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the layer connector connecting to a bond pad of the item

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  • CPC
  • H01L2224/32157
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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/32157the layer connector connecting to a bond pad of the item
Industries

Patents Grantslast 30 patents

Patents Applicationslast 30 patents

  • Information Patent Application

    ELECTRONIC DEVICE
    • Publication number 20240363582
    • Publication date Oct 31, 2024
    • InnoLux Corporation
    • Pai-Chiao Cheng
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    PROTECTION LAYER FOR SEMICONDUCTOR DEVICE
    • Publication number 20230402405
    • Publication date Dec 14, 2023
    • Taiwan Semiconductor Manufacturing Co., Ltd.
    • I-Han Huang
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    ELECTRONIC DEVICE
    • Publication number 20220084982
    • Publication date Mar 17, 2022
    • InnoLux Corporation
    • Pai-Chiao Cheng
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SENSOR SYSTEMS AND METHODS FOR PROVIDING SENSOR SYSTEMS
    • Publication number 20210183808
    • Publication date Jun 17, 2021
    • GENERAL ELECTRIC COMPANY
    • David Richard Esler
    • B81 - MICRO-STRUCTURAL TECHNOLOGY
  • Information Patent Application

    ELECTRONIC DEVICE
    • Publication number 20200365551
    • Publication date Nov 19, 2020
    • InnoLux Corporation
    • Pai-Chiao Cheng
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR DEVICE
    • Publication number 20170256483
    • Publication date Sep 7, 2017
    • Kabushiki Kaisha Toshiba
    • Hiroshi Matsuyama
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    METHOD FOR PACKING ELECTRIC COMPONENTS ON A SUBSTRATE
    • Publication number 20100186894
    • Publication date Jul 29, 2010
    • SONY CHEMICAL & INFORMATION DEVICE CORPORATION
    • Takashi Matsumura
    • B30 - PRESSES
  • Information Patent Application

    COMPRESSION BONDING DEVICE
    • Publication number 20090014498
    • Publication date Jan 15, 2009
    • SONY CHEMICAL & INFORMATION DEVICE CORPORATION
    • Takashi Matsumura
    • B30 - PRESSES