the leads being also applied on the sidewalls or the bottom of the substrate

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

Current Industry

H01L23/49805the leads being also applied on the sidewalls or the bottom of the substrate

Industries

Patents Grantslast 30 patents

Information Patent Grant
Method of forming semiconductor packages having through package vias
- Patent number 12,107,051
- Issue date Oct 1, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional functional integration
- Patent number 12,074,098
- Issue date Aug 27, 2024
- Texas Instruments Incorporated
- Sreenivasan K. Koduri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optimized power delivery for multi-layer substrate
- Patent number 12,057,379
- Issue date Aug 6, 2024
- Cisco Technology, Inc.
- D. Brice Achkir
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High-frequency ceramic packages with modified castellation and meta...
- Patent number 12,040,265
- Issue date Jul 16, 2024
- Texas Instruments Incorporated
- Yiqi Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Organic interposer including intra-die structural reinforcement str...
- Patent number 12,040,267
- Issue date Jul 16, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Li-Ling Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sensor package and manufacturing method thereof
- Patent number 12,002,725
- Issue date Jun 4, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Ji Young Chung
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Palladium-coated copper bonding wire, manufacturing method of palla...
- Patent number 11,996,382
- Issue date May 28, 2024
- Tanaka Denshi Kogyo K.K.
- Mitsuo Takada
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Semiconductor device and method for manufacturing semiconductor device
- Patent number 11,996,355
- Issue date May 28, 2024
- Mitsubishi Electric Corporation
- Atsushi Maeda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structures and methods of manufacture
- Patent number 11,984,388
- Issue date May 14, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Stephen St. Germain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
ASIC package with photonics and vertical power delivery
- Patent number 11,978,721
- Issue date May 7, 2024
- Google LLC
- Woon-Seong Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Devices and methods related to dual-sided radio-frequency package w...
- Patent number 11,961,805
- Issue date Apr 16, 2024
- Skyworks Solutions, Inc.
- Howard E. Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component, multiplexer, and module
- Patent number 11,942,438
- Issue date Mar 26, 2024
- Taiyo Yuden Co., Ltd.
- Motoi Yamauchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 11,923,280
- Issue date Mar 5, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Won Bae Bang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor integrated fluxgate device shielded by discrete magne...
- Patent number 11,921,134
- Issue date Mar 5, 2024
- Texas Instruments Incorporated
- Dok Won Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package and a method of manufacturing the same
- Patent number 11,908,781
- Issue date Feb 20, 2024
- Advanced Semiconductor Engineering, Inc.
- Wei-Chih Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 11,901,269
- Issue date Feb 13, 2024
- Samsung Electronics Co., Ltd.
- Seongchan Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Insulating component, semiconductor package, and semiconductor appa...
- Patent number 11,901,247
- Issue date Feb 13, 2024
- Kyocera Corporation
- Masami Juta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and packaging process for side-wall plating w...
- Patent number 11,876,003
- Issue date Jan 16, 2024
- VISHAY GENERAL SEMICONDUCTOR, LLC
- Longnan Jin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic assembly
- Patent number 11,862,544
- Issue date Jan 2, 2024
- Advanced Semiconductor Engineering, Inc.
- Chang-Lin Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a packaged semiconductor device having enhanced w...
- Patent number 11,862,539
- Issue date Jan 2, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Pedro Joel Rivera-Marty
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging substrate, packaging structure, electronic device, and ma...
- Patent number 11,854,953
- Issue date Dec 26, 2023
- Huawei Technologies Co., Ltd.
- Zan Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package structure with conductive shielding film
- Patent number 11,855,047
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming semiconductor packages having through package vias
- Patent number 11,837,550
- Issue date Dec 5, 2023
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Surface-mount thin-film components having terminals configured for...
- Patent number 11,798,896
- Issue date Oct 24, 2023
- KYOCERA AVX Components Corporation
- Yehuda Seidman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Edge-connected semiconductor systems
- Patent number 11,791,319
- Issue date Oct 17, 2023
- NVIDIA Corporation
- Joey Cai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring board, electronic device, and electronic module
- Patent number 11,784,117
- Issue date Oct 10, 2023
- Kyocera Corporation
- Kazushi Nakamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a semiconductor device
- Patent number 11,764,135
- Issue date Sep 19, 2023
- Amkor Technology Singapore Holding Pte Ltd.
- Siang Miang Yeo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and corresponding method
- Patent number 11,749,588
- Issue date Sep 5, 2023
- STMicroelectronics S.r.l.
- Michele Derai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Side pad anchored by next adjacent via
- Patent number 11,735,529
- Issue date Aug 22, 2023
- International Business Machines Corporation
- Takahito Watanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Quad flat no lead package and method of making
- Patent number 11,735,435
- Issue date Aug 22, 2023
- Texas Instruments Incorporated
