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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/24225the item being non-metallic

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Passivation structure with planar top surfaces
- Patent number 12,218,022
- Issue date Feb 4, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yi-Hsiu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing conductive tracks, and electronic module
- Patent number 12,183,710
- Issue date Dec 31, 2024
- Siemens Aktiengesellschaft
- Alexander Hensel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming stacked integrated circuits using selective ther...
- Patent number 12,027,488
- Issue date Jul 2, 2024
- The Regents of the University of California
- Mike Breeden
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package and method
- Patent number 11,961,814
- Issue date Apr 16, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chien-Hsun Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure including through via structures
- Patent number 11,923,310
- Issue date Mar 5, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Kai Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure
- Patent number 11,874,513
- Issue date Jan 16, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chia-Lun Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method of forming the same
- Patent number 11,855,057
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chi-Yang Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, semiconductor device package and method of ma...
- Patent number 11,830,834
- Issue date Nov 28, 2023
- Advanced Semiconductor Engineering, Inc.
- Hsing Kuo Tien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and manufacturing method thereof
- Patent number 11,823,980
- Issue date Nov 21, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Tzuan-Horng Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Passivation structure with planar top surfaces
- Patent number 11,817,361
- Issue date Nov 14, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yi-Hsiu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low profile interconnect for light emitter
- Patent number 11,811,011
- Issue date Nov 7, 2023
- Magic Leap, Inc.
- Kevin Curtis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and semiconductor device including the same
- Patent number 11,764,182
- Issue date Sep 19, 2023
- Samsung Electronics Co., Ltd.
- Jun So Pak
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and method of manufacturing the same
- Patent number 11,676,942
- Issue date Jun 13, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure with interconnection die and method of making same
- Patent number 11,664,315
- Issue date May 30, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hao-Yi Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Channel routing for memory devices
- Patent number 11,658,156
- Issue date May 23, 2023
- Micron Technology, Inc.
- Brent Keeth
- G11 - INFORMATION STORAGE
Information Patent Grant
Fan out structure for light-emitting diode (LED) device and lightin...
- Patent number 11,631,594
- Issue date Apr 18, 2023
- Lumileds LLC
- Tze Yang Hin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan out structure for light-emitting diode (LED) device and lightin...
- Patent number 11,621,173
- Issue date Apr 4, 2023
- Lumileds LLC
- Tze Yang Hin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure
- Patent number 11,585,992
- Issue date Feb 21, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chia-Lun Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method of forming the same
- Patent number 11,532,596
- Issue date Dec 20, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Tsung-Yuan Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 11,527,509
- Issue date Dec 13, 2022
- Samsung Electronics Co., Ltd.
- Sanghoon Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level package structure with internal conductive layer
- Patent number 11,424,209
- Issue date Aug 23, 2022
- Intel Corporation
- Sven Albers
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip packing structure employing millimeter wave
- Patent number 11,362,050
- Issue date Jun 14, 2022
- Keycore Technology Corp.
- Wei-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package
- Patent number 11,309,295
- Issue date Apr 19, 2022
- Advanced Semiconductor Engineering, Inc.
- Wen Hung Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low profile interconnect for light emitter
- Patent number 11,264,548
- Issue date Mar 1, 2022
- Magic Leap, Inc.
- Kevin Curtis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package and method
- Patent number 11,239,193
- Issue date Feb 1, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chien-Hsun Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package and method
- Patent number 11,211,371
- Issue date Dec 28, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Antenna module and electronic system including the same
- Patent number 11,165,143
- Issue date Nov 2, 2021
- Samsung Electronics Co., Ltd.
- Junghwa Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package and method
- Patent number 11,121,089
- Issue date Sep 14, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jen-Jui Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure having line connected via portions
- Patent number 11,088,079
- Issue date Aug 10, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chih-Kai Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure
- Patent number 11,002,927
- Issue date May 11, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chia-Lun Chang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
MANUFACTURING METHOD OF ELECTRONIC PACKAGE AND ELECTRONIC PACKAGE
- Publication number 20240421096
- Publication date Dec 19, 2024
- VIA TECHNOLOGIES, INC.
- Wen-Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING STACKED INTEGRATED CIRCUITS USING SELECTIVE THER...
- Publication number 20240347502
- Publication date Oct 17, 2024
- The Regents of the University of California
- Mike Breeden
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGES
- Publication number 20240222307
- Publication date Jul 4, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chien-Hsun Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE HAVING LINE CONNECTED VIA PORTIONS
- Publication number 20240213167
- Publication date Jun 27, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Kai CHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240170464
- Publication date May 23, 2024
- Samsung Electronics Co., Ltd.
- Chajea JO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CARRIER STRUCTURE
- Publication number 20240088054
- Publication date Mar 14, 2024
- Siliconware Precision Industries Co., Ltd.
- Shu-Ting LAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD
- Publication number 20240071947
- Publication date Feb 29, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yu-Ling Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE WITH INTEGRATED EMBEDDED OFF-DIE INDUCTORS
- Publication number 20240071958
- Publication date Feb 29, 2024
- Xilinx, Inc.
- Hong SHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE, METHOD, AND SYSTEM TO PROTECT THROUGH-DIELECTRIC VIAS OF A...
- Publication number 20240063147
- Publication date Feb 22, 2024
- Intel Corporation
- Adel Elsherbini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20230402358
- Publication date Dec 14, 2023
- Samsung Electronics Co., Ltd.
- CHOONGBIN YIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20230369172
- Publication date Nov 16, 2023
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Tzuan-Horng Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Passivation Structure with Planar Top Surfaces
- Publication number 20230360992
- Publication date Nov 9, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yi-Hsiu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE USING SEMICONDUCTOR LIGHT-EMITTING ELEMENT, AND METH...
- Publication number 20230317669
- Publication date Oct 5, 2023
- LG ELECTRONICS INC.
- Jinhyung LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20230307417
- Publication date Sep 28, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD OF MAKING SAME
- Publication number 20230260915
- Publication date Aug 17, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hao-Yi Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH INTEGRATED DEEP TRENCH CAPACITORS
- Publication number 20230260894
- Publication date Aug 17, 2023
- MEDIATEK INC.
- Chu-Wei Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND FORMING METHOD THEREOF
- Publication number 20230260945
- Publication date Aug 17, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jiun-Yi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE
- Publication number 20230168451
- Publication date Jun 1, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Lun Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20230031430
- Publication date Feb 2, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tzuan-Horng Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MA...
- Publication number 20230009219
- Publication date Jan 12, 2023
- Advanced Semiconductor Engineering, Inc.
- Hsing Kuo TIEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME
- Publication number 20230009553
- Publication date Jan 12, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chi-Yang Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Circuits Including Micropatterns and Using Partial Curing to Adhere...
- Publication number 20220352108
- Publication date Nov 3, 2022
- 3M Innovative Properties Company
- Teresa M. Goeddel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE WITH INTERCONNECTION DIE AND METHOD OF MAKING SAME
- Publication number 20220293524
- Publication date Sep 15, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hao-Yi Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20220293560
- Publication date Sep 15, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME
- Publication number 20220285317
- Publication date Sep 8, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tsung-Yuan Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Passivation Structure with Planar Top Surfaces
- Publication number 20220262698
- Publication date Aug 18, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yi-Hsiu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP STRUCTURE, PACKAGING STRUCTURE AND MANUFACTURING METHOD OF CHI...
- Publication number 20220223560
- Publication date Jul 14, 2022
- CHANGXIN MEMORY TECHNOLOGIES, INC
- Zengyan FAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Circuit Package and Method
- Publication number 20220157760
- Publication date May 19, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chien-Hsun Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20220139874
- Publication date May 5, 2022
- Samsung Electronics Co., Ltd.
- Sanghoon LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR DEVICE INCLUDING THE SAME
- Publication number 20220068870
- Publication date Mar 3, 2022
- Samsung Electronics Co., Ltd.
- Jun So PAK
- H01 - BASIC ELECTRIC ELEMENTS

