
-
-
-
-
DISPLAY DEVICE
-
Publication number 20210336108
-
Publication date Oct 28, 2021
-
SAMSUNG DISPLAY CO., LTD.
-
Hyun Wook LEE
-
H01 - BASIC ELECTRIC ELEMENTS