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the layer connector connecting to a bonding area disposed in a recess of the surface of the item
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CPC
H01L2224/32267
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H
ELECTRICITY
H01
Electric elements
H01L
SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
H01L2224/00
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
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H01L2224/32267
the layer connector connecting to a bonding area disposed in a recess of the surface of the item
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last 30 patents
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Patent Application
INTEGRATED MILLIMETER WAVE ANTENNA ESD PROTECTION
Publication number
20240363556
Publication date
Oct 31, 2024
Intel Corporation
Harald Gossner
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
SEMICONDUCTOR DEVICE
Publication number
20230089615
Publication date
Mar 23, 2023
Kabushiki Kaisha Toshiba
Kenichi AGAWA
H01 - BASIC ELECTRIC ELEMENTS