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the material being a silicon nitride not containing oxygen
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Methods of selective atomic layer deposition
Patent number
12,291,779
Issue date
May 6, 2025
Applied Materials, Inc.
Bhaskar Jyoti Bhuyan
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Substrate processing apparatus, elevator and method of manufacturin...
Patent number
12,293,932
Issue date
May 6, 2025
Kokusai Electric Corporation
Yuji Takebayashi
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Nitride semiconductor device and manufacturing method thereof
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12,289,914
Issue date
Apr 29, 2025
United Microelectronics Corp.
Chih Tung Yeh
H01 - BASIC ELECTRIC ELEMENTS
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Pulsed DC power for deposition of film
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12,288,670
Issue date
Apr 29, 2025
Applied Materials, Inc.
Abhijeet Laxman Sangle
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Method of manufacturing semiconductor device, substrate processing...
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12,288,683
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Apr 29, 2025
Kokusai Electric Corporation
Yasunobu Koshi
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Gate-all-around integrated circuit structures having insulator fin...
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12,288,813
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Apr 29, 2025
Intel Corporation
Aaron D. Lilak
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Film deposition apparatus for fine pattern forming
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12,288,671
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Apr 29, 2025
Tokyo Electron Limited
Kazuhide Hasebe
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Selective deposition method to form air gaps
Patent number
12,283,520
Issue date
Apr 22, 2025
ASM IP Holding B.V.
Chiyu Zhu
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Method of manufacturing a semiconductor device
Patent number
12,283,477
Issue date
Apr 22, 2025
Taiwan Semiconductor Manufacturing Company Ltd.
Shih-Wei Peng
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Methods for depositing blocking layers on conductive surfaces
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12,281,382
Issue date
Apr 22, 2025
Applied Materials, Inc.
Lakmal C. Kalutarage
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Substrate processing method
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12,283,479
Issue date
Apr 22, 2025
ASM IP Holding B.V.
JaeOk Ko
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Etching composition and method for selectively removing silicon nit...
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12,281,251
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Apr 22, 2025
VERSUM MATERIALS US, LLC
Jhih Kuei Ge
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Method for manufacturing metal gate
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12,284,824
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Apr 22, 2025
Shanghai Huali Integrated Circuit Corporation
Yanxia Hao
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Manufacturing method for compound semiconductor device
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12,283,922
Issue date
Apr 22, 2025
Fujitsu Limited
Kozo Makiyama
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Method of manufacturing semiconductor device, substrate processing...
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12,283,476
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Apr 22, 2025
Kokusai Electric Corporation
Hiroshi Ashihara
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Method for manufacturing semiconductor device
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12,283,481
Issue date
Apr 22, 2025
United Microelectronics Corp.
Yu Cheng Lin
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Integrated assemblies and methods of forming integrated assemblies
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12,279,431
Issue date
Apr 15, 2025
Ramey M. Abdelrahaman
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Fin field-effect transistor and method of forming the same
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12,278,277
Issue date
Apr 15, 2025
Taiwan Semiconductor Manufacturing Company, Ltd
Sheng-Liang Pan
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Semiconductor device with silicon nitride passivation film
Patent number
12,278,102
Issue date
Apr 15, 2025
Sumitomo Electric Industries, Ltd.
Kazuhide Sumiyoshi
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Treatment liquid and substrate treatment method
Patent number
12,275,921
Issue date
Apr 15, 2025
FUJIFILM Corporation
Tomonori Takahashi
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Semiconductor device with helmet structure between two semiconducto...
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12,278,236
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Apr 15, 2025
Taiwan Semiconductor Manufacturing Co., Ltd
Kuo-Cheng Ching
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Method for manufacturing semiconductor memory device and semiconduc...
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12,279,432
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Apr 15, 2025
Kioxia Corporation
Hirotaka Tsuda
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Selective laser annealing method
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12,278,275
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Apr 15, 2025
Infineon Technologies AG
Albert Birner
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Integrated circuit device with low threshold voltage
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12,272,604
Issue date
Apr 8, 2025
Taiwan Semiconductor Manufacturing Co., Ltd
Chung-Liang Cheng
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Integrated assemblies and methods of forming integrated assemblies
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12,274,063
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Apr 8, 2025
Jordan D. Greenlee
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Station-to-station control of backside bow compensation deposition
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12,272,608
Issue date
Apr 8, 2025
Lam Research Corporation
Yanhui Huang
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Method of forming an electronic structure using reforming gas, syst...
