the item being a discrete passive component

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H01L2224/08265

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/08265the item being a discrete passive component

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Multilayer capacitor and circuit board containing the same
- Patent number 12,112,891
- Issue date Oct 8, 2024
- KYOCERA AVX Components Corporation
- Jeffrey Cain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded structures with integrated passive component
- Patent number 12,057,383
- Issue date Aug 6, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Encapsulated package including device dies connected via interconne...
- Patent number 11,978,714
- Issue date May 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kuo-Chiang Ting
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating a chip package
- Patent number 11,908,692
- Issue date Feb 20, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jie Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer capacitor and circuit board containing the same
- Patent number 11,636,978
- Issue date Apr 25, 2023
- KYOCERA AVX Components Corporation
- Jeffrey Cain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded structures with integrated passive component
- Patent number 11,626,363
- Issue date Apr 11, 2023
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package containing device dies and interconnect die and redistribut...
- Patent number 11,532,585
- Issue date Dec 20, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kuo-Chiang Ting
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer-level passive array packaging
- Patent number 11,395,408
- Issue date Jul 19, 2022
- Apple Inc.
- Scott D. Morrison
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of forming the same
- Patent number 11,373,969
- Issue date Jun 28, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chi-Hsi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light-emitting diode chip, device, and lamp
- Patent number 11,309,297
- Issue date Apr 19, 2022
- Xiamen Sanan Optoelectronics Technology Co., Ltd.
- Xiaoqiang Zeng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages including routing dies and methods of formin...
- Patent number 11,177,201
- Issue date Nov 16, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jie Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mask assembly and method for fabricating a chip package
- Patent number 11,107,680
- Issue date Aug 31, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jie Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power integrated module
- Patent number 11,024,588
- Issue date Jun 1, 2021
- Delta Electronics (Shanghai) Co., Ltd.
- Jianhong Zeng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages
- Patent number 11,018,121
- Issue date May 25, 2021
- Samsung Electronics Co., Ltd.
- Sangnam Jeong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect chips
- Patent number 10,867,954
- Issue date Dec 15, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kuo-Chiang Ting
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages
- Patent number 10,797,030
- Issue date Oct 6, 2020
- Samsung Electronics Co., Ltd.
- Sangnam Jeong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of forming the same
- Patent number 10,741,512
- Issue date Aug 11, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chi-Hsi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect chips
- Patent number 10,720,401
- Issue date Jul 21, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kuo-Chiang Ting
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power integrated module
- Patent number 10,629,550
- Issue date Apr 21, 2020
- Delta Electronics (Shanghai) Co., Ltd.
- Jianhong Zeng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of forming the same
- Patent number 10,522,490
- Issue date Dec 31, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chi-Hsi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging process
- Patent number 10,424,573
- Issue date Sep 24, 2019
- DELTA ELECTRONICS INT'L (SINGAPORE) PTE LTD
- Beng Beng Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solenoid inductor
- Patent number 10,332,671
- Issue date Jun 25, 2019
- QUALCOMM Incorporated
- Mario Francisco Velez
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Integrated fan-out package and manufacturing method thereof
- Patent number 10,283,377
- Issue date May 7, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd
- Meng-Tse Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method of fabricating the same
- Patent number 10,276,525
- Issue date Apr 30, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd
- Ching-Wen Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip chip assembly with connected component
- Patent number 10,211,174
- Issue date Feb 19, 2019
- International Business Machines Corporation
- Jean Audet
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure
- Patent number 10,090,375
- Issue date Oct 2, 2018
- Mediatek Inc.
- Tzu-Hung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of forming the same
- Patent number 10,026,704
- Issue date Jul 17, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chi-Hsi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip chip assembly with connected component
- Patent number 9,984,988
- Issue date May 29, 2018
- International Business Machines Corporation
- Jean Audet
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of forming the same
- Patent number 9,768,133
- Issue date Sep 19, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chi-Hsi Wu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
RF ANTENNA MODULE USING COPPER-TO-COPPER INTERCONNECTS BETWEEN THE...
- Publication number 20240363567
- Publication date Oct 31, 2024
- Intel Corporation
- Bernd WAIDHAS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE
- Publication number 20240304584
- Publication date Sep 12, 2024
- Advanced Semiconductor Engineering, Inc.
- Hai-Ming CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENCAPSULATED PACKAGE INCLUDING DEVICE DIES CONNECTED VIA INTERCONNE...
- Publication number 20240258261
- Publication date Aug 1, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Kuo-Chiang Ting
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20240203962
- Publication date Jun 20, 2024
- Commissariat A L'Energie Atomique et Aux Energies Alternatives
- Cyrille Laviron
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240194626
- Publication date Jun 13, 2024
- Samsung Electronics Co., Ltd.
- SOOJEOUNG PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integration of Discrete Embeddable Capacitors on Integrated Circuit...
- Publication number 20240145447
- Publication date May 2, 2024
- pSemi Corporation
- Shishir Ray
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGES AND METHODS OF FORMATION
- Publication number 20240107780
- Publication date Mar 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Wei WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Structure and Method of Fabrication for High Performance Integrated...
- Publication number 20240088032
- Publication date Mar 14, 2024
- Apple Inc.
- Vidhya Ramachandran
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE
- Publication number 20230326861
- Publication date Oct 12, 2023
- Advanced Semiconductor Engineering, Inc.
- Hung-Yi LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT PACKAGE WITH INTEGRATED COMPONENT AND REDISTRI...
- Publication number 20230275044
- Publication date Aug 31, 2023
- SMOLTEK AB
- Karl Lundahl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES
- Publication number 20230260977
- Publication date Aug 17, 2023
- MEDIATEK INC.
- Hsiao-Yun CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FAN-OUT SEMICONDUCTOR PACKAGE
- Publication number 20230187424
- Publication date Jun 15, 2023
- Samsung Electronics Co., Ltd.
- Joonsung Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL SEMICONDUCTOR PACKAGE HAVING A STACKED PASSIVE DE...
- Publication number 20230130354
- Publication date Apr 27, 2023
- ADVANCED MICRO DEVICES, INC.
- RAHUL AGARWAL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wafer-Level Passive Array Packaging
- Publication number 20220071013
- Publication date Mar 3, 2022
- Apple Inc.
- Scott D. Morrison
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATING A CHIP PACKAGE
- Publication number 20210391168
- Publication date Dec 16, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jie Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20210257324
- Publication date Aug 19, 2021
- Samsung Electronics Co., Ltd.
- SOOJEOUNG PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER INTEGRATED MODULE
- Publication number 20200303326
- Publication date Sep 24, 2020
- DELTA ELECTRONICS (SHANGHAI) CO., LTD.
- Jianhong ZENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package and Method of Forming the Same
- Publication number 20200083187
- Publication date Mar 12, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chi-Hsi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Interconnect Chips
- Publication number 20200027851
- Publication date Jan 23, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuo-Chiang Ting
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING PROCESS
- Publication number 20190304961
- Publication date Oct 3, 2019
- Delta Electronics Int'l (Singapore) Pte Ltd
- Beng Beng Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES
- Publication number 20190295999
- Publication date Sep 26, 2019
- Samsung Electronics Co., Ltd.
- Sangnam JEONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED FAN-OUT PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20190139787
- Publication date May 9, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Meng-Tse Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MASK ASSEMBLY AND METHOD FOR FABRICATING A CHIP PACKAGE
- Publication number 20190067001
- Publication date Feb 28, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jie Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES
- Publication number 20180366456
- Publication date Dec 20, 2018
- Samsung Electronics Co., Ltd.
- Sangnam JEONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package and Method of Forming the Same
- Publication number 20180342474
- Publication date Nov 29, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chi-Hsi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDED STRUCTURES WITH INTEGRATED PASSIVE COMPONENT
- Publication number 20180190580
- Publication date Jul 5, 2018
- INVENSAS BONDING TECHNOLOGIES, INC.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD OF FABRICATING THE SAME
- Publication number 20180151524
- Publication date May 31, 2018
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ching-Wen Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package and Method of Forming the Same
- Publication number 20180082964
- Publication date Mar 22, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chi-Hsi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE
- Publication number 20170179055
- Publication date Jun 22, 2017
- MEDIATEK INC.
- Tzu-Hung LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLIP CHIP ASSEMBLY WITH CONNECTED COMPONENT
- Publication number 20170170133
- Publication date Jun 15, 2017
- International Business Machines Corporation
- JEAN AUDET
- H01 - BASIC ELECTRIC ELEMENTS

