the layer connector connecting between the body and an opposite side of the item with respect to the body

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H01L2224/3226

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/3226the layer connector connecting between the body and an opposite side of the item with respect to the body

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Bonded structures with integrated passive component
- Patent number 12,057,383
- Issue date Aug 6, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method of forming the same
- Patent number 12,051,655
- Issue date Jul 30, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jen-Jui Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for thin film capacitor integration
- Patent number 11,948,871
- Issue date Apr 2, 2024
- Texas Instruments Incorporated
- Benjamin Stassen Cook
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package structure and method for forming the same
- Patent number 11,784,061
- Issue date Oct 10, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Sheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit die stacked with backer die including capacitors...
- Patent number 11,699,629
- Issue date Jul 11, 2023
- Qorvo US, Inc.
- Anthony Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with high heat dissipation efficiency
- Patent number 11,699,675
- Issue date Jul 11, 2023
- Harvatek Corporation
- Chin-Jui Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Raised via for terminal connections on different planes
- Patent number 11,646,220
- Issue date May 9, 2023
- Taiwan Semiconductor Manufacturing Company
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded structures with integrated passive component
- Patent number 11,626,363
- Issue date Apr 11, 2023
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Module and electronic apparatus
- Patent number 11,527,494
- Issue date Dec 13, 2022
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Takahiro Igarashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal paste for joints, assembly, production method for assembly, s...
- Patent number 11,462,502
- Issue date Oct 4, 2022
- SHOWA DENKO MATERIALS CO., LTD.
- Yuki Kawana
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Coupling of integrated circuits (ICS) through a passivation-defined...
- Patent number 11,450,630
- Issue date Sep 20, 2022
- Cirrus Logic, Inc.
- Christopher Healy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including semiconductor chip and capacitor
- Patent number 11,450,627
- Issue date Sep 20, 2022
- SK hynix Inc.
- Dae Hyeok Ha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level integration of passive devices
- Patent number 11,398,456
- Issue date Jul 26, 2022
- Apple Inc.
- Jun Zhai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with integrated passive electrical component
- Patent number 11,257,739
- Issue date Feb 22, 2022
- Texas Instruments Incorporated
- Joyce Marie Mullenix
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Raised via for terminal connections on different planes
- Patent number 11,251,071
- Issue date Feb 15, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power module with capacitor configured for improved thermal management
- Patent number 11,212,947
- Issue date Dec 28, 2021
- EPCOS AG
- Markus Koini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged die stacks with stacked capacitors and methods of assembli...
- Patent number 11,121,074
- Issue date Sep 14, 2021
- Intel Corporation
- Bok Eng Cheah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing semiconductor device
- Patent number 11,069,538
- Issue date Jul 20, 2021
- Shindengen Electric Manufacturing Co., Ltd.
- Soichiro Umeda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of manufacturing the semiconductor...
- Patent number 10,971,486
- Issue date Apr 6, 2021
- Samsung Electronics Co., Ltd.
- Hee-Won Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method of manufacturing the same
- Patent number 10,861,832
- Issue date Dec 8, 2020
- United Microelectronics Corp.
- Chien-Li Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan-out semiconductor package
- Patent number 10,832,986
- Issue date Nov 10, 2020
- Samsung Electronics Co., Ltd.
- Jung Hyun Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing a silver sintering agent having silver oxide s...
- Patent number 10,785,877
- Issue date Sep 22, 2020
- Heraeus Deutschland GmbH & Co. KG
- Michael Schäfer
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Packaged semiconductor system having unidirectional connections to...
- Patent number 10,756,013
- Issue date Aug 25, 2020
- Texas Instruments Incorporated
- Saumya Gandhi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded-bridge substrate connectors and methods of assembling same
- Patent number 10,727,197
- Issue date Jul 28, 2020
- Intel IP Corporation
- Bernd Waidhas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method of manufacturing the same
- Patent number 10,714,452
- Issue date Jul 14, 2020
- United Microelectronics Corp.
- Chien-Li Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with integrated passive electrical component
- Patent number 10,714,412
- Issue date Jul 14, 2020
- Texas Instruments Incorporated
- Joyce Marie Mullenix
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Oven-controlled crystal oscillator
- Patent number 10,666,194
- Issue date May 26, 2020
- Nihon Dempa Kogyo Co., Ltd.
- Junichi Arai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Raised via for terminal connections on different planes
- Patent number 10,629,477
- Issue date Apr 21, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged die stacks with stacked capacitors and methods of assembli...
