the leads being also applied on the sidewalls or the bottom of the substrate

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

Current Industry

H01L23/49805the leads being also applied on the sidewalls or the bottom of the substrate

Industries

Patents Grantslast 30 patents

Information Patent Grant
Devices and methods related to dual-sided radio-frequency package w...
- Patent number 11,961,805
- Issue date Apr 16, 2024
- Skyworks Solutions, Inc.
- Howard E. Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component, multiplexer, and module
- Patent number 11,942,438
- Issue date Mar 26, 2024
- Taiyo Yuden Co., Ltd.
- Motoi Yamauchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 11,923,280
- Issue date Mar 5, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Won Bae Bang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor integrated fluxgate device shielded by discrete magne...
- Patent number 11,921,134
- Issue date Mar 5, 2024
- Texas Instruments Incorporated
- Dok Won Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package and a method of manufacturing the same
- Patent number 11,908,781
- Issue date Feb 20, 2024
- Advanced Semiconductor Engineering, Inc.
- Wei-Chih Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 11,901,269
- Issue date Feb 13, 2024
- Samsung Electronics Co., Ltd.
- Seongchan Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Insulating component, semiconductor package, and semiconductor appa...
- Patent number 11,901,247
- Issue date Feb 13, 2024
- Kyocera Corporation
- Masami Juta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and packaging process for side-wall plating w...
- Patent number 11,876,003
- Issue date Jan 16, 2024
- VISHAY GENERAL SEMICONDUCTOR, LLC
- Longnan Jin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic assembly
- Patent number 11,862,544
- Issue date Jan 2, 2024
- Advanced Semiconductor Engineering, Inc.
- Chang-Lin Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a packaged semiconductor device having enhanced w...
- Patent number 11,862,539
- Issue date Jan 2, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Pedro Joel Rivera-Marty
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging substrate, packaging structure, electronic device, and ma...
- Patent number 11,854,953
- Issue date Dec 26, 2023
- Huawei Technologies Co., Ltd.
- Zan Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package structure with conductive shielding film
- Patent number 11,855,047
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming semiconductor packages having through package vias
- Patent number 11,837,550
- Issue date Dec 5, 2023
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Surface-mount thin-film components having terminals configured for...
- Patent number 11,798,896
- Issue date Oct 24, 2023
- KYOCERA AVX Components Corporation
- Yehuda Seidman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Edge-connected semiconductor systems
- Patent number 11,791,319
- Issue date Oct 17, 2023
- NVIDIA Corporation
- Joey Cai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring board, electronic device, and electronic module
- Patent number 11,784,117
- Issue date Oct 10, 2023
- Kyocera Corporation
- Kazushi Nakamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a semiconductor device
- Patent number 11,764,135
- Issue date Sep 19, 2023
- Amkor Technology Singapore Holding Pte Ltd.
- Siang Miang Yeo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and corresponding method
- Patent number 11,749,588
- Issue date Sep 5, 2023
- STMicroelectronics S.r.l.
- Michele Derai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Side pad anchored by next adjacent via
- Patent number 11,735,529
- Issue date Aug 22, 2023
- International Business Machines Corporation
- Takahito Watanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Quad flat no lead package and method of making
- Patent number 11,735,435
- Issue date Aug 22, 2023
- Texas Instruments Incorporated
- Dan Okamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan-out package structure and method
- Patent number 11,715,681
- Issue date Aug 1, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tzu-Wei Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structures and methods of manufacture
- Patent number 11,710,686
- Issue date Jul 25, 2023
- Semiconductor Components Industries, LLC
- Stephen St. Germain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring substrate
- Patent number 11,688,669
- Issue date Jun 27, 2023
- Shinko Electric Industries Co. Ltd.
- Satoshi Hondo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
IC chip package with dummy solder structure under corner, and relat...
- Patent number 11,682,646
- Issue date Jun 20, 2023
- MARVELL ASIA PTE. LTD.
- Manish Nayini
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Sensor package and manufacturing method thereof
- Patent number 11,682,598
- Issue date Jun 20, 2023
- Amkor Technology Singapore Holding Pte.
- Ji Young Chung
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Three-dimensional functional integration
- Patent number 11,682,609
- Issue date Jun 20, 2023
- Texas Instruments Incorporated
- Sreenivasan K. Koduri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Radio frequency modules
- Patent number 11,682,649
- Issue date Jun 20, 2023
- Skyworks Solutions, Inc.
- Gregory Edward Babcock
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure with interconnection between chips and packaging...
- Patent number 11,670,520
- Issue date Jun 6, 2023
- Unimicron Technology Corp.
- Jia Shiang Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and a method of making a semiconductor device
- Patent number 11,664,447
- Issue date May 30, 2023
- Nexperia B.V.
- Jeroen Croon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
RFI free picture frame metal stiffener
- Patent number 11,658,127
- Issue date May 23, 2023
