the internal layer extending out of an opening

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/05027the internal layer extending out of an opening

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device
- Patent number 12,165,998
- Issue date Dec 10, 2024
- Fuji Electric Co., Ltd.
- Tohru Shirakawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting display device
- Patent number 12,080,724
- Issue date Sep 3, 2024
- Samsung Display Co., Ltd.
- Jun Ki Jeong
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
Semiconductor devices including through-silicon-vias and methods of...
- Patent number 12,014,972
- Issue date Jun 18, 2024
- Samsung Electronics Co., Ltd.
- Ju-Il Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Advanced device assembly structures and methods
- Patent number 11,999,001
- Issue date Jun 4, 2024
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Cyprian Emeka Uzoh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device having reduced bump height variation
- Patent number 11,935,866
- Issue date Mar 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jing-Cheng Lin
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and semiconductor package
- Patent number 11,791,286
- Issue date Oct 17, 2023
- Samsung Electronics Co., Ltd.
- Youn-ji Min
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal pad modification
- Patent number 11,756,911
- Issue date Sep 12, 2023
- International Business Machines Corporation
- Krishna Tunga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit structure and method for reducing polymer layer...
- Patent number 11,688,728
- Issue date Jun 27, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jing-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method for reflowed solder balls and their under bump...
- Patent number 11,664,297
- Issue date May 30, 2023
- LBSEMICON CO., LTD.
- Jae Jin Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,581,279
- Issue date Feb 14, 2023
- Samsung Electronics Co., Ltd.
- Ju-il Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, fabrication method for a semiconductor device...
- Patent number 11,569,123
- Issue date Jan 31, 2023
- Sony Corporation
- Yoshihisa Kagawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device bonding area including fused solder film and m...
- Patent number 11,545,452
- Issue date Jan 3, 2023
- Lapis Semiconductor Co., Ltd.
- Masanori Shindo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Post-passivation interconnect structure
- Patent number 11,417,610
- Issue date Aug 16, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding pad layer system, gas sensor and method for manufacturing a...
- Patent number 11,407,635
- Issue date Aug 9, 2022
- Robert Bosch GmbH
- Andreas Scheurle
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor package having a semiconductor device bonded to a cir...
- Patent number 11,387,183
- Issue date Jul 12, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Feng-Cheng Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of fabricating the same
- Patent number 11,348,876
- Issue date May 31, 2022
- Samsung Electronics Co., Ltd.
- Kyoung Lim Suk
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip with patterned underbump metallization and polym...
- Patent number 11,335,659
- Issue date May 17, 2022
- ATI Technologies ULC
- Roden R. Topacio
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mechanisms for forming post-passivation interconnect structure
- Patent number 11,257,775
- Issue date Feb 22, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ying-Ju Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silicon carbide semiconductor device having a step film formed betw...
- Patent number 11,245,013
- Issue date Feb 8, 2022
- Fuji Electric Co., Ltd.
- Yuichi Hashizume
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Back-illuminated semiconductor photodetection element
- Patent number 11,239,266
- Issue date Feb 1, 2022
- Hamamatsu Photonics K.K.
- Tomoya Taguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having through silicon vias and manufacturing...
- Patent number 11,211,363
- Issue date Dec 28, 2021
- LONGITUDE LICENSING LIMITED
- Ryohei Kitada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, manufacturing method for semiconductor device...
- Patent number 11,205,608
- Issue date Dec 21, 2021
- ADVANCED INTERCONNECT SYSTEMS LIMITED
- Haruki Ito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit structure having dies with connectors of differe...
- Patent number 11,183,473
- Issue date Nov 23, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shin-Puu Jeng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Testing of semiconductor chips with microbumps
- Patent number 11,169,207
- Issue date Nov 9, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wei-Cheng Wu
- G01 - MEASURING TESTING
Information Patent Grant
Solder-pinning metal pads for electronic components
- Patent number 11,166,381
- Issue date Nov 2, 2021
- International Business Machines Corporation
- Yves Martin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method for reflowed solder balls and their under bump...
- Patent number 11,127,658
- Issue date Sep 21, 2021
- LBSEMICON CO., LTD.
- Jae Jin Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices including through-silicon-vias and methods of...
- Patent number 11,094,612
- Issue date Aug 17, 2021
- Samsung Electronics Co., Ltd.
- Ju-Il Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacture
- Patent number 11,094,562
- Issue date Aug 17, 2021
- Nexperia B.V.
- Leung Chi Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit structure and method for reducing polymer layer...
- Patent number 11,081,475
- Issue date Aug 3, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jing-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,037,897