- Patent number 10,593,618
- Issue date Mar 17, 2020
- Intel Corporation
- Bok Eng Cheah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level integration of passive devices
- Patent number 10,468,381
- Issue date Nov 5, 2019
- Apple Inc.
- Jun Zhai
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
CHIP PACKAGE STRUCTURE WITH RING DAM
- Publication number 20240387195
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Sheng LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE EMPLOYING CORE WITH CAVITY EMBEDDING REDUCED HEIGHT ELECT...
- Publication number 20240371736
- Publication date Nov 7, 2024
- QUALCOMM Incorporated
- Omar James Bchir
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RF ANTENNA MODULE USING COPPER-TO-COPPER INTERCONNECTS BETWEEN THE...
- Publication number 20240363567
- Publication date Oct 31, 2024
- Intel Corporation
- Bernd WAIDHAS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED MILLIMETER WAVE ANTENNA ESD PROTECTION
- Publication number 20240363556
- Publication date Oct 31, 2024
- Intel Corporation
- Harald Gossner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME
- Publication number 20240332215
- Publication date Oct 3, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jen-Jui Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE
- Publication number 20240282662
- Publication date Aug 22, 2024
- UT-Battelle, LLC
- Md Shajjad Chowdhury
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240203961
- Publication date Jun 20, 2024
- Samsung Electronics Co., Ltd.
- Hyeonjeong HWANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESS FOR THIN FILM CAPACITOR INTEGRATION
- Publication number 20240194574
- Publication date Jun 13, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Benjamin Stassen Cook
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240164118
- Publication date May 16, 2024
- RENESAS ELECTRONICS CORPORATION
- Kazuaki TSUCHIYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240145413
- Publication date May 2, 2024
- SUMITOMO ELECTRIC DEVICE INNOVATIONS, INC.
- Makoto NISHIHARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240128248
- Publication date Apr 18, 2024
- RENESAS ELECTRONICS CORPORATION
- Yasutaka NAKASHIBA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20240105694
- Publication date Mar 28, 2024
- Samsung Electronics Co., Ltd.
- Jung Hoo YUN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Package with Double-Side...
- Publication number 20240063196
- Publication date Feb 22, 2024
- STATS ChipPAC Pte Ltd.
- TaeKeun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP STRUCTURE, SEMICONDUCTOR PACKAGE, AND FABRICATING METHOD THEREOF
- Publication number 20240021558
- Publication date Jan 18, 2024
- Powertech Technology Inc.
- Shang-Yu CHANG-CHIEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE STRUCTURE WITH RING DAM
- Publication number 20230369068
- Publication date Nov 16, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Sheng LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOLDED ELECTRONIC PACKAGE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20230326835
- Publication date Oct 12, 2023
- NEXPERIA B.V.
- Hing Suan Cheam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20230089615
- Publication date Mar 23, 2023
- Kabushiki Kaisha Toshiba
- Kenichi AGAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED SEMICONDUCTOR DEVICE, LEADFRAME AND METHOD FOR IMPROVED BO...
- Publication number 20230068886
- Publication date Mar 2, 2023
- NXP USA, Inc.
- You Ge
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME
- Publication number 20230014450
- Publication date Jan 19, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jen-Jui Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IC CHIP MOUNTING DEVICE AND IC CHIP MOUNTING METHOD
- Publication number 20230011327
- Publication date Jan 12, 2023
- SATO HOLDINGS KABUSHIKI KAISHA
- Yoshimitsu MAEDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20220392819
- Publication date Dec 8, 2022
- DENSO CORPORATION
- Sachio KODAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESS FOR THIN FILM CAPACITOR INTEGRATION
- Publication number 20220375836
- Publication date Nov 24, 2022
- TEXAS INSTRUMENTS INCORPORATED
- Benjamin Stassen Cook
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH HIGH HEAT DISSIPATION EFFICIENCY
- Publication number 20220359451
- Publication date Nov 10, 2022
- HARVATEK CORPORATION
- Chin-Jui LIANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING SAME
- Publication number 20220352130
- Publication date Nov 3, 2022
- Samsung Electronics Co., Ltd.
- JEONG HYUN LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wafer Level Integration of Passive Devices
- Publication number 20220320048
- Publication date Oct 6, 2022
- Apple Inc.
- Jun Zhai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DIE STACKED WITH BACKER DIE INCLUDING CAPACITORS...
- Publication number 20220310471
- Publication date Sep 29, 2022
- Qorvo US, Inc.
- Anthony Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20220270893
- Publication date Aug 25, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Sheng LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLEXIBLE ELECTRONIC STRUCTURE
- Publication number 20220246500
- Publication date Aug 4, 2022
- PRAGMATIC PRINTING LTD.
- Brian COBB
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Raised Via for Terminal Connections on Different Planes
- Publication number 20220165611
- Publication date May 26, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COUPLING OF INTEGRATED CIRCUITS (ICS) THROUGH A PASSIVATION-DEFINED...
- Publication number 20220130778
- Publication date Apr 28, 2022
- Cirrus Logic International Semiconductor Ltd.
- Christopher Healy
- H01 - BASIC ELECTRIC ELEMENTS

