the layer connector being at least partially embedded in the surface

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/29022the layer connector being at least partially embedded in the surface

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Devices and methods related to stack structures including passivati...
- Patent number 11,804,460
- Issue date Oct 31, 2023
- Skyworks Solutions, Inc.
- Jiro Yota
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die-substrate assemblies having sinter-bonded backside via structur...
- Patent number 11,749,639
- Issue date Sep 5, 2023
- NXP USA, INC.
- Lakshminarayan Viswanathan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with high heat dissipation efficiency
- Patent number 11,699,675
- Issue date Jul 11, 2023
- Harvatek Corporation
- Chin-Jui Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
OLED display panel and OLED device with wire overlying step in via-...
- Patent number 11,538,883
- Issue date Dec 27, 2022
- Chengdu BOE Optoelectronics Technology Co., Ltd.
- Young Yik Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light-emitting diode, method for manufacturing the same, backlight...
- Patent number 11,322,671
- Issue date May 3, 2022
- BOE OPTICAL SCIENCE AND TECHNOLOGY CO., LTD.
- Tao Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stack structures in electronic devices including passivation layers...
- Patent number 11,257,774
- Issue date Feb 22, 2022
- Skyworks Solutions, Inc.
- Jiro Yota
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for processing high electron mobility transistor (HEMT)
- Patent number 10,861,947
- Issue date Dec 8, 2020
- RFHIC CORPORATION
- Won Sang Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High reliability wafer level semiconductor packaging
- Patent number 10,790,208
- Issue date Sep 29, 2020
- Semiconductor Components Industries, LLC
- Yu-Te Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High electron mobility transistor (HEMT)
- Patent number 10,707,311
- Issue date Jul 7, 2020
- RFHIC CORPORATION
- Won Sang Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and apparatus for thermal interface material (TIM) bond lin...
- Patent number 10,529,645
- Issue date Jan 7, 2020
- Xilinx, Inc.
- Jaspreet Singh Gandhi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High reliability wafer level semiconductor packaging
- Patent number 10,290,556
- Issue date May 14, 2019
- Semiconductor Components Industries, LLC
- Yu-Te Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High electron mobility transistor (HEMT)
- Patent number 10,217,827
- Issue date Feb 26, 2019
- RFHIC CORPORATION
- Won Sang Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High reliability wafer level semiconductor packaging
- Patent number 9,859,180
- Issue date Jan 2, 2018
- Semiconductor Components Industries, LLC
- Yu-Te Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of manufacturing a semiconductor device
- Patent number 9,653,623
- Issue date May 16, 2017
- Samsung Electronics Co., Ltd.
- Yi-Koan Hong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 9,355,937
- Issue date May 31, 2016
- Mitsubishi Electric Corporation
- Hidetoshi Koyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding pad for thermocompression bonding, process for producing a...
- Patent number 9,281,280
- Issue date Mar 8, 2016
- Robert Bosch GmbH
- Christoph Schelling
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Embedded electrical component surface interconnect
- Patent number 9,245,819
- Issue date Jan 26, 2016
- FREESCALE SEMICONDUCTOR, INC.
- Michael B. Vincent
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Power module
- Patent number 9,240,370
- Issue date Jan 19, 2016
- Industrial Technology Research Institute
- Shu-Jung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Preform including a groove extending to an edge of the preform
- Patent number 9,190,384
- Issue date Nov 17, 2015
- TriQuint Semiconductor, Inc.
- Shixi Louis Liu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Die including a groove extending from a via to an edge of the die
- Patent number 8,718,720
- Issue date May 6, 2014
- TriQuint Semiconductor, Inc.
- Shixi Louis Liu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device, method for manufacturing semiconductor device...
- Patent number 8,610,269
- Issue date Dec 17, 2013
- NEC Corporation
- Kenji Nanba
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE, METHOD OF FORMING SEMICONDUCTOR PACKAGE, AND...
- Publication number 20240363501
- Publication date Oct 31, 2024
- Shenzhen STS Microelectronics Co., Ltd.
- Qian LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20240222236
- Publication date Jul 4, 2024
- Fuji Electric Co., Ltd.
- Shinji TADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOCKET FOR TESTING SEMICONDUCTOR DEVICE
- Publication number 20240142493
- Publication date May 2, 2024
- Samsung Electronics Co., Ltd.
- Sanguk Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING STRUCTURE HAVING ORGANIC INTERPOSER LAYER AND METHOD FOR...
- Publication number 20240063029
- Publication date Feb 22, 2024
- SJ Semiconductor(Jiangyin) Corporation
- Chengchung LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240047398
- Publication date Feb 8, 2024
- Murata Manufacturing Co., Ltd.
- Atsushi KUROKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH HIGH HEAT DISSIPATION EFFICIENCY
- Publication number 20220359451
- Publication date Nov 10, 2022
- HARVATEK CORPORATION
- Chin-Jui LIANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICES AND METHODS RELATED TO STACK STRUCTURES INCLUDING PASSIVATI...
- Publication number 20220336396
- Publication date Oct 20, 2022
- Skyworks Solutions, Inc.
- Jiro YOTA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OLED DISPLAY PANEL AND MANUFACTURING METHOD THEREOF, OLED DISPLAY D...
- Publication number 20210376034
- Publication date Dec 2, 2021
- CHENGDU BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Young Yik KO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR PROCESSING HIGH ELECTRON MOBILITY TRANSISTOR (HEMT)
- Publication number 20200287004
- Publication date Sep 10, 2020
- RFHIC Corporation
- Won Sang Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH RELIABILITY WAFER LEVEL SEMICONDUCTOR PACKAGING
- Publication number 20190229025
- Publication date Jul 25, 2019
- Semiconductor Components Industries, LLC
- Yu-Te HSIEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUS FOR THERMAL INTERFACE MATERIAL (TIM) BOND LIN...
- Publication number 20180358280
- Publication date Dec 13, 2018
- Xilinx, Inc.
- Jaspreet Singh Gandhi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH RELIABILITY WAFER LEVEL SEMICONDUCTOR PACKAGING
- Publication number 20180082913
- Publication date Mar 22, 2018
- Semiconductor Components Industries, LLC
- Yu-Te HSIEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH RELIABILITY WAFER LEVEL SEMICONDUCTOR PACKAGING
- Publication number 20170236761
- Publication date Aug 17, 2017
- Semiconductor Components Industries, LLC
- Yu-Te HSIEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PREFORM INCLUDING A GROOVE EXTENDING TO AN EDGE OF THE PREFORM
- Publication number 20140206149
- Publication date Jul 24, 2014
- TriQuint Semiconductor, Inc.
- Shixi Louis Liu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
BONDING PAD FOR THERMOCOMPRESSION BONDING, PROCESS FOR PRODUCING A...
- Publication number 20140035168
- Publication date Feb 6, 2014
- ROBERT BOSCH GmbH
- Christoph Schelling
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Embedded Electrical Component Surface Interconnect
- Publication number 20130215583
- Publication date Aug 22, 2013
- FREESCALE SEMICONDUCTOR, INC.
- Michael B. Vincent
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE...
- Publication number 20120104602
- Publication date May 3, 2012
- Kenji Nanba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...
- Publication number 20110049707
- Publication date Mar 3, 2011
- Kabushiki Kaisha Toshiba
- Masaharu Seto
- H01 - BASIC ELECTRIC ELEMENTS