- Dan Okamoto
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20240363506
- Publication date Oct 31, 2024
- Amkor Technology Singapore Holding Pte. Ltd.
- Won Bae Bang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS RELATED TO DUAL-SIDED RADIO-FREQUENCY PACKAGE WITH OVERMOLD...
- Publication number 20240347476
- Publication date Oct 17, 2024
- Skyworks Solutions, Inc.
- Howard E. CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CLIPS WITH ALIGNMENT FEATURES AND RELATED METHODS
- Publication number 20240332145
- Publication date Oct 3, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Roxanna Samson Caguioa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SENSOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20240321658
- Publication date Sep 26, 2024
- Amkor Technology Singapore Holding Pte. Ltd.
- Ji Young Chung
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
ORGANIC INTERPOSER INCLUDING INTRA-DIE STRUCTURAL REINFORCEMENT STR...
- Publication number 20240321717
- Publication date Sep 26, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Li-Ling LIAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TEST SUBSTRATE, TEST DEVICE, AND TEST METHOD
- Publication number 20240234221
- Publication date Jul 11, 2024
- Samsung Electronics Co., Ltd.
- Changui Hong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Asic Package With Photonics And Vertical Power Delivery
- Publication number 20240213215
- Publication date Jun 27, 2024
- Google LLC
- Woon-Seong Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING A PACKAGED SEMICONDUCTOR DEVICE HAVING ENHANCED W...
- Publication number 20240203839
- Publication date Jun 20, 2024
- Amkor Technology Singapore Holding Pte. Ltd
- Pedro Joel Rivera-Marty
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Die Attach with Adhesive Layer C...
- Publication number 20240194628
- Publication date Jun 13, 2024
- STATS ChipPAC Pte Ltd.
- YongMoo Shin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC ASSEMBLY
- Publication number 20240145357
- Publication date May 2, 2024
- Advanced Semiconductor Engineering, Inc.
- Chang-Lin YEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE FOR ACCOMMODATING ELECTRONIC COMPONENT, ELECTRONIC APPARATU...
- Publication number 20240145318
- Publication date May 2, 2024
- KYOCERA CORPORATION
- Takuo KISAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE AND ELECTRONIC APPARATUS
- Publication number 20240145415
- Publication date May 2, 2024
- PanelSemi Corporation
- HSIEN-TE CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TEST SUBSTRATE, TEST DEVICE, AND TEST METHOD
- Publication number 20240136237
- Publication date Apr 25, 2024
- Samsung Electronics Co., Ltd.
- Changui Hong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID CHIP CARRIER PACKAGE
- Publication number 20240128170
- Publication date Apr 18, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Yiqi Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Antenna-In-Package Structure
- Publication number 20240096770
- Publication date Mar 21, 2024
- JCET STATS ChipPAC Korea Limited
- SeungHyun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER BASED MOLDED FLIP CHIP ROUTABLE IC PACKAGE
- Publication number 20240096771
- Publication date Mar 21, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Osvaldo Lopez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RECESS LEAD FOR A SURFACE MOUNT PACKAGE
- Publication number 20240071889
- Publication date Feb 29, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Naweed Anjum
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH-SUBSTRATE CONNECTIONS FOR RECESSED SEMICONDUCTOR DIES
- Publication number 20240055397
- Publication date Feb 15, 2024
- Micron Technology, Inc.
- Thiagarajan Raman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240038640
- Publication date Feb 1, 2024
- Rohm Co., Ltd.
- Hiroki MIYAZAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC DEVICE PACKAGE WITH INTEGRAL ANTENNA MODULE AND SEM...
- Publication number 20240038691
- Publication date Feb 1, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Vijaylaxmi Gumaste Khanolkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240030080
- Publication date Jan 25, 2024
- Rohm Co., Ltd.
- Akihiro KOGA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR INTERPOSER STRUCTURE
- Publication number 20240014109
- Publication date Jan 11, 2024
- NANYA TECHNOLOGY CORPORATION
- CHIN-LING HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR INTERPOSER STRUCTURE
- Publication number 20240014110
- Publication date Jan 11, 2024
- NANYA TECHNOLOGY CORPORATION
- CHIN-LING HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-DIE QFN HYBRID PACKAGE
- Publication number 20240006278
- Publication date Jan 4, 2024
- MEDIATEK INC.
- Hsin-Long Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICALLY CONDUCTIVE STRIPS ON A SIDE OF A MEMORY MODULE
- Publication number 20230420342
- Publication date Dec 28, 2023
- Intel Corporation
- Min Suet LIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND CORRESPONDING METHOD
- Publication number 20230411258
- Publication date Dec 21, 2023
- STMicroelectronics S.r.l
- Michele DERAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE
- Publication number 20230411257
- Publication date Dec 21, 2023
- Amkor Technology Singapore Holding Pte. Ltd.
- Siang Miang YEO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING STRUCTURE CONNECTING FRONTSIDE AND B...
- Publication number 20230402367
- Publication date Dec 14, 2023
- Taiwan Semiconductor Manufacturing company Ltd.
- CHIA-TIEN WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Disposing Electrical Components...
- Publication number 20230395477
- Publication date Dec 7, 2023
- STATS ChipPAC Pte Ltd.
- GunHyuck Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP SCALE QFN PLASTIC PACKAGING SYSTEM FOR HIGH FREQUENCY INTEGRAT...
- Publication number 20230395478
- Publication date Dec 7, 2023
- ASELSAN ELEKTRONIK SANAYI VE TICARET ANONIM SIRKETI
- Ahmet AKTUG
- H01 - BASIC ELECTRIC ELEMENTS

