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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/16155the item being non-metallic

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Electrical bridge package with integrated off-bridge photonic chann...
- Patent number 12,191,257
- Issue date Jan 7, 2025
- Celestial AI Inc.
- Ankur Aggarwal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having package on package structure and method...
- Patent number 11,804,477
- Issue date Oct 31, 2023
- Samsung Electronics Co., Ltd.
- Jeonghyun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnection structure of a semiconductor chip and semiconductor...
- Patent number 11,626,370
- Issue date Apr 11, 2023
- Samsung Electronics Co., Ltd.
- Keumhee Ma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having molded die and semiconductor die and m...
- Patent number 11,538,761
- Issue date Dec 27, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hao-Cheng Hou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through-substrate waveguide
- Patent number 11,532,574
- Issue date Dec 20, 2022
- Intel Coropration
- Aleksandar Aleksov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including a wire and a method of fabricating...
- Patent number 11,502,028
- Issue date Nov 15, 2022
- SK hynix Inc.
- Chae Sung Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat dissipation device having a thermally conductive structure and...
- Patent number 11,302,599
- Issue date Apr 12, 2022
- Intel Corporation
- Feras Eid
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having electromagnetic wave absorbing layer wi...
- Patent number 11,121,095
- Issue date Sep 14, 2021
- Mitsubishi Electric Corporation
- Tomohiro Tanishita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package device and method of manufacturing the same
- Patent number 10,756,025
- Issue date Aug 25, 2020
- Advanced Semiconductor Engineering, Inc.
- Wei-Hsuan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device and method of manufacturing the same
- Patent number 10,663,816
- Issue date May 26, 2020
- LG Display Co., Ltd.
- WonJun Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device and method of manufacturing the same
- Patent number 10,310,341
- Issue date Jun 4, 2019
- LG Display Co., Ltd.
- WonJun Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display apparatus and method of manufacturing the same
- Patent number 10,254,603
- Issue date Apr 9, 2019
- Samsung Display Co., Ltd.
- Minseok Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package device and method of manufacturing the same
- Patent number 10,068,854
- Issue date Sep 4, 2018
- Advanced Semiconductor Engineering, Inc.
- Wei-Hsuan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D field programmable gate array system with reset management and m...
- Patent number 9,843,328
- Issue date Dec 12, 2017
- Altera Corporation
- Ping Xiao
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Electronic device with solder pads including projections
- Patent number 9,583,470
- Issue date Feb 28, 2017
- Intel Corporation
- Omkar Karhade
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D package with through substrate vias
- Patent number 9,530,759
- Issue date Dec 27, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of testing through silicon VIAS (TSVs) of three dimensional...
- Patent number 8,956,889
- Issue date Feb 17, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hung-Chih Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Test structures for through silicon vias (TSVs) of three dimensiona...
- Patent number 8,421,073
- Issue date Apr 16, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hung-Chih Lin
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ORTHOGONAL BRIDGE PACKAGING TECHNOLOGY
- Publication number 20250006699
- Publication date Jan 2, 2025
- International Business Machines Corporation
- John Knickerbocker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE COMPRISING AN OPTICAL INTEGRATED DEVICE
- Publication number 20240319455
- Publication date Sep 26, 2024
- QUALCOMM Incorporated
- Xia LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER AMPLIFICATION HIGH-FREQUENCY CIRCUIT DEVICE
- Publication number 20240213189
- Publication date Jun 27, 2024
- Mitsubishi Electric Corporation
- Yuta SUGIYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICAL BRIDGE PACKAGE WITH INTEGRATED OFF-BRIDGE PHOTONIC CHANN...
- Publication number 20240145393
- Publication date May 2, 2024
- Ankur AGGARWAL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND A METHOD FOR MAKING THE SAME
- Publication number 20240120289
- Publication date Apr 11, 2024
- JCET STATS ChipPAC Korea Limited
- SeungHyun LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240088271
- Publication date Mar 14, 2024
- Murata Manufacturing Co., Ltd.
- Atsushi KUROKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RADIO-FREQUENCY MODULE
- Publication number 20240030166
- Publication date Jan 25, 2024
- Murata Manufacturing Co., Ltd.
- Hiromichi KITAJIMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH-FREQUENCY MODULE
- Publication number 20240030165
- Publication date Jan 25, 2024
- Murata Manufacturing Co., Ltd.
- Kiyoshi AIKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING PACKAGE ON PACKAGE STRUCTURE AND METHOD...
- Publication number 20240014191
- Publication date Jan 11, 2024
- Samsung Electronics Co., Ltd.
- Jeonghyun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECTION STRUCTURE OF A SEMICONDUCTOR CHIP AND METHOD OF MAN...
- Publication number 20230253336
- Publication date Aug 10, 2023
- Keumhee Ma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP MODULE WITH HEAT DISSIPATION DEVICE AND MANUFACTURING METHOD T...
- Publication number 20220336314
- Publication date Oct 20, 2022
- SMArim Global Corp.
- TIEN-LAI WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20220216153
- Publication date Jul 7, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hao-Cheng Hou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING PACKAGE ON PACKAGE STRUCTURE AND METHOD...
- Publication number 20220181309
- Publication date Jun 9, 2022
- Samsung Electronics Co., Ltd.
- Jeonghyun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING A WIRE AND A METHOD OF FABRICATING...
- Publication number 20220108942
- Publication date Apr 7, 2022
- SK HYNIX INC.
- Chae Sung LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECTION STRUCTURE OF A SEMICONDUCTOR CHIP AND SEMICONDUCTOR...
- Publication number 20220093521
- Publication date Mar 24, 2022
- Samsung Electronics Co., Ltd.
- Keumhee Ma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20210111130
- Publication date Apr 15, 2021
- MITSUBISHI ELECTRIC CORPORATION
- Tomohiro TANISHITA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH-SUBSTRATE WAVEGUIDE
- Publication number 20200294939
- Publication date Sep 17, 2020
- Intel Corporation
- Aleksandar Aleksov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT DISSIPATION DEVICE HAVING A THERMALLY CONDUCTIVE STRUCTURE AND...
- Publication number 20190326192
- Publication date Oct 24, 2019
- Intel Corporation
- Feras Eid
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY APPARATUS AND METHOD OF MANUFACTURING THE SAME
- Publication number 20190204653
- Publication date Jul 4, 2019
- SAMSUNG DISPLAY CO., LTD.
- Minseok KIM
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
SEMICONDUCTOR PACKAGE DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20180350753
- Publication date Dec 6, 2018
- Advanced Semiconductor Engineering, Inc.
- Wei-Hsuan LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY APPARATUS AND METHOD OF MANUFACTURING THE SAME
- Publication number 20180173042
- Publication date Jun 21, 2018
- SAMSUNG DISPLAY CO., LTD.
- Minseok KIM
- G02 - OPTICS
Information Patent Application
SEMICONDUCTOR PACKAGE DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20180114757
- Publication date Apr 26, 2018
- Advanced Semiconductor Engineering, Inc.
- Wei-Hsuan LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Display Device and Method of Manufacturing the Same
- Publication number 20160377905
- Publication date Dec 29, 2016
- LG Display Co., Ltd.
- WonJun CHOI
- G02 - OPTICS
Information Patent Application
3D Package With Through Substrate Vias
- Publication number 20160218090
- Publication date Jul 28, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDER PAD DEVICE AND METHOD
- Publication number 20150179622
- Publication date Jun 25, 2015
- Omkar Karhade
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF TESTING THROUGH SILICON VIAS (TSVS) OF THREE DIMENSIONAL...
- Publication number 20130196458
- Publication date Aug 1, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- HUNG-CHIH LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TEST STRUCTURES FOR THROUGH SILICON VIAS (TSVs) OF THREE DIMENSIONA...
- Publication number 20120097944
- Publication date Apr 26, 2012
- Taiwan Semiconductor Manufacturing Company, Ltd.
- HUNG-CHIH LIN
- H01 - BASIC ELECTRIC ELEMENTS