the item being non-metallic

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Passivation structure with planar top surfaces

Method for producing conductive tracks, and electronic module

Methods of forming stacked integrated circuits using selective ther...

Integrated circuit package and method

Package structure including through via structures

Package structure

Package structure and method of forming the same

Semiconductor device, semiconductor device package and method of ma...

Package structure and manufacturing method thereof

Passivation structure with planar top surfaces

Low profile interconnect for light emitter

Semiconductor package and semiconductor device including the same

Semiconductor structure and method of manufacturing the same

Structure with interconnection die and method of making same

Channel routing for memory devices

Fan out structure for light-emitting diode (LED) device and lightin...

Fan out structure for light-emitting diode (LED) device and lightin...

Package structure

Package structure and method of forming the same

Semiconductor package

Wafer level package structure with internal conductive layer

Multi-chip packing structure employing millimeter wave

Semiconductor device package

Low profile interconnect for light emitter

Integrated circuit package and method

Integrated circuit package and method

Antenna module and electronic system including the same

Integrated circuit package and method

Package structure having line connected via portions

Package structure

Patents Applicationslast 30 patents

MANUFACTURING METHOD OF ELECTRONIC PACKAGE AND ELECTRONIC PACKAGE

METHODS OF FORMING STACKED INTEGRATED CIRCUITS USING SELECTIVE THER...

INTEGRATED CIRCUIT PACKAGES

PACKAGE STRUCTURE HAVING LINE CONNECTED VIA PORTIONS

SEMICONDUCTOR PACKAGE

CARRIER STRUCTURE

SEMICONDUCTOR PACKAGE AND METHOD

CHIP PACKAGE WITH INTEGRATED EMBEDDED OFF-DIE INDUCTORS

DEVICE, METHOD, AND SYSTEM TO PROTECT THROUGH-DIELECTRIC VIAS OF A...

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

Passivation Structure with Planar Top Surfaces

DISPLAY DEVICE USING SEMICONDUCTOR LIGHT-EMITTING ELEMENT, AND METH...

PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR STRUCTURE AND METHOD OF MAKING SAME

SEMICONDUCTOR DEVICE WITH INTEGRATED DEEP TRENCH CAPACITORS

SEMICONDUCTOR STRUCTURE AND FORMING METHOD THEREOF

PACKAGE STRUCTURE

PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE, SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MA...

PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME

Circuits Including Micropatterns and Using Partial Curing to Adhere...

STRUCTURE WITH INTERCONNECTION DIE AND METHOD OF MAKING SAME

SEMICONDUCTOR STRUCTURE AND METHOD OF MANUFACTURING THE SAME

PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME

Passivation Structure with Planar Top Surfaces

CHIP STRUCTURE, PACKAGING STRUCTURE AND MANUFACTURING METHOD OF CHI...

Integrated Circuit Package and Method

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR DEVICE INCLUDING THE SAME