the leads being also applied on the sidewalls or the bottom of the substrate

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method of forming semiconductor packages having through package vias

Three-dimensional functional integration

Optimized power delivery for multi-layer substrate

High-frequency ceramic packages with modified castellation and meta...

Organic interposer including intra-die structural reinforcement str...

Sensor package and manufacturing method thereof

Palladium-coated copper bonding wire, manufacturing method of palla...

Semiconductor device and method for manufacturing semiconductor device

Semiconductor package structures and methods of manufacture

ASIC package with photonics and vertical power delivery

Devices and methods related to dual-sided radio-frequency package w...

Electronic component, multiplexer, and module

Semiconductor device and manufacturing method thereof

Semiconductor integrated fluxgate device shielded by discrete magne...

Semiconductor device package and a method of manufacturing the same

Semiconductor package

Insulating component, semiconductor package, and semiconductor appa...

Semiconductor package and packaging process for side-wall plating w...

Electronic assembly

Method of forming a packaged semiconductor device having enhanced w...

Packaging substrate, packaging structure, electronic device, and ma...

Chip package structure with conductive shielding film

Method of forming semiconductor packages having through package vias

Surface-mount thin-film components having terminals configured for...

Edge-connected semiconductor systems

Wiring board, electronic device, and electronic module

Method of manufacturing a semiconductor device

Semiconductor device and corresponding method

Side pad anchored by next adjacent via

Quad flat no lead package and method of making

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

METHODS RELATED TO DUAL-SIDED RADIO-FREQUENCY PACKAGE WITH OVERMOLD...

CLIPS WITH ALIGNMENT FEATURES AND RELATED METHODS

SENSOR PACKAGE AND MANUFACTURING METHOD THEREOF

ORGANIC INTERPOSER INCLUDING INTRA-DIE STRUCTURAL REINFORCEMENT STR...

TEST SUBSTRATE, TEST DEVICE, AND TEST METHOD

Asic Package With Photonics And Vertical Power Delivery

METHOD OF FORMING A PACKAGED SEMICONDUCTOR DEVICE HAVING ENHANCED W...

Semiconductor Device and Method of Die Attach with Adhesive Layer C...

ELECTRONIC ASSEMBLY

PACKAGE FOR ACCOMMODATING ELECTRONIC COMPONENT, ELECTRONIC APPARATU...

ELECTRONIC DEVICE AND ELECTRONIC APPARATUS

TEST SUBSTRATE, TEST DEVICE, AND TEST METHOD

HYBRID CHIP CARRIER PACKAGE

Integrated Antenna-In-Package Structure

WAFER BASED MOLDED FLIP CHIP ROUTABLE IC PACKAGE

RECESS LEAD FOR A SURFACE MOUNT PACKAGE

THROUGH-SUBSTRATE CONNECTIONS FOR RECESSED SEMICONDUCTOR DIES

SEMICONDUCTOR DEVICE

MICROELECTRONIC DEVICE PACKAGE WITH INTEGRAL ANTENNA MODULE AND SEM...

SEMICONDUCTOR DEVICE

SEMICONDUCTOR INTERPOSER STRUCTURE

SEMICONDUCTOR INTERPOSER STRUCTURE

MULTI-DIE QFN HYBRID PACKAGE

ELECTRICALLY CONDUCTIVE STRIPS ON A SIDE OF A MEMORY MODULE

SEMICONDUCTOR DEVICE AND CORRESPONDING METHOD

METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE INCLUDING STRUCTURE CONNECTING FRONTSIDE AND B...

Semiconductor Device and Method of Disposing Electrical Components...

CHIP SCALE QFN PLASTIC PACKAGING SYSTEM FOR HIGH FREQUENCY INTEGRAT...