the item being non-metallic

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Electrical bridge package with integrated off-bridge photonic chann...

Semiconductor device having package on package structure and method...

Interconnection structure of a semiconductor chip and semiconductor...

Semiconductor package having molded die and semiconductor die and m...

Through-substrate waveguide

Semiconductor package including a wire and a method of fabricating...

Heat dissipation device having a thermally conductive structure and...

Semiconductor device having electromagnetic wave absorbing layer wi...

Semiconductor package device and method of manufacturing the same

Display device and method of manufacturing the same

Display device and method of manufacturing the same

Display apparatus and method of manufacturing the same

Semiconductor package device and method of manufacturing the same

3D field programmable gate array system with reset management and m...

Electronic device with solder pads including projections

3D package with through substrate vias

Method of testing through silicon VIAS (TSVs) of three dimensional...

Test structures for through silicon vias (TSVs) of three dimensiona...

Patents Applicationslast 30 patents

ORTHOGONAL BRIDGE PACKAGING TECHNOLOGY

PACKAGE COMPRISING AN OPTICAL INTEGRATED DEVICE

POWER AMPLIFICATION HIGH-FREQUENCY CIRCUIT DEVICE

ELECTRICAL BRIDGE PACKAGE WITH INTEGRATED OFF-BRIDGE PHOTONIC CHANN...

ELECTRONIC PACKAGE AND A METHOD FOR MAKING THE SAME

SEMICONDUCTOR DEVICE

RADIO-FREQUENCY MODULE

HIGH-FREQUENCY MODULE

SEMICONDUCTOR DEVICE HAVING PACKAGE ON PACKAGE STRUCTURE AND METHOD...

INTERCONNECTION STRUCTURE OF A SEMICONDUCTOR CHIP AND METHOD OF MAN...

CHIP MODULE WITH HEAT DISSIPATION DEVICE AND MANUFACTURING METHOD T...

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE HAVING PACKAGE ON PACKAGE STRUCTURE AND METHOD...

SEMICONDUCTOR PACKAGE INCLUDING A WIRE AND A METHOD OF FABRICATING...

INTERCONNECTION STRUCTURE OF A SEMICONDUCTOR CHIP AND SEMICONDUCTOR...

SEMICONDUCTOR DEVICE

THROUGH-SUBSTRATE WAVEGUIDE

HEAT DISSIPATION DEVICE HAVING A THERMALLY CONDUCTIVE STRUCTURE AND...

DISPLAY APPARATUS AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE DEVICE AND METHOD OF MANUFACTURING THE SAME

DISPLAY APPARATUS AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE DEVICE AND METHOD OF MANUFACTURING THE SAME

Display Device and Method of Manufacturing the Same

3D Package With Through Substrate Vias

SOLDER PAD DEVICE AND METHOD

METHOD OF TESTING THROUGH SILICON VIAS (TSVS) OF THREE DIMENSIONAL...

TEST STRUCTURES FOR THROUGH SILICON VIAS (TSVs) OF THREE DIMENSIONA...