the layer connector being disposed in a recess of the surface

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CPC
H01L2224/29021

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/29021the layer connector being disposed in a recess of the surface

Industries

Patents Grantslast 30 patents

Information Patent Grant
Display device using semiconductor light-emitting elements and manu...
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Information Patent Grant
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Information Patent Grant
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- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Power semiconductor device and substrate with dimple region
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- Kohei Yabuta
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Information Patent Grant
Method for manufacturing display panel, display panel, and display...
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- Canyuan Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for processing a semiconductor wafer, semiconductor wafer, c...
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- Issue date Sep 12, 2023
- Infineon Technologies Austria AG
- Carsten von Koblinski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor device and manufacturing method for power semic...
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- Issue date May 24, 2022
- Mitsubishi Electric Corporation
- Kohei Yabuta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High reliability wafer level semiconductor packaging
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- Yu-Te Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High reliability wafer level semiconductor packaging
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- Yu-Te Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High reliability wafer level semiconductor packaging
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- Yu-Te Hsieh
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Information Patent Grant
Method for processing a wafer and wafer structure
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- Issue date Mar 7, 2017
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Information Patent Grant
Semiconductor chips having improved solidity, semiconductor package...
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Information Patent Grant
Semiconductor packages and methods of formation thereof
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- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Diamond composite heat spreader and associated methods
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- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Diamond composite heat spreader and associated methods
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- Issue date Feb 6, 2007
- Chien-Min Sung
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Carbonaceous composite heat spreader and associated methods
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- Issue date Jan 10, 2006
- Chien-Min Sung
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...

Patents Applicationslast 30 patents

Information Patent Application
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- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE CARRIER PLATE WITH EMBEDDED EFFICIENT HEAT DISSIPATION MODU...
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LIQUID METAL WELLS FOR INTERCONNECT ARCHITECTURES
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Information Patent Application
PRE-MOLD SUBSTRATE AND METHOD FOR MANUFACTURING THE PRE-MOLD SUBSTRATE
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- HAESUNG DS CO., LTD.
- Jong Hoe Ku
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD FOR FABRICATING THE SAME
- Publication number 20240055385
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- KUO-HUA HSIEH
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Information Patent Application
SEMICONDUCTOR WAFER, CLIP AND SEMICONDUCTOR DEVICE
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- Carsten von Koblinski
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Information Patent Application
METHOD FOR MANUFACTURING DISPLAY PANEL, DISPLAY PANEL, AND DISPLAY...
- Publication number 20230402442
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- Canyuan ZHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY MODULE AND DISPLAY APPARATUS HAVING THE SAME
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- Publication date Nov 30, 2023
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- Jaeseok Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHTING ELEMENT ALIGNMENT
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- Michael DECKERS
- H01 - BASIC ELECTRIC ELEMENTS
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DISPLAY DEVICE AND TILED DISPLAY DEVICE
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- H01 - BASIC ELECTRIC ELEMENTS
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DISPLAY APPARATUS INCLUDING A LOW BRIGHTNESS AREA
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- Junghoon YOON
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METHOD FOR MANUFACTURING DISPLAY PANEL, DISPLAY PANEL, AND DISPLAY...
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Information Patent Application
DISPLAY DEVICE AND METHOD OF PROVIDING THE SAME
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POWER SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD FOR POWER SEMIC...
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Method and Structure for Supporting Thin Semiconductor Chips with a...
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POWER SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD FOR POWER SEMIC...
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HIGH RELIABILITY WAFER LEVEL SEMICONDUCTOR PACKAGING
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- Semiconductor Components Industries, LLC
- Yu-Te HSIEH
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HIGH RELIABILITY WAFER LEVEL SEMICONDUCTOR PACKAGING
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HIGH RELIABILITY WAFER LEVEL SEMICONDUCTOR PACKAGING
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LASER HEATING APPARATUS FOR METAL EUTECTIC BONDING
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Silicon-diamond composite heat spreader and associated methods
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- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...

the layer connector being disposed in a recess of the surface

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Display device using semiconductor light-emitting elements and manu...

Display device and method of providing the same

Display device

Power semiconductor device and substrate with dimple region

Method for manufacturing display panel, display panel, and display...

Method for processing a semiconductor wafer, semiconductor wafer, c...

Power semiconductor device and manufacturing method for power semic...

High reliability wafer level semiconductor packaging

High reliability wafer level semiconductor packaging

High reliability wafer level semiconductor packaging

Method for processing a wafer and wafer structure

Semiconductor chips having improved solidity, semiconductor package...

Semiconductor packages and methods of formation thereof

Diamond composite heat spreader and associated methods

Diamond composite heat spreader and associated methods

Carbonaceous composite heat spreader and associated methods

Patents Applicationslast 30 patents

INTEGRATED PACKAGE AND METHOD FOR MAKING THE SAME

PACKAGE CARRIER PLATE WITH EMBEDDED EFFICIENT HEAT DISSIPATION MODU...

LIGHT-EMITTING DEVICE, LIGHT-EMITTING MODULE AND PREPARATION METHOD...

SENSOR PACKAGING METHOD AND SENSOR PACKAGE

LIQUID METAL WELLS FOR INTERCONNECT ARCHITECTURES

PRE-MOLD SUBSTRATE AND METHOD FOR MANUFACTURING THE PRE-MOLD SUBSTRATE

PACKAGE STRUCTURE AND METHOD FOR FABRICATING THE SAME

SEMICONDUCTOR WAFER, CLIP AND SEMICONDUCTOR DEVICE

METHOD FOR MANUFACTURING DISPLAY PANEL, DISPLAY PANEL, AND DISPLAY...

DISPLAY MODULE AND DISPLAY APPARATUS HAVING THE SAME

LIGHTING ELEMENT ALIGNMENT

DISPLAY DEVICE AND TILED DISPLAY DEVICE

DISPLAY APPARATUS INCLUDING A LOW BRIGHTNESS AREA

METHOD FOR MANUFACTURING DISPLAY PANEL, DISPLAY PANEL, AND DISPLAY...

Display Device

DIE-SUBSTRATE ASSEMBLIES HAVING SINTER-BONDED BACKSIDE VIA STRUCTUR...

DISPLAY DEVICE AND METHOD OF PROVIDING THE SAME

POWER SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD FOR POWER SEMIC...

METHOD FOR PROCESSING A SEMICONDUCTOR WAFER, SEMICONDUCTOR WAFER, C...

Method and Structure for Supporting Thin Semiconductor Chips with a...

POWER SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD FOR POWER SEMIC...

HIGH RELIABILITY WAFER LEVEL SEMICONDUCTOR PACKAGING

HIGH RELIABILITY WAFER LEVEL SEMICONDUCTOR PACKAGING

HIGH RELIABILITY WAFER LEVEL SEMICONDUCTOR PACKAGING

SEMICONDUCTOR CHIPS HAVING IMPROVED SOLIDITY, SEMICONDUCTOR PACKAGE...

Semiconductor Packages and Methods of Formation Thereof

LASER HEATING APPARATUS FOR METAL EUTECTIC BONDING

Diamond composite heat spreader and associated methods

Silicon-diamond composite heat spreader and associated methods

Diamond composite heat spreader and associated methods