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the material being a silicon nitride not containing oxygen
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Transistor with dielectric spacers and field plate and method of fa...
Patent number
12,369,380
Issue date
Jul 22, 2025
NXP USA, INC.
Darrell Glenn Hill
H01 - BASIC ELECTRIC ELEMENTS
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Method of processing substrate, method of manufacturing semiconduct...
Patent number
12,365,987
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Jul 22, 2025
Kokusai Electric Corporation
Hiroaki Hiramatsu
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Precursors and processes for deposition of Si-containing films usin...
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12,368,042
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Jul 22, 2025
L'AIR LIQUIDE, SOCIETE ANONYME POUR L'ETUDE ET L'EXPLOITATION DES PROCEDES GE...
Naoto Noda
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Vertical semiconductor device and method for fabricating the same
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12,363,902
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Jul 15, 2025
SK hynix Inc.
Hye-Hyeon Byeon
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Method of manufacturing semiconductor device, substrate processing...
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12,359,314
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Jul 15, 2025
Kokusai Electric Corporation
Shin Sone
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Semiconductor device and manufacturing method thereof
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12,362,224
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Jul 15, 2025
Taiwan Semiconductor Manufacturing Co., Ltd
Kuo-Cheng Ching
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Semiconductor device
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12,363,961
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Jul 15, 2025
Infineon Technologies AG
Carsten Schaeffer
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Deposition of oxides and nitrides
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12,359,315
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Jul 15, 2025
ASM IP Holding B.V.
Henri Jussila
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Methods and apparatus for low temperature silicon nitride films
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12,362,169
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Jul 15, 2025
Applied Materials, Inc.
Wenbo Yan
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Gate and locos dielectrics grown using locos processing
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12,354,905
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Jul 8, 2025
Texas Instruments Incorporated
Mark Francis Arendt
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Deposition of films using molybdenum precursors
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12,351,914
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Jul 8, 2025
Lam Research Corporation
Joshua Collins
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Multilayer stacking wafer bonding structure and method of manufactu...
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12,354,870
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Jul 8, 2025
Powerchip Semiconductor Manufacturing Corporation
Shou-Zen Chang
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Amorphous layers for reducing copper diffusion and method forming same
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12,354,908
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Jul 8, 2025
Taiwan Semiconductor Manufacturing Co., Ltd
Jyh-Nan Lin
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Method for forming semiconductor device and resulting device
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12,349,449
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Jul 1, 2025
Taiwan Semiconductor Manufacturing Company, Ltd
Tong-Min Weng
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Manufacturing method for semiconductor device
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12,349,434
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Jul 1, 2025
Tokyo Electron Limited
Koji Akiyama
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Substrate processing method and substrate processing system
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12,347,676
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Jul 1, 2025
Tokyo Electron Limited
Yuichiro Wagatsuma
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MOCVD method for growing INALGAN/GAN heterostructure
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12,347,678
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Jul 1, 2025
NATIONAL YANG MING CHIAO TUNG UNIVERSITY
Edward Yi Chang
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Film formation method and film formation apparatus
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12,341,004
Issue date
Jun 24, 2025
Tokyo Electron Limited
Yumiko Kawano
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Semiconductor device with fin structures
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12,342,605
Issue date
Jun 24, 2025
Taiwan Semiconductor Manufacturing Company, Ltd
Kun-Yu Lee
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Method for preparing a surface for direct-bonding
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12,341,018
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Jun 24, 2025
ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
Jeremy Alfred Theil
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Substrate processing method and substrate processing apparatus
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12,341,020
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Jun 24, 2025
Tokyo Electron Limited
Ryutaro Suda
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Methods for patterning a silicon oxide-silicon nitride-silicon oxid...
Patent number
12,334,333
Issue date
Jun 17, 2025
Taiwan Semiconductor Manufacturing Company Limited
Yi-Ren Wang
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Inner spacers for gate-all-around semiconductor devices
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12,336,214
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Jun 17, 2025
Taiwan Semiconductor Manufacturing Co., Ltd
Yu-Yun Peng
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Structures and methods for fabricating staircase regions of a three...