Patent number
12,272,548
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Apr 8, 2025
ASM IP Holding B.V.
Shinya Yoshimoto
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High-resistance resistor based on silicon carbide and manufacturing...
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12,268,013
Issue date
Apr 1, 2025
Talyuan University of Technology
Yuying Xi
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Transistor with dielectric spacers and method of fabrication therefor
Patent number
12,266,713
Issue date
Apr 1, 2025
NXP USA, INC.
Darrell Glenn Hill
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Substrate processing apparatus, method of manufacturing semiconduct...
Patent number
12,266,522
Issue date
Apr 1, 2025
Kokusai Electric Corporation
Kazuyuki Okuda
H01 - BASIC ELECTRIC ELEMENTS
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CONFORMAL BORON DOPING METHOD FOR THREE-DIMENSIONAL STRUCTURE AND U...
Publication number
20250149339
Publication date
May 8, 2025
Beijing Superstring Academy of Memory Technology
Jianfeng Gao
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Selective Dielectric Capping for Hybrid Bonding
Publication number
20250149474
Publication date
May 8, 2025
Applied Materials, Inc.
Prayudi LIANTO
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GRAPHENE SENSORS AND A METHOD OF MANUFACTURE
Publication number
20250146971
Publication date
May 8, 2025
Paragraf Limited
Liam McDonnell
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SEMICONDUCTOR DEVICE
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20250151311
Publication date
May 8, 2025
XIAMEN SAN'AN INTEGRATED CIRCUIT CO., LTD.
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METHOD OF MANUFACTURING A FIELD EFFECT TRANSISTOR USING CARBON NANO...
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20250151347
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May 8, 2025
Taiwan Semiconductor Manufacturing Company, Ltd.
H01 - BASIC ELECTRIC ELEMENTS
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SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS
Publication number
20250140552
Publication date
May 1, 2025
TOKYO ELECTRON LIMITED
Motoki SHINDEN
H01 - BASIC ELECTRIC ELEMENTS
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Semiconductor Device Having Dielectric Material Treated with Microw...
Publication number
20250140553
Publication date
May 1, 2025
Taiwan Semiconductor Manufacturing Company, Ltd.
Szu-Hua Chen
H01 - BASIC ELECTRIC ELEMENTS
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LOW RESISTIVITY METAL STACKS AND METHODS OF DEPOSITING THE SAME
Publication number
20250140562
Publication date
May 1, 2025
Applied Materials, Inc.
Zhaoxuan Wang
H01 - BASIC ELECTRIC ELEMENTS
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SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
Publication number
20250142934
Publication date
May 1, 2025
Mitsubishi Electric Corporation
Asuka MATSUYAMA
H01 - BASIC ELECTRIC ELEMENTS
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Assemblies Having Conductive Structures Along Pillars of Semiconduc...
Publication number
20250142875
Publication date
May 1, 2025
Micron Technology, Inc.
Sanh D. Tang
H01 - BASIC ELECTRIC ELEMENTS
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METAL OXIDE COMPOSITE AS ETCH STOP LAYER
Publication number
20250132197
Publication date
Apr 24, 2025
Taiwan Semiconductor Manufacturing Company, Ltd.
Kai-Feng Cheng
H01 - BASIC ELECTRIC ELEMENTS
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SOURCE/DRAIN FEATURE SEPARATION STRUCTURE
Publication number
20250133716
Publication date
Apr 24, 2025
Taiwan Semiconductor Manufacturing Co., Ltd.
Wen-Chun Keng
H01 - BASIC ELECTRIC ELEMENTS
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HARDMASK INTEGRATION FOR HIGH ASPECT RATIO APPLICATIONS
Publication number
20250132159
Publication date
Apr 24, 2025
TOKYO ELECTRON LIMITED
Joshua Baillargeon
H01 - BASIC ELECTRIC ELEMENTS
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METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
Publication number
20250125144
Publication date
Apr 17, 2025
NANYA TECHNOLOGY CORPORATION
Yubon CHIANG
H01 - BASIC ELECTRIC ELEMENTS
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EPITAXIAL SOURCE OR DRAIN STRUCTURES FOR ADVANCED INTEGRATED CIRCUI...
