the layer connector connecting to a bonding area protruding from the surface of the item

Industry

CPC
H01L2224/32238

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/32238the layer connector connecting to a bonding area protruding from the surface of the item

Industries

Patents Grantslast 30 patents

Information Patent Grant
Light-emitting device and displayer
- Patent number 12,148,867
- Issue date Nov 19, 2024
- FOSHAN NATIONSTAR OPTOELECTRONICS CO., LTD
- Kuai Qin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device and method of manufacturing the same
- Patent number 12,080,662
- Issue date Sep 3, 2024
- Samsung Display Co., Ltd.
- Eui Jeong Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 11,837,569
- Issue date Dec 5, 2023
- Kioxia Corporation
- Yoshiharu Okada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device including adhesive film with conductive ball
- Patent number 11,824,034
- Issue date Nov 21, 2023
- Samsung Display Co., Ltd.
- Joo-nyung Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Anisotropic conductive film and display device using the same
- Patent number 11,683,963
- Issue date Jun 20, 2023
- SAMSUNG DISPLAY CO., LTD.
- Chungseok Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring substrate and semiconductor device
- Patent number 11,404,362
- Issue date Aug 2, 2022
- Shinko Electric Industries Co., Ltd.
- Takashi Arai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-sided cooling semiconductor package and method of manufacturi...
- Patent number 11,380,646
- Issue date Jul 5, 2022
- Life-On Semiconductor Corporation
- Chung Hsing Tzu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light-emitting device
- Patent number 11,114,596
- Issue date Sep 7, 2021
- Nichia Corporation
- Yoshikazu Matsuda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die stack assembly using an edge separation structure for connectiv...
- Patent number 10,854,581
- Issue date Dec 1, 2020
- Littelfuse, Inc.
- Elmar Wisotzki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-stage cure bare die light emitting diode
- Patent number 10,795,452
- Issue date Oct 6, 2020
- Microsoft Technology Licensing, LLC
- Benjamin Patrick Sullivan
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
High reliability wafer level semiconductor packaging
- Patent number 10,790,208
- Issue date Sep 29, 2020
- Semiconductor Components Industries, LLC
- Yu-Te Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die stack assembly using an edge separation structure for connectiv...
- Patent number 10,734,362
- Issue date Aug 4, 2020
- Littelfuse, Inc.
- Elmar Wisotzki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded-bridge substrate connectors and methods of assembling same
- Patent number 10,727,197
- Issue date Jul 28, 2020
- Intel IP Corporation
- Bernd Waidhas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device
- Patent number 10,600,712
- Issue date Mar 24, 2020
- Shindengen Electric Manufacturing Co., Ltd.
- Yuji Morinaga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for fabricating a circuit substrate
- Patent number 10,573,614
- Issue date Feb 25, 2020
- Via Technologies, Inc.
- Chen-Yueh Kung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High reliability wafer level semiconductor packaging
- Patent number 10,290,556
- Issue date May 14, 2019
- Semiconductor Components Industries, LLC
- Yu-Te Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Anisotropic conductive film and display device using the same
- Patent number 10,217,807
- Issue date Feb 26, 2019
- Samsung Display Co., Ltd.
- Chungseok Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit substrate and semicondutor package structure
- Patent number 10,103,115
- Issue date Oct 16, 2018
- Via Technologies, Inc.
- Chen-Yueh Kung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stretchable semiconductor packages and semiconductor devices includ...
- Patent number 9,972,568
- Issue date May 15, 2018
- SK hynix Inc.
- Jong Hoon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Copper pillar sidewall protection
- Patent number 9,875,980
- Issue date Jan 23, 2018
- Amkor Technology, Inc.
- Glenn Rinne
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High reliability wafer level semiconductor packaging
- Patent number 9,859,180
- Issue date Jan 2, 2018
- Semiconductor Components Industries, LLC
- Yu-Te Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stretchable semiconductor packages and semiconductor devices includ...
- Patent number 9,806,016
- Issue date Oct 31, 2017
- SK hynix Inc.
- Jong Hoon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including barrier members and method of manuf...
- Patent number 9,741,633
- Issue date Aug 22, 2017
- Samsung Electronics Co., Ltd.
- Jian Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating semiconductor device using gang bonding and s...
- Patent number 9,711,693
- Issue date Jul 18, 2017
- Chung Hoon Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor laser structure
- Patent number 9,653,382
- Issue date May 16, 2017
- Industrial Technology Research Institute
- Jui-Ying Lin
- G02 - OPTICS
Information Patent Grant
Method and apparatus for a seal ring structure
- Patent number 9,650,243
- Issue date May 16, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ting-Ying Chen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Heat dissipation device and semiconductor device
- Patent number 9,646,915
- Issue date May 9, 2017
- Kyocera Corporation
- Yoshitaka Iwata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module
- Patent number 9,633,967
- Issue date Apr 25, 2017
- NSK Ltd.
- Takashi Sunaga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optical coupling module