the item being a discrete passive component

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Multilayer capacitor and circuit board containing the same

Bonded structures with integrated passive component

Encapsulated package including device dies connected via interconne...

Method for fabricating a chip package

Multilayer capacitor and circuit board containing the same

Bonded structures with integrated passive component

Package containing device dies and interconnect die and redistribut...

Wafer-level passive array packaging

Semiconductor package and method of forming the same

Light-emitting diode chip, device, and lamp

Semiconductor packages including routing dies and methods of formin...

Mask assembly and method for fabricating a chip package

Power integrated module

Semiconductor packages

Interconnect chips

Semiconductor packages

Semiconductor package and method of forming the same

Interconnect chips

Power integrated module

Semiconductor package and method of forming the same

Packaging process

Solenoid inductor

Integrated fan-out package and manufacturing method thereof

Package structure and method of fabricating the same

Flip chip assembly with connected component

Semiconductor structure

Semiconductor package and method of forming the same

Flip chip assembly with connected component

Semiconductor package and method of forming the same

Patents Applicationslast 30 patents

RF ANTENNA MODULE USING COPPER-TO-COPPER INTERCONNECTS BETWEEN THE...

PACKAGE STRUCTURE

ENCAPSULATED PACKAGE INCLUDING DEVICE DIES CONNECTED VIA INTERCONNE...

ELECTRONIC DEVICE

SEMICONDUCTOR PACKAGE

Integration of Discrete Embeddable Capacitors on Integrated Circuit...

SEMICONDUCTOR DEVICE PACKAGES AND METHODS OF FORMATION

Structure and Method of Fabrication for High Performance Integrated...

ELECTRONIC PACKAGE

ELECTRONIC COMPONENT PACKAGE WITH INTEGRATED COMPONENT AND REDISTRI...

SEMICONDUCTOR PACKAGES

FAN-OUT SEMICONDUCTOR PACKAGE

THREE-DIMENSIONAL SEMICONDUCTOR PACKAGE HAVING A STACKED PASSIVE DE...

Wafer-Level Passive Array Packaging

METHOD FOR FABRICATING A CHIP PACKAGE

SEMICONDUCTOR PACKAGE

POWER INTEGRATED MODULE

Semiconductor Package and Method of Forming the Same

Interconnect Chips

PACKAGING PROCESS

SEMICONDUCTOR PACKAGES

INTEGRATED FAN-OUT PACKAGE AND MANUFACTURING METHOD THEREOF

MASK ASSEMBLY AND METHOD FOR FABRICATING A CHIP PACKAGE

SEMICONDUCTOR PACKAGES

Semiconductor Package and Method of Forming the Same

BONDED STRUCTURES WITH INTEGRATED PASSIVE COMPONENT

PACKAGE STRUCTURE AND METHOD OF FABRICATING THE SAME

Semiconductor Package and Method of Forming the Same

SEMICONDUCTOR STRUCTURE

FLIP CHIP ASSEMBLY WITH CONNECTED COMPONENT