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12,334,399
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Jun 17, 2025
Yangtze Memory Technologies Co., Ltd.
Xiongyu Wang
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Methods and apparatus for selective etch stop capping and selective...
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12,334,394
Issue date
Jun 17, 2025
Applied Materials, Inc.
Suketu Parikh
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Etching gas mixture and method of manufacturing integrated circuit...
Patent number
12,327,731
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Jun 10, 2025
Samsung Electronics Co., Ltd.
Changgil Son
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Ultraviolet radiation activated atomic layer deposition
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12,327,721
Issue date
Jun 10, 2025
Taiwan Semiconductor Manufacturing Co., Ltd
Christine Y. Ouyang
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Method of processing substrate, substrate processing apparatus, rec...
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12,327,720
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Jun 10, 2025
Kokusai Electric Corporation
Toshiyuki Kikuchi
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Semiconductor device and method for manufacturing semiconductor device
Patent number
12,328,908
Issue date
Jun 10, 2025
Semiconductor Energy Laboratory Co., Ltd.
Tetsuya Kakehata
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Thin film deposition process
Patent number
12,322,591
Issue date
Jun 3, 2025
ASM IP Holding B.V.
Naoki Inoue
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INTEGRATED ASSEMBLIES AND METHODS OF FORMING INTEGRATED ASSEMBLIES
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20250240962
Publication date
Jul 24, 2025
Lodestar Licensing Group LLC
Ramey M. Abdelrahaman
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VERTICAL THIN-FILM TRANSISTOR AND APPLICATION AS BIT-LINE CONNECTOR...
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20250240970
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Jul 24, 2025
Sunrise Memory Corporation
Tianhong Yan
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SEMICONDUCTOR DEVICE WITH A SEMICONDUCTOR BODY HAVING A TYPE III-NI...
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20250240993
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Jul 24, 2025
INFINEON TECHNOLOGIES AG
Albert Birner
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ETCHING GAS MIXTURE AND METHOD OF MANUFACTURING INTEGRATED CIRCUIT...
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20250239461
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Jul 24, 2025
Samsung Electronics Co., Ltd.
Changgil SON
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INTEGRATED ASSEMBLIES AND METHODS OF FORMING INTEGRATED ASSEMBLIES
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20250234551
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Jul 17, 2025
Lodestar Licensing Group LLC
Jordan D. Greenlee
H01 - BASIC ELECTRIC ELEMENTS
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METHODS OF SELECTIVE ATOMIC LAYER DEPOSITION
Publication number
20250230545
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Jul 17, 2025
Applied Materials, Inc.
Bhaskar Jyoti Bhuyan
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DEPOSITION APPARATUS WITH DETECTION SYSTEM AND METHODS
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20250232992
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Jul 17, 2025
Taiwan Semiconductor Manufacturing company Ltd.
Ming-Yao HSIAO
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METHOD FOR MANUFACTURING MODIFIED SUBSTRATE AND METHOD FOR MANUFACT...
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20250230539
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Jul 17, 2025
FUJIFILM CORPORATION
Akihiro Hakamata
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GAP-FILLING METHOD FOR A SEMICONDUCTOR DEVICE AND METHOD OF MANUFAC...
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20250233017
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Jul 17, 2025
WONIK IPS CO., LTD.
Chang Gyu SONG
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METHOD FOR SELECTIVE DEPOSITION ON DIELECTRIC MATERIALS
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20250226205
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Jul 10, 2025
Entegris, Inc.
SungHae Lee
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GATE-ALL-AROUND INTEGRATED CIRCUIT STRUCTURES HAVING INSULATOR FIN...
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20250227959
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Jul 10, 2025
Intel Corporation
Aaron D. LILAK
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STRESS MODULATION OF NITRIDE LAYERS USING CHEMICAL VAPOR DEPOSITION...
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20250226226
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Jul 10, 2025
Applied Materials, Inc.