- Intel Corporation
- Eng Huat Goh
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ELECTRONIC ASSEMBLY
- Publication number 20240145357
- Publication date May 2, 2024
- Advanced Semiconductor Engineering, Inc.
- Chang-Lin YEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE FOR ACCOMMODATING ELECTRONIC COMPONENT, ELECTRONIC APPARATU...
- Publication number 20240145318
- Publication date May 2, 2024
- KYOCERA CORPORATION
- Takuo KISAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE AND ELECTRONIC APPARATUS
- Publication number 20240145415
- Publication date May 2, 2024
- PanelSemi Corporation
- HSIEN-TE CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TEST SUBSTRATE, TEST DEVICE, AND TEST METHOD
- Publication number 20240136237
- Publication date Apr 25, 2024
- Samsung Electronics Co., Ltd.
- Changui Hong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID CHIP CARRIER PACKAGE
- Publication number 20240128170
- Publication date Apr 18, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Yiqi Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Antenna-In-Package Structure
- Publication number 20240096770
- Publication date Mar 21, 2024
- JCET STATS ChipPAC Korea Limited
- SeungHyun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER BASED MOLDED FLIP CHIP ROUTABLE IC PACKAGE
- Publication number 20240096771
- Publication date Mar 21, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Osvaldo Lopez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RECESS LEAD FOR A SURFACE MOUNT PACKAGE
- Publication number 20240071889
- Publication date Feb 29, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Naweed Anjum
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH-SUBSTRATE CONNECTIONS FOR RECESSED SEMICONDUCTOR DIES
- Publication number 20240055397
- Publication date Feb 15, 2024
- Micron Technology, Inc.
- Thiagarajan Raman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240038640
- Publication date Feb 1, 2024
- Rohm Co., Ltd.
- Hiroki MIYAZAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC DEVICE PACKAGE WITH INTEGRAL ANTENNA MODULE AND SEM...
- Publication number 20240038691
- Publication date Feb 1, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Vijaylaxmi Gumaste Khanolkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240030080
- Publication date Jan 25, 2024
- Rohm Co., Ltd.
- Akihiro KOGA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR INTERPOSER STRUCTURE
- Publication number 20240014109
- Publication date Jan 11, 2024
- NANYA TECHNOLOGY CORPORATION
- CHIN-LING HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR INTERPOSER STRUCTURE
- Publication number 20240014110
- Publication date Jan 11, 2024
- NANYA TECHNOLOGY CORPORATION
- CHIN-LING HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-DIE QFN HYBRID PACKAGE
- Publication number 20240006278
- Publication date Jan 4, 2024
- MEDIATEK INC.
- Hsin-Long Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICALLY CONDUCTIVE STRIPS ON A SIDE OF A MEMORY MODULE
- Publication number 20230420342
- Publication date Dec 28, 2023
- Intel Corporation
- Min Suet LIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND CORRESPONDING METHOD
- Publication number 20230411258
- Publication date Dec 21, 2023
- STMicroelectronics S.r.l
- Michele DERAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE
- Publication number 20230411257
- Publication date Dec 21, 2023
- Amkor Technology Singapore Holding Pte. Ltd.
- Siang Miang YEO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING STRUCTURE CONNECTING FRONTSIDE AND B...
- Publication number 20230402367
- Publication date Dec 14, 2023
- Taiwan Semiconductor Manufacturing company Ltd.
- CHIA-TIEN WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Disposing Electrical Components...
- Publication number 20230395477
- Publication date Dec 7, 2023
- STATS ChipPAC Pte Ltd.
- GunHyuck Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP SCALE QFN PLASTIC PACKAGING SYSTEM FOR HIGH FREQUENCY INTEGRAT...
- Publication number 20230395478
- Publication date Dec 7, 2023
- ASELSAN ELEKTRONIK SANAYI VE TICARET ANONIM SIRKETI
- Ahmet AKTUG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RADIO-FREQUENCY MODULE AND COMMUNICATION DEVICE
- Publication number 20230395536
- Publication date Dec 7, 2023
- Murata Manufacturing Co., Ltd.
- Naohide TOMITA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Forming Semiconductor Packages Having Through Package Vias
- Publication number 20230378075
- Publication date Nov 23, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20230361006
- Publication date Nov 9, 2023
- Rohm Co., Ltd.
- Ryuta YAGINUMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE HAVING LEADFRAME-LESS SIGNAL CONNECTORS, IN PARTICULAR...
- Publication number 20230317537
- Publication date Oct 5, 2023
- STMicroelectronics S.r.l.
- Sergio SAVINO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20230317575
- Publication date Oct 5, 2023
- Analog Devices, Inc.
- Hien Minh Pham
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURES AND METHODS OF MANUFACTURE
- Publication number 20230317576
- Publication date Oct 5, 2023
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Stephen ST. GERMAIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SENSOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20230290699
- Publication date Sep 14, 2023
- Amkor Technology Singapore Holding Pte. Ltd.
- Ji Young Chung
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
THREE-DIMENSIONAL FUNCTIONAL INTEGRATION
- Publication number 20230260879
- Publication date Aug 17, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Sreenivasan K. Koduri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR INTEGRATED FLUXGATE DEVICE SHIELDED BY DISCRETE MAGNE...
- Publication number 20230243874
- Publication date Aug 3, 2023
- TEXAS INSTRUMENTS INCORPORATED
- DOK WON LEE
- H01 - BASIC ELECTRIC ELEMENTS