- Issue date Jun 15, 2021
- Rohm Co., Ltd.
- Tadahiro Morifuji
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
LIGHT EMITTING DISPLAY DEVICE
- Publication number 20240405031
- Publication date Dec 5, 2024
- SAMSUNG DISPLAY CO., LTD.
- Jun Ki JEONG
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Application
BONDING-TYPE INTERCONNECTION MEMBER
- Publication number 20240321790
- Publication date Sep 26, 2024
- Kabushiki Kaisha Toshiba
- Kei OBARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH PAD CONTACT FEATURE AND METHOD THEREFOR
- Publication number 20240282726
- Publication date Aug 22, 2024
- NXP USA, Inc.
- Trent Uehling
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING BONDING PADS AND METHOD FOR FABRICAT...
- Publication number 20240243081
- Publication date Jul 18, 2024
- SK HYNIX INC.
- Byung Ho LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MAKING SEMICONDUCTOR DEVICE HAVING REDUCED BUMP HEIGHT VA...
- Publication number 20240222318
- Publication date Jul 4, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jing-Cheng LIN
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DIE HAVING AN OPTICAL DETECTION MARKER AND METHOD OF...
- Publication number 20240120298
- Publication date Apr 11, 2024
- Dietrich Bonart
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THICK REDISTRIBUTION LAYER FEATURES
- Publication number 20240088074
- Publication date Mar 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Feng Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240079392
- Publication date Mar 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chuei-Tang WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEEP TRENCH CAPACITORS (DTCs) EMPLOYING BYPASS METAL TRACE SIGNAL R...
- Publication number 20240038753
- Publication date Feb 1, 2024
- QUALCOMM Incorporated
- Aniket PATIL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY PANEL AND MANUFACTURING METHOD THEREOF, AND ELECTRONIC TERM...
- Publication number 20240021628
- Publication date Jan 18, 2024
- Shenzhen china Star Optoelectronics Semiconductor Display Technology Co., Ltd.
- Zhuhui LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20230411323
- Publication date Dec 21, 2023
- RENESAS ELECTRONICS CORPORATION
- Etsuko WATANABE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Packages and Methods of Forming RDL and Side and Back...
- Publication number 20230343668
- Publication date Oct 26, 2023
- UTAC Headquarters Pte. Ltd.
- Il Kwon Shim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE AND MANUFACTURING METHOD OF THE SAME
- Publication number 20230326932
- Publication date Oct 12, 2023
- SAMSUNG DISPLAY CO., LTD.
- Yong Duck SON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPROACH TO PREVENT PLATING AT V-GROOVE ZONE IN PHOTONICS SILICON D...
- Publication number 20230314735
- Publication date Oct 5, 2023
- Intel Corporation
- Santosh SHAW
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY APPARATUS
- Publication number 20230309351
- Publication date Sep 28, 2023
- SAMSUNG DISPLAY CO., LTD.
- Soyoung Lee
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Application
DISPLAY DEVICE AND TILED DISPLAY DEVICE
- Publication number 20230238400
- Publication date Jul 27, 2023
- SAMSUNG DISPLAY CO., LTD.
- Seung Lyong BOK
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
DISPLAY APPARATUS
- Publication number 20230215856
- Publication date Jul 6, 2023
- Samsung Electronics Co., Ltd.
- Sihan KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY APPARATUS AND METHOD OF MANUFACTURING THE SAME
- Publication number 20230209926
- Publication date Jun 29, 2023
- SAMSUNG DISPLAY CO., LTD.
- Shinhyuk Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20230187393
- Publication date Jun 15, 2023
- Samsung Electronics Co., Ltd.
- Ju-il Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20220399319
- Publication date Dec 15, 2022
- Japan Display Inc.
- Masanobu IKEDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20220392858
- Publication date Dec 8, 2022
- Fuji Electric Co., Ltd.
- Tohru SHIRAKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACKLIGHT MODULE AND MANUFACTURING METHOD THEREOF
- Publication number 20220302181
- Publication date Sep 22, 2022
- SHENZHEN CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Junling LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE...
- Publication number 20220115296
- Publication date Apr 14, 2022
- Advanced Interconnect Systems Limited
- Haruki Ito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device Having Through Silicon Vias and Manufacturing...
- Publication number 20220102318
- Publication date Mar 31, 2022
- Ryohei Kitada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Advanced Device Assembly Structures And Methods
- Publication number 20220097166
- Publication date Mar 31, 2022
- Invensas Corporation
- Cyprian Emeka Uzoh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
MICRODEVICE CARTRIDGE STRUCTURE
- Publication number 20220005774
- Publication date Jan 6, 2022
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE
- Publication number 20210384144
- Publication date Dec 9, 2021
- Samsung Electronics Co., Ltd.
- Youn-ji MIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD FOR REFLOWED SOLDER BALLS AND THEIR UNDER BUMP...
- Publication number 20210366809
- Publication date Nov 25, 2021
- LBSEMICON CO., LTD.
- Jae Jin KWON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Circuit Structure and Method for Reducing Polymer Layer...
- Publication number 20210351173
- Publication date Nov 11, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jing-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20210233879
- Publication date Jul 29, 2021
- Samsung Electronics Co., Ltd.
- Ju-il Choi
- H01 - BASIC ELECTRIC ELEMENTS