the layer connector being at least partially embedded in the surface

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Devices and methods related to stack structures including passivati...

Die-substrate assemblies having sinter-bonded backside via structur...

Semiconductor device with high heat dissipation efficiency

OLED display panel and OLED device with wire overlying step in via-...

Light-emitting diode, method for manufacturing the same, backlight...

Stack structures in electronic devices including passivation layers...

Methods for processing high electron mobility transistor (HEMT)

High reliability wafer level semiconductor packaging

High electron mobility transistor (HEMT)

Methods and apparatus for thermal interface material (TIM) bond lin...

High reliability wafer level semiconductor packaging

High electron mobility transistor (HEMT)

High reliability wafer level semiconductor packaging

Methods of manufacturing a semiconductor device

Semiconductor device

Bonding pad for thermocompression bonding, process for producing a...

Embedded electrical component surface interconnect

Power module

Preform including a groove extending to an edge of the preform

Die including a groove extending from a via to an edge of the die

Semiconductor device, method for manufacturing semiconductor device...

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE, METHOD OF FORMING SEMICONDUCTOR PACKAGE, AND...

ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF

SOCKET FOR TESTING SEMICONDUCTOR DEVICE

PACKAGING STRUCTURE HAVING ORGANIC INTERPOSER LAYER AND METHOD FOR...

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE WITH HIGH HEAT DISSIPATION EFFICIENCY

DEVICES AND METHODS RELATED TO STACK STRUCTURES INCLUDING PASSIVATI...

OLED DISPLAY PANEL AND MANUFACTURING METHOD THEREOF, OLED DISPLAY D...

METHODS FOR PROCESSING HIGH ELECTRON MOBILITY TRANSISTOR (HEMT)

HIGH RELIABILITY WAFER LEVEL SEMICONDUCTOR PACKAGING

METHODS AND APPARATUS FOR THERMAL INTERFACE MATERIAL (TIM) BOND LIN...

HIGH RELIABILITY WAFER LEVEL SEMICONDUCTOR PACKAGING

HIGH RELIABILITY WAFER LEVEL SEMICONDUCTOR PACKAGING

PREFORM INCLUDING A GROOVE EXTENDING TO AN EDGE OF THE PREFORM

BONDING PAD FOR THERMOCOMPRESSION BONDING, PROCESS FOR PRODUCING A...

Embedded Electrical Component Surface Interconnect

SEMICONDUCTOR DEVICE, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE...

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...