the leads being also applied on the sidewalls or the bottom of the substrate

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Devices and methods related to dual-sided radio-frequency package w...

Electronic component, multiplexer, and module

Semiconductor device and manufacturing method thereof

Semiconductor integrated fluxgate device shielded by discrete magne...

Semiconductor device package and a method of manufacturing the same

Semiconductor package

Insulating component, semiconductor package, and semiconductor appa...

Semiconductor package and packaging process for side-wall plating w...

Electronic assembly

Method of forming a packaged semiconductor device having enhanced w...

Packaging substrate, packaging structure, electronic device, and ma...

Chip package structure with conductive shielding film

Method of forming semiconductor packages having through package vias

Surface-mount thin-film components having terminals configured for...

Edge-connected semiconductor systems

Wiring board, electronic device, and electronic module

Method of manufacturing a semiconductor device

Semiconductor device and corresponding method

Side pad anchored by next adjacent via

Quad flat no lead package and method of making

Fan-out package structure and method

Semiconductor package structures and methods of manufacture

Wiring substrate

IC chip package with dummy solder structure under corner, and relat...

Sensor package and manufacturing method thereof

Three-dimensional functional integration

Radio frequency modules

Package structure with interconnection between chips and packaging...

Semiconductor device and a method of making a semiconductor device

RFI free picture frame metal stiffener

Patents Applicationslast 30 patents

ELECTRONIC ASSEMBLY

PACKAGE FOR ACCOMMODATING ELECTRONIC COMPONENT, ELECTRONIC APPARATU...

ELECTRONIC DEVICE AND ELECTRONIC APPARATUS

TEST SUBSTRATE, TEST DEVICE, AND TEST METHOD

HYBRID CHIP CARRIER PACKAGE

Integrated Antenna-In-Package Structure

WAFER BASED MOLDED FLIP CHIP ROUTABLE IC PACKAGE

RECESS LEAD FOR A SURFACE MOUNT PACKAGE

THROUGH-SUBSTRATE CONNECTIONS FOR RECESSED SEMICONDUCTOR DIES

SEMICONDUCTOR DEVICE

MICROELECTRONIC DEVICE PACKAGE WITH INTEGRAL ANTENNA MODULE AND SEM...

SEMICONDUCTOR DEVICE

SEMICONDUCTOR INTERPOSER STRUCTURE

SEMICONDUCTOR INTERPOSER STRUCTURE

MULTI-DIE QFN HYBRID PACKAGE

ELECTRICALLY CONDUCTIVE STRIPS ON A SIDE OF A MEMORY MODULE

SEMICONDUCTOR DEVICE AND CORRESPONDING METHOD

METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE INCLUDING STRUCTURE CONNECTING FRONTSIDE AND B...

Semiconductor Device and Method of Disposing Electrical Components...

CHIP SCALE QFN PLASTIC PACKAGING SYSTEM FOR HIGH FREQUENCY INTEGRAT...

RADIO-FREQUENCY MODULE AND COMMUNICATION DEVICE

Method of Forming Semiconductor Packages Having Through Package Vias

SEMICONDUCTOR DEVICE

POWER MODULE HAVING LEADFRAME-LESS SIGNAL CONNECTORS, IN PARTICULAR...

ELECTRONIC DEVICE

SEMICONDUCTOR PACKAGE STRUCTURES AND METHODS OF MANUFACTURE

SENSOR PACKAGE AND MANUFACTURING METHOD THEREOF

THREE-DIMENSIONAL FUNCTIONAL INTEGRATION

SEMICONDUCTOR INTEGRATED FLUXGATE DEVICE SHIELDED BY DISCRETE MAGNE...