the internal layer extending out of an opening

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device

Light emitting display device

Semiconductor devices including through-silicon-vias and methods of...

Advanced device assembly structures and methods

Semiconductor device having reduced bump height variation

Semiconductor device and semiconductor package

Metal pad modification

Integrated circuit structure and method for reducing polymer layer...

Manufacturing method for reflowed solder balls and their under bump...

Semiconductor device

Semiconductor device, fabrication method for a semiconductor device...

Semiconductor device bonding area including fused solder film and m...

Post-passivation interconnect structure

Bonding pad layer system, gas sensor and method for manufacturing a...

Semiconductor package having a semiconductor device bonded to a cir...

Semiconductor package and method of fabricating the same

Semiconductor chip with patterned underbump metallization and polym...

Mechanisms for forming post-passivation interconnect structure

Silicon carbide semiconductor device having a step film formed betw...

Back-illuminated semiconductor photodetection element

Semiconductor device having through silicon vias and manufacturing...

Semiconductor device, manufacturing method for semiconductor device...

Integrated circuit structure having dies with connectors of differe...

Testing of semiconductor chips with microbumps

Solder-pinning metal pads for electronic components

Manufacturing method for reflowed solder balls and their under bump...

Semiconductor devices including through-silicon-vias and methods of...

Semiconductor device and method of manufacture

Integrated circuit structure and method for reducing polymer layer...

Semiconductor device

Patents Applicationslast 30 patents

LIGHT EMITTING DISPLAY DEVICE

BONDING-TYPE INTERCONNECTION MEMBER

SEMICONDUCTOR DEVICE WITH PAD CONTACT FEATURE AND METHOD THEREFOR

SEMICONDUCTOR DEVICE INCLUDING BONDING PADS AND METHOD FOR FABRICAT...

METHOD OF MAKING SEMICONDUCTOR DEVICE HAVING REDUCED BUMP HEIGHT VA...

SEMICONDUCTOR DIE HAVING AN OPTICAL DETECTION MARKER AND METHOD OF...

THICK REDISTRIBUTION LAYER FEATURES

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

DEEP TRENCH CAPACITORS (DTCs) EMPLOYING BYPASS METAL TRACE SIGNAL R...

DISPLAY PANEL AND MANUFACTURING METHOD THEREOF, AND ELECTRONIC TERM...

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

Semiconductor Packages and Methods of Forming RDL and Side and Back...

DISPLAY DEVICE AND MANUFACTURING METHOD OF THE SAME

APPROACH TO PREVENT PLATING AT V-GROOVE ZONE IN PHOTONICS SILICON D...

DISPLAY APPARATUS

DISPLAY DEVICE AND TILED DISPLAY DEVICE

DISPLAY APPARATUS

DISPLAY APPARATUS AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE

DISPLAY DEVICE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE

BACKLIGHT MODULE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE, MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE...

Semiconductor Device Having Through Silicon Vias and Manufacturing...

Advanced Device Assembly Structures And Methods

MICRODEVICE CARTRIDGE STRUCTURE

SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE

MANUFACTURING METHOD FOR REFLOWED SOLDER BALLS AND THEIR UNDER BUMP...

Integrated Circuit Structure and Method for Reducing Polymer Layer...

SEMICONDUCTOR DEVICE