- Patent number 9,613,886
- Issue date Apr 4, 2017
- Industrial Technology Research Institute
- Jui-Ying Lin
- G02 - OPTICS
Information Patent Grant
Semiconductor module
- Patent number 9,609,775
- Issue date Mar 28, 2017
- NSK Ltd.
- Takashi Sunaga
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240379485
- Publication date Nov 14, 2024
- Fuji Electric Co., Ltd.
- Shinichi MASUDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20240321809
- Publication date Sep 26, 2024
- STMicroelectronics International N.V.
- Romain COFFY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240312960
- Publication date Sep 19, 2024
- Kabushiki Kaisha Toshiba
- Shun TAKEDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE ADHESIVE FILM AND FABRICATION METHOD THEREFOR, ELECTRONI...
- Publication number 20240304586
- Publication date Sep 12, 2024
- CHENGDU BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Shaopeng LI
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
SEMICONDUCTOR MODULE AND WIRING MEMBER
- Publication number 20240243093
- Publication date Jul 18, 2024
- Fuji Electric Co., Ltd.
- Koji OSAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20240234230
- Publication date Jul 11, 2024
- ROHM CO., LTD.
- Natsuki SAKAMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER COMPOSITE, SEMICONDUCTOR DEVICE AND METHODS OF MANUFACTURING...
- Publication number 20240112956
- Publication date Apr 4, 2024
- INFINEON TECHNOLOGIES AUSTRIA AG
- Hermann Gruber
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER LEADFRAME PACKAGE WITH REDUCED SOLDER VOIDS
- Publication number 20240113064
- Publication date Apr 4, 2024
- STMICROELECTRONICS, INC.
- Jefferson Sismundo TALLEDO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE FOR VEHICLE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240105573
- Publication date Mar 28, 2024
- Hyundai Motor Company
- Jun Hee PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPONENT-EMBEDDED PACKAGING STRUCTURE
- Publication number 20240096838
- Publication date Mar 21, 2024
- PHOENIX PIONEER TECHNOLOGY CO., LTD.
- Chu-Chin HU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE AND SEMICONDUCTOR DEVICE
- Publication number 20240096792
- Publication date Mar 21, 2024
- Murata Manufacturing Co., Ltd.
- Satoshi GOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Carrier Substrate
- Publication number 20240087979
- Publication date Mar 14, 2024
- Solid-tech Co., Ltd.
- Tzu Chien Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE ASSEMBLY SUBSTRATES WITH TUNNELED INTERCONNECT...
- Publication number 20240071963
- Publication date Feb 29, 2024
- Micron Technology, Inc.
- Yun Ting Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SMALLER MODULE BY STACKING
- Publication number 20240038743
- Publication date Feb 1, 2024
- Dingyou Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240006402
- Publication date Jan 4, 2024
- ROHM CO., LTD.
- Masashi HAYASHIGUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE ARRAY DEVICE
- Publication number 20230290753
- Publication date Sep 14, 2023
- Kabushiki Kaisha Toshiba
- Hideto FURUYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING COLOR MICRO LED DISPLAY CHIP MODULE
- Publication number 20230246060
- Publication date Aug 3, 2023
- Fujian Prima Optoelectronics Co., Ltd.
- Fan Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES
- Publication number 20230115957
- Publication date Apr 13, 2023
- Samsung Electronics Co., Ltd.
- KIJU LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE
- Publication number 20230070620
- Publication date Mar 9, 2023
- SAMSUNG DISPLAY CO., LTD.
- Seung Kyu LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20230052108
- Publication date Feb 16, 2023
- Rohm Co., Ltd.
- Kenji HAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE AND MANUFACTURING METHOD OF THE SAME
- Publication number 20230005961
- Publication date Jan 5, 2023
- SAMSUNG DISPLAY CO., LTD.
- Dae Hwan JANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE USING SEMICONDUCTOR LIGHT EMITTING ELEMENTS, AND MET...
- Publication number 20220406982
- Publication date Dec 22, 2022
- LG ELECTRONICS INC.
- Hwanjoon CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY PANEL AND METHOD OF MANUFACTURING SAME
- Publication number 20220367770
- Publication date Nov 17, 2022
- HON HAI PRECISION INDUSTRY CO., LTD.
- YI-HSIANG LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONNECTING STRIP FOR DISCRETE AND POWER ELECTRONIC DEVICES
- Publication number 20220320032
- Publication date Oct 6, 2022
- STMicroelectronics S.r.l.
- Agatino Minotti
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Light-Emitting Device and Displayer
- Publication number 20220231206
- Publication date Jul 21, 2022
- FOSHAN NATIONSTAR OPTOELECTRONICS CO., LTD
- Kuai QIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20220148993
- Publication date May 12, 2022
- NEPES CO., LTD.
- Byung Cheol KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20220059493
- Publication date Feb 24, 2022
- KIOXIA Corporation
- Yoshiharu OKADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUPPORT SUBSTRATE FOR INTEGRATED CIRCUIT, ELECTRONIC DEVICE, AND CO...
- Publication number 20210391227
- Publication date Dec 16, 2021
- STMicroelectronics (Grenoble 2) SAS
- Richard REMBERT
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20210375804
- Publication date Dec 2, 2021
- SAMSUNG DISPLAY CO., LTD.
- EUI JEONG KANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE
- Publication number 20210288015
- Publication date Sep 16, 2021
- SAMSUNG DISPLAY CO., LTD.
- Joo-nyung JANG
- H01 - BASIC ELECTRIC ELEMENTS

