TREA

the layer connector connecting to a bonding area disposed in a recess of the surface of the item

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  • CPC
  • H01L2224/32267
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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/32267the layer connector connecting to a bonding area disposed in a recess of the surface of the item
Industries

Patents Grantslast 30 patents

Patents Applicationslast 30 patents

  • Information Patent Application

    INTEGRATED MILLIMETER WAVE ANTENNA ESD PROTECTION
    • Publication number 20240363556
    • Publication date Oct 31, 2024
    • Intel Corporation
    • Harald Gossner
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR DEVICE
    • Publication number 20230089615
    • Publication date Mar 23, 2023
    • Kabushiki Kaisha Toshiba
    • Kenichi AGAWA
    • H01 - BASIC ELECTRIC ELEMENTS