the layer connector connecting between the body and an opposite side of the item with respect to the body

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Bonded structures with integrated passive component

Package structure and method of forming the same

Process for thin film capacitor integration

Chip package structure and method for forming the same

Integrated circuit die stacked with backer die including capacitors...

Semiconductor device with high heat dissipation efficiency

Raised via for terminal connections on different planes

Bonded structures with integrated passive component

Module and electronic apparatus

Metal paste for joints, assembly, production method for assembly, s...

Coupling of integrated circuits (ICS) through a passivation-defined...

Semiconductor package including semiconductor chip and capacitor

Wafer level integration of passive devices

Semiconductor package with integrated passive electrical component

Raised via for terminal connections on different planes

Power module with capacitor configured for improved thermal management

Packaged die stacks with stacked capacitors and methods of assembli...

Semiconductor device and method of manufacturing semiconductor device

Semiconductor package and method of manufacturing the semiconductor...

Package structure and method of manufacturing the same

Fan-out semiconductor package

Method for producing a silver sintering agent having silver oxide s...

Packaged semiconductor system having unidirectional connections to...

Embedded-bridge substrate connectors and methods of assembling same

Package structure and method of manufacturing the same

Semiconductor package with integrated passive electrical component

Oven-controlled crystal oscillator

Raised via for terminal connections on different planes

Packaged die stacks with stacked capacitors and methods of assembli...

Wafer level integration of passive devices

Patents Applicationslast 30 patents

CHIP PACKAGE STRUCTURE WITH RING DAM

SUBSTRATE EMPLOYING CORE WITH CAVITY EMBEDDING REDUCED HEIGHT ELECT...

RF ANTENNA MODULE USING COPPER-TO-COPPER INTERCONNECTS BETWEEN THE...

INTEGRATED MILLIMETER WAVE ANTENNA ESD PROTECTION

PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME

POWER MODULE

SEMICONDUCTOR PACKAGE

PROCESS FOR THIN FILM CAPACITOR INTEGRATION

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME

Semiconductor Device and Method of Forming Package with Double-Side...

CHIP STRUCTURE, SEMICONDUCTOR PACKAGE, AND FABRICATING METHOD THEREOF

CHIP PACKAGE STRUCTURE WITH RING DAM

MOLDED ELECTRONIC PACKAGE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE

PACKAGED SEMICONDUCTOR DEVICE, LEADFRAME AND METHOD FOR IMPROVED BO...

PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME

IC CHIP MOUNTING DEVICE AND IC CHIP MOUNTING METHOD

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

PROCESS FOR THIN FILM CAPACITOR INTEGRATION

SEMICONDUCTOR DEVICE WITH HIGH HEAT DISSIPATION EFFICIENCY

SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING SAME

Wafer Level Integration of Passive Devices

INTEGRATED CIRCUIT DIE STACKED WITH BACKER DIE INCLUDING CAPACITORS...

CHIP PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME

FLEXIBLE ELECTRONIC STRUCTURE

Raised Via for Terminal Connections on Different Planes

COUPLING OF INTEGRATED CIRCUITS (ICS) THROUGH A PASSIVATION-DEFINED...