the layer connector connecting to a bonding area protruding from the surface of the item

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Light-emitting device and displayer

Display device and method of manufacturing the same

Semiconductor device and manufacturing method thereof

Display device including adhesive film with conductive ball

Anisotropic conductive film and display device using the same

Wiring substrate and semiconductor device

Multi-sided cooling semiconductor package and method of manufacturi...

Light-emitting device

Die stack assembly using an edge separation structure for connectiv...

Multi-stage cure bare die light emitting diode

High reliability wafer level semiconductor packaging

Die stack assembly using an edge separation structure for connectiv...

Embedded-bridge substrate connectors and methods of assembling same

Electronic device

Process for fabricating a circuit substrate

High reliability wafer level semiconductor packaging

Anisotropic conductive film and display device using the same

Circuit substrate and semicondutor package structure

Stretchable semiconductor packages and semiconductor devices includ...

Copper pillar sidewall protection

High reliability wafer level semiconductor packaging

Stretchable semiconductor packages and semiconductor devices includ...

Semiconductor package including barrier members and method of manuf...

Method of fabricating semiconductor device using gang bonding and s...

Semiconductor laser structure

Method and apparatus for a seal ring structure

Heat dissipation device and semiconductor device

Semiconductor module

Optical coupling module

Semiconductor module

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE

ELECTRONIC DEVICE

SEMICONDUCTOR DEVICE

CONDUCTIVE ADHESIVE FILM AND FABRICATION METHOD THEREFOR, ELECTRONI...

SEMICONDUCTOR MODULE AND WIRING MEMBER

ELECTRONIC DEVICE

WAFER COMPOSITE, SEMICONDUCTOR DEVICE AND METHODS OF MANUFACTURING...

POWER LEADFRAME PACKAGE WITH REDUCED SOLDER VOIDS

POWER MODULE FOR VEHICLE AND METHOD OF MANUFACTURING THE SAME

COMPONENT-EMBEDDED PACKAGING STRUCTURE

SEMICONDUCTOR MODULE AND SEMICONDUCTOR DEVICE

Carrier Substrate

SEMICONDUCTOR DEVICE ASSEMBLY SUBSTRATES WITH TUNNELED INTERCONNECT...

SMALLER MODULE BY STACKING

SEMICONDUCTOR DEVICE

SEMICONDUCTOR MODULE ARRAY DEVICE

METHOD FOR MANUFACTURING COLOR MICRO LED DISPLAY CHIP MODULE

SEMICONDUCTOR PACKAGES

DISPLAY DEVICE

SEMICONDUCTOR DEVICE

DISPLAY DEVICE AND MANUFACTURING METHOD OF THE SAME

DISPLAY DEVICE USING SEMICONDUCTOR LIGHT EMITTING ELEMENTS, AND MET...

DISPLAY PANEL AND METHOD OF MANUFACTURING SAME

CONNECTING STRIP FOR DISCRETE AND POWER ELECTRONIC DEVICES

Light-Emitting Device and Displayer

SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

SUPPORT SUBSTRATE FOR INTEGRATED CIRCUIT, ELECTRONIC DEVICE, AND CO...

DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME

DISPLAY DEVICE