Rajesh PRASAD
H01 - BASIC ELECTRIC ELEMENTS
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FILM DEPOSITION APPARATUS FOR FINE PATTERN FORMING
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20250226177
Publication date
Jul 10, 2025
TOKYO ELECTRON LIMITED
Kazuhide HASEBE
G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
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METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, SUBSTRATE PROCESSING...
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20250226207
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Jul 10, 2025
Kokusai Electric Corporation
Yasunobu KOSHI
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METHODS AND APPARATUSES FOR FILLING A GAP
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20250226214
Publication date
Jul 10, 2025
ASM IP HOLDING B.V.
Ranjit Borude
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Substrate Processing Apparatus, Heat Insulating Structure, Method o...
Publication number
20250215561
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Jul 3, 2025
Kokusai Electric Corporation
Yusaku OKAJIMA
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HIGH ELECTRON MOBILITY TRANSISTOR AND METHOD OF MANUFACTURING THE SAME
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20250220973
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Jul 3, 2025
Powerchip Semiconductor Manufacturing Corporation
Jih-Wen Chou
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METHOD FOR MANUFACTURING SEMICONDUCTOR MEMORY DEVICE AND SEMICONDUC...
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20250220909
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Jul 3, 2025
KIOXIA Corporation
Hirotaka TSUDA
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ENCAPSULATED FLEXIBLE ELECTRONICS FOR LONG-TERM IMPLANTATION
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20250213162
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Jul 3, 2025
Northwestern University
John A. ROGERS
H01 - BASIC ELECTRIC ELEMENTS
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METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE
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20250218765
Publication date
Jul 3, 2025
Taiwan Semiconductor Manufacturing company Ltd.
SHIH-WEI PENG
H01 - BASIC ELECTRIC ELEMENTS
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THIN FILM MODIFICATION COMPOSITION, METHOD OF FORMING THIN FILM USI...
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20250218767
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Jul 3, 2025
Soulbrain Co., LTD
Seung Hyun LEE
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TREATING SILICON NITRIDE BASED DIELECTRIC FILMS
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20250218763
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Jul 3, 2025
Applied Materials, Inc.
Dongjoon KIM
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METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, SUBSTRATE PROCESSING...
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20250218764
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Jul 3, 2025
Kokusai Electric Corporation
Hiroshi ASHIHARA
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METHOD OF PROCESSING SUBSTRATE, METHOD OF MANUFACTURING SEMICONDUCT...
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20250218770
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Jul 3, 2025
Kokusai Electric Corporation
Kimihiko NAKATANI
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FILLING METHOD AND SUBSTRATE PROCESSING SYSTEM
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20250218769
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Jul 3, 2025
Tokyo Electron Limited
Hiroki MURAKAMI
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FIN FIELD-EFFECT TRANSISTOR AND METHOD OF FORMING THE SAME
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20250221000
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Jul 3, 2025
Taiwan Semiconductor Manufacturing Company, Ltd.
Sheng-Liang Pan
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SEMICONDUCTOR DEVICE WITH HELMET STRUCTURE BETWEEN TWO SEMICONDUCTO...
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20250212505
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Jun 26, 2025
Taiwan Semiconductor Manufacturing Co., Ltd.
Kuo-Cheng CHING
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TEMPERATURE CONTROL MODULE FOR A FURNACE REACTOR AND METHOD OF CONT...
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20250210343
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Jun 26, 2025
ASM IP HOLDING B.V.
Marina Mariano
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METHODS OF DEPOSITING SILICON-CONTAINING DIELECTRIC LAYERS FOR SEMI...
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20250210347
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Jun 26, 2025
Applied Materials, Inc.
Zhijie Chua
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SEMICONDUCTOR PACKAGE SUBSTRATE DICING AND EDGE PASSIVATION
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20250210586
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Jun 26, 2025
Intel Corporation
Praveen SREERAMAGIRI
H01 - BASIC ELECTRIC ELEMENTS