Publication number
20250126869
Publication date
Apr 17, 2025
Intel Corporation
Subhash JOSHI
H01 - BASIC ELECTRIC ELEMENTS
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METHOD OF BONDING MULTIPLE COPPER ELEMENTS AND METHOD OF BONDING MU...
Publication number
20250125185
Publication date
Apr 17, 2025
National Cheng Kung University
Shih-kang LIN
H01 - BASIC ELECTRIC ELEMENTS
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SUBSTRATE-PROCESSING METHOD AND SUBSTRATE-PROCESSING APPARATUS
Publication number
20250118550
Publication date
Apr 10, 2025
TOKYO ELECTRON LIMITED
Munehito KAGAYA
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
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METHODS OF FORMING MEMORY STRUCTURES FOR THREE-DIMENSIONAL NONVOLAT...
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20250118547
Publication date
Apr 10, 2025
IMEC vzw
Sana Rachidi
H01 - BASIC ELECTRIC ELEMENTS
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HEMT TRANSISTOR
Publication number
20250118613
Publication date
Apr 10, 2025
STMicroelectronics International N.V.
Paolo COLPANI
H01 - BASIC ELECTRIC ELEMENTS
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HEAT DISSIPATION FOR FIELD EFFECT TRANSISTORS
Publication number
20250118548
Publication date
Apr 10, 2025
Taiwan Semiconductor Manufacturing Company, Ltd.
Kai-Fang Cheng
H01 - BASIC ELECTRIC ELEMENTS
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SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME
Publication number
20250120083
Publication date
Apr 10, 2025
KIOXIA Corporation
Shinya ARAI
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SEMICONDUCTOR STRUCTURE, SEMICONDUCTOR DEVICE WITH AIR SPACERS, AND...
Publication number
20250112169
Publication date
Apr 3, 2025
NANYA TECHNOLOGY CORPORATION
FENG-WEN HSU
H01 - BASIC ELECTRIC ELEMENTS
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SELECTIVE DIELECTRIC GROWTH FOR DIRECTING CONTACT TO GATE OR CONTAC...
Publication number
20250112037
Publication date
Apr 3, 2025
Intel Corporation
Mark KOEPER
H01 - BASIC ELECTRIC ELEMENTS
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METHOD FOR PRODUCING A POWER SEMICONDUCTOR COMPONENT HAVING A PLURA...
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20250113514
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Apr 3, 2025
ROBERT BOSCH GmbH
Daniel Krebs
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SEMICONDUCTOR STRUCTURE, SEMICONDUCTOR DEVICE WITH AIR SPACERS, AND...
Publication number
20250112171
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Apr 3, 2025
NANYA TECHNOLOGY CORPORATION
FENG-WEN HSU
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PROCESS FOR SYNTHESIS OF MONOLAYER TRANSITION METAL DICHALOCOGENIDE
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20250105006
Publication date
Mar 27, 2025
INDIAN INSTITUTE OF SCIENCE EDUCATION AND RESEARCH, PUNE (IISER PUNE)
Gokul M. A
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SUBSTRATE PROCESSING APPARATUS AND METHOD OF MANUFACTURING SEMICOND...
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20250101583
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Mar 27, 2025
Kokusai Electric Corporation
Hidetoshi Mimura
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
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LOW RESISTANCE INTERCONNECT STRUCTURE FOR SEMICONDUCTOR DEVICE
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20250105147
Publication date
Mar 27, 2025
Taiwan Semiconductor Manufacturing Co., Ltd.
Jason HUANG
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CYCLIC LOW TEMPERATURE FILM GROWTH PROCESSES
Publication number
20250095983
Publication date
Mar 20, 2025
TOKYO ELECTRON LIMITED
Jianping Zhao
H01 - BASIC ELECTRIC ELEMENTS
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INTEGRATED ASSEMBLIES HAVING VERTICALLY-SPACED CHANNEL MATERIAL SEG...
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20250098168
Publication date
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Lodestar Licensing Group LLC
John D. Hopkins
H01 - BASIC ELECTRIC ELEMENTS