the layer connector being disposed in a recess of the surface

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/29021the layer connector being disposed in a recess of the surface

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Patents Grantslast 30 patents

Information Patent Grant
Display apparatus including a low brightness area
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Information Patent Grant
Display device using semiconductor light-emitting elements and manu...
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Information Patent Grant
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Information Patent Grant
Display device
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Information Patent Grant
Power semiconductor device and substrate with dimple region
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- Kohei Yabuta
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Information Patent Grant
Method for manufacturing display panel, display panel, and display...
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- Canyuan Zhang
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Information Patent Grant
Method for processing a semiconductor wafer, semiconductor wafer, c...
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- Issue date Sep 12, 2023
- Infineon Technologies Austria AG
- Carsten von Koblinski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor device and manufacturing method for power semic...
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- Kohei Yabuta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High reliability wafer level semiconductor packaging
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- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High reliability wafer level semiconductor packaging
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Information Patent Grant
High reliability wafer level semiconductor packaging
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- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for processing a wafer and wafer structure
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Information Patent Grant
Semiconductor chips having improved solidity, semiconductor package...
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Information Patent Grant
Semiconductor packages and methods of formation thereof
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Information Patent Grant
Diamond composite heat spreader and associated methods
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Information Patent Grant
Diamond composite heat spreader and associated methods
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Information Patent Grant
Carbonaceous composite heat spreader and associated methods
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- Issue date Jan 10, 2006
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- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...

Patents Applicationslast 30 patents

Information Patent Application
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PACKAGE CARRIER PLATE WITH EMBEDDED EFFICIENT HEAT DISSIPATION MODU...
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LIQUID METAL WELLS FOR INTERCONNECT ARCHITECTURES
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PRE-MOLD SUBSTRATE AND METHOD FOR MANUFACTURING THE PRE-MOLD SUBSTRATE
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PACKAGE STRUCTURE AND METHOD FOR FABRICATING THE SAME
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SEMICONDUCTOR WAFER, CLIP AND SEMICONDUCTOR DEVICE
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METHOD FOR MANUFACTURING DISPLAY PANEL, DISPLAY PANEL, AND DISPLAY...
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Information Patent Application
DISPLAY MODULE AND DISPLAY APPARATUS HAVING THE SAME
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LIGHTING ELEMENT ALIGNMENT
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DISPLAY DEVICE AND TILED DISPLAY DEVICE
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DISPLAY APPARATUS INCLUDING A LOW BRIGHTNESS AREA
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- Publication number 20230117132
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DISPLAY DEVICE AND METHOD OF PROVIDING THE SAME
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Method and Structure for Supporting Thin Semiconductor Chips with a...
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- INFINEON TECHNOLOGIES AG
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POWER SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD FOR POWER SEMIC...
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HIGH RELIABILITY WAFER LEVEL SEMICONDUCTOR PACKAGING
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- Semiconductor Components Industries, LLC
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HIGH RELIABILITY WAFER LEVEL SEMICONDUCTOR PACKAGING
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HIGH RELIABILITY WAFER LEVEL SEMICONDUCTOR PACKAGING
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- H01 - BASIC ELECTRIC ELEMENTS
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SEMICONDUCTOR CHIPS HAVING IMPROVED SOLIDITY, SEMICONDUCTOR PACKAGE...
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Semiconductor Packages and Methods of Formation Thereof
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LASER HEATING APPARATUS FOR METAL EUTECTIC BONDING
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Information Patent Application
Diamond composite heat spreader and associated methods
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- Chien-Min Sung
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Silicon-diamond composite heat spreader and associated methods
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- Chien-Min Sung
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
Diamond composite heat spreader and associated methods
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- Chien-Min Sung
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...

the layer connector being disposed in a recess of the surface

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Display apparatus including a low brightness area

Display device using semiconductor light-emitting elements and manu...

Display device and method of providing the same

Display device

Power semiconductor device and substrate with dimple region

Method for manufacturing display panel, display panel, and display...

Method for processing a semiconductor wafer, semiconductor wafer, c...

Power semiconductor device and manufacturing method for power semic...

High reliability wafer level semiconductor packaging

High reliability wafer level semiconductor packaging

High reliability wafer level semiconductor packaging

Method for processing a wafer and wafer structure

Semiconductor chips having improved solidity, semiconductor package...

Semiconductor packages and methods of formation thereof

Diamond composite heat spreader and associated methods

Diamond composite heat spreader and associated methods

Carbonaceous composite heat spreader and associated methods

Patents Applicationslast 30 patents

INTEGRATED PACKAGE AND METHOD FOR MAKING THE SAME

PACKAGE CARRIER PLATE WITH EMBEDDED EFFICIENT HEAT DISSIPATION MODU...

LIGHT-EMITTING DEVICE, LIGHT-EMITTING MODULE AND PREPARATION METHOD...

SENSOR PACKAGING METHOD AND SENSOR PACKAGE

LIQUID METAL WELLS FOR INTERCONNECT ARCHITECTURES

PRE-MOLD SUBSTRATE AND METHOD FOR MANUFACTURING THE PRE-MOLD SUBSTRATE

PACKAGE STRUCTURE AND METHOD FOR FABRICATING THE SAME

SEMICONDUCTOR WAFER, CLIP AND SEMICONDUCTOR DEVICE

METHOD FOR MANUFACTURING DISPLAY PANEL, DISPLAY PANEL, AND DISPLAY...

DISPLAY MODULE AND DISPLAY APPARATUS HAVING THE SAME

LIGHTING ELEMENT ALIGNMENT

DISPLAY DEVICE AND TILED DISPLAY DEVICE

DISPLAY APPARATUS INCLUDING A LOW BRIGHTNESS AREA

METHOD FOR MANUFACTURING DISPLAY PANEL, DISPLAY PANEL, AND DISPLAY...

Display Device

DIE-SUBSTRATE ASSEMBLIES HAVING SINTER-BONDED BACKSIDE VIA STRUCTUR...

DISPLAY DEVICE AND METHOD OF PROVIDING THE SAME

POWER SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD FOR POWER SEMIC...

METHOD FOR PROCESSING A SEMICONDUCTOR WAFER, SEMICONDUCTOR WAFER, C...

Method and Structure for Supporting Thin Semiconductor Chips with a...

POWER SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD FOR POWER SEMIC...

HIGH RELIABILITY WAFER LEVEL SEMICONDUCTOR PACKAGING

HIGH RELIABILITY WAFER LEVEL SEMICONDUCTOR PACKAGING

HIGH RELIABILITY WAFER LEVEL SEMICONDUCTOR PACKAGING

SEMICONDUCTOR CHIPS HAVING IMPROVED SOLIDITY, SEMICONDUCTOR PACKAGE...

Semiconductor Packages and Methods of Formation Thereof

LASER HEATING APPARATUS FOR METAL EUTECTIC BONDING

Diamond composite heat spreader and associated methods

Silicon-diamond composite heat spreader and associated methods

Diamond composite heat spreader and associated methods