the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body

Industry

CPC
H01L2224/32151

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/32151the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor structure and method for forming the same
- Patent number 11,854,867
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Company Ltd.
- Jen-Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and method for forming the same
- Patent number 11,521,893
- Issue date Dec 6, 2022
- Taiwan Semiconductor Manufacturing Company Ltd.
- Jen-Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package comprising a substrate with interconnect routing over solde...
- Patent number 11,444,019
- Issue date Sep 13, 2022
- QUALCOMM Incorporated
- Aniket Patil
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power inverter module with reduced inductance
- Patent number 10,937,747
- Issue date Mar 2, 2021
- GM Global Technology Operations LLC
- Marko Jaksic
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive paste for bonding
- Patent number 10,696,875
- Issue date Jun 30, 2020
- E. I. Du Pont de Nemours and Company
- Yumi Matsuura
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor package
- Patent number 10,461,005
- Issue date Oct 29, 2019
- Advanced Semiconductor Engineering, Inc.
- Wen-Long Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating glass substrate package
- Patent number 10,453,819
- Issue date Oct 22, 2019
- Ping-Jung Yang
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Grant
Power module assembly with dual substrates and reduced inductance
- Patent number 10,283,475
- Issue date May 7, 2019
- GM Global Technology Operations LLC
- Terence G. Ward
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating glass substrate package
- Patent number 10,096,565
- Issue date Oct 9, 2018
- Ping-Jung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module
- Patent number 9,704,828
- Issue date Jul 11, 2017
- Shindengen Electric Manufacturing Co., Ltd.
- Kosuke Ikeda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a flip chip package and apparatus to attach...
- Patent number 8,697,494
- Issue date Apr 15, 2014
- Samsung Electronics Co., Ltd.
- Chang-Seong Jeon
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
High density chip stacked package, package-on-package and method of...
- Patent number 8,664,757
- Issue date Mar 4, 2014
- Samsung Electronics Co., Ltd.
- Yun-Rae Cho
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
3-D IC in Embedded Die Substrate
- Publication number 20240203892
- Publication date Jun 20, 2024
- pSemi Corporation
- Buddhika Abesingha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE, POWER SUPPLY CIRCUIT, AND CHIP
- Publication number 20240170439
- Publication date May 23, 2024
- Huawei Technologies Co., Ltd
- Fengqun Lang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Power Semiconductor Module and Manufacturing Method
- Publication number 20230317684
- Publication date Oct 5, 2023
- Hitachi Energy Switzerland AG
- Harald Beyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20230098026
- Publication date Mar 30, 2023
- Taiwan Semiconductor Manufacturing company Ltd.
- JEN-YUAN CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20220139771
- Publication date May 5, 2022
- Taiwan Semiconductor Manufacturing company Ltd.
- JEN-YUAN CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE COMPRISING A SUBSTRATE WITH INTERCONNECT ROUTING OVER SOLDE...
- Publication number 20210313266
- Publication date Oct 7, 2021
- QUALCOMM Incorporated
- Aniket PATIL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER INVERTER MODULE WITH REDUCED INDUCTANCE
- Publication number 20210020588
- Publication date Jan 21, 2021
- GM GLOBAL TECHNOLOGY OPERATIONS LLC
- Marko Jaksic
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING AN ELECTRONIC DEVICE
- Publication number 20200248040
- Publication date Aug 6, 2020
- DUPONT ELECTRONICS, INC.
- Yumi Matsuura
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20190304862
- Publication date Oct 3, 2019
- Advanced Semiconductor Engineering, Inc.
- Wen-Long LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATING GLASS SUBSTRATE PACKAGE
- Publication number 20190027459
- Publication date Jan 24, 2019
- Ping-Jung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE ASSEMBLY WITH DUAL SUBSTRATES AND REDUCED INDUCTANCE
- Publication number 20180166410
- Publication date Jun 14, 2018
- GM GLOBAL TECHNOLOGY OPERATIONS LLC
- Terence G. Ward
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATING GLASS SUBSTRATE PACKAGE
- Publication number 20170207188
- Publication date Jul 20, 2017
- Ping-Jung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED COMPONENT PACKAGE STRUCTURE AND METHOD OF MANUFACTURING TH...
- Publication number 20160064329
- Publication date Mar 3, 2016
- Advanced Semiconductor Engineering, Inc.
- Chih-Cheng LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING A FLIP CHIP PACKAGE AND APPARATUS TO ATTACH...
- Publication number 20140196280
- Publication date Jul 17, 2014
- Samsung Electronics Co., Ltd.
- Chang-Seong Jeon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING A FLIP CHIP PACKAGE AND APPARATUS TO ATTACH...
- Publication number 20120100668
- Publication date Apr 26, 2012
- Samsung Electronics Co., Ltd.
- Chang-Seong Jeon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH DENSITY CHIP STACKED PACKAGE, PACKAGE-ON-PACKAGE AND METHOD OF...
- Publication number 20120007227
- Publication date Jan 12, 2012
- Samsung Electronics Co., Ltd.
- Yun-Rae CHO
- H01 - BASIC ELECTRIC ELEMENTS

the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor structure and method for forming the same

Semiconductor structure and method for forming the same

Package comprising a substrate with interconnect routing over solde...

Power inverter module with reduced inductance

Conductive paste for bonding

Semiconductor package

Method for fabricating glass substrate package

Power module assembly with dual substrates and reduced inductance

Method for fabricating glass substrate package

Semiconductor module

Method of manufacturing a flip chip package and apparatus to attach...

High density chip stacked package, package-on-package and method of...

Patents Applicationslast 30 patents

3-D IC in Embedded Die Substrate

POWER MODULE, POWER SUPPLY CIRCUIT, AND CHIP

Power Semiconductor Module and Manufacturing Method

SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME

SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME

PACKAGE COMPRISING A SUBSTRATE WITH INTERCONNECT ROUTING OVER SOLDE...

POWER INVERTER MODULE WITH REDUCED INDUCTANCE

METHOD OF MANUFACTURING AN ELECTRONIC DEVICE

SEMICONDUCTOR PACKAGE

METHOD FOR FABRICATING GLASS SUBSTRATE PACKAGE

POWER MODULE ASSEMBLY WITH DUAL SUBSTRATES AND REDUCED INDUCTANCE

METHOD FOR FABRICATING GLASS SUBSTRATE PACKAGE

EMBEDDED COMPONENT PACKAGE STRUCTURE AND METHOD OF MANUFACTURING TH...

METHOD OF MANUFACTURING A FLIP CHIP PACKAGE AND APPARATUS TO ATTACH...

METHOD OF MANUFACTURING A FLIP CHIP PACKAGE AND APPARATUS TO ATTACH...

HIGH DENSITY CHIP STACKED PACKAGE, PACKAGE-ON-PACKAGE AND METHOD OF...