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the item being metallic

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  • CPC
  • H01L2224/16175
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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/16175the item being metallic
Industries

Patents Grantslast 30 patents

  • Information Patent Grant

    Printed repassivation for wafer chip scale packaging
    • Patent number 10,541,220
    • Issue date Jan 21, 2020
    • Texas Instruments Incorporated
    • Daiki Komatsu
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Wiring substrate
    • Patent number 9,818,681
    • Issue date Nov 14, 2017
    • Shinko Electric Industries Co., Ltd.
    • Yoshihiro Machida
    • H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

  • Information Patent Application

    CHIP PROTECTION DEVICE
    • Publication number 20240096748
    • Publication date Mar 21, 2024
    • Samsung Electronics Co., Ltd.
    • Taejun JEON
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    PRINTED REPASSIVATION FOR WAFER CHIP SCALE PACKAGING
    • Publication number 20200043878
    • Publication date Feb 6, 2020
    • TEXAS INSTRUMENTS INCORPORATED
    • Daiki Komatsu
    • H01 - BASIC ELECTRIC ELEMENTS