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the material being a silicon nitride not containing oxygen
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Air gap spacer formation for nano-scale semiconductor devices
Patent number
12,224,203
Issue date
Feb 11, 2025
Adeia Semiconductor Solutions LLC
Kangguo Cheng
H01 - BASIC ELECTRIC ELEMENTS
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Manufacturing method of metal grid, thin film sensor and manufactur...
Patent number
12,224,234
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Feb 11, 2025
BEIJING BOE TECHNOLOGY DEVELOPMENT CO., LTD.
Hu Meng
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Long-term implantable electronic devices
Patent number
12,220,239
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Feb 11, 2025
Northwestern University
John A. Rogers
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Method of manufacturing a field effect transistor using carbon nano...
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12,218,198
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Feb 4, 2025
Taiwan Semiconductor Manufacturing Company, Ltd
Matthias Passlack
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Semiconductor device structure with etch stop layer for reducing RC...
Patent number
12,218,241
Issue date
Feb 4, 2025
Taiwan Semiconductor Manufacturing Company, Ltd
Chung-Ting Ko
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Method of etching film and plasma processing apparatus
Patent number
12,217,973
Issue date
Feb 4, 2025
Tokyo Electron Limited
Kosuke Ogasawara
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Flowable chemical vapor deposition of metal oxides
Patent number
12,211,736
Issue date
Jan 28, 2025
Applied Materials, Inc.
Hurshvardhan Srivastava
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Manufacturing method for silicon nitride thin film, thin film trans...
Patent number
12,211,688
Issue date
Jan 28, 2025
BEIHAI HKC OPTOELECTRONICS TECHNOLOGY CO., LTD.
En-Tsung Cho
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Protective passivation layer for magnetic tunnel junctions
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12,213,385
Issue date
Jan 28, 2025
Taiwan Semiconductor Manufacturing Company, Ltd
Jodi Mari Iwata
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Electronic devices comprising a compressive dielectric material, an...
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12,205,900
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Jan 21, 2025
Micron Technology, Inc.
Jivaan Kishore Jhothiraman
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Substrate processing apparatus and method of manufacturing semicond...
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12,203,167
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Jan 21, 2025
Kokusai Electric Corporation
Hidetoshi Mimura
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Epitaxial oxide materials, structures, and devices
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12,206,048
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Jan 21, 2025
SILANNA UV TECHNOLOGIES PTE LTD
Petar Atanackovic
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Semiconductor device and method for manufacturing same
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12,207,470
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Jan 21, 2025
Kioxia Corporation
Shinya Arai
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Silicon nitride films having reduced interfacial strain
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12,198,926
Issue date
Jan 14, 2025
PSIQUANTUM, CORP.
Yong Liang
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Gate line plug structures for advanced integrated circuit structure...
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12,199,167
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Jan 14, 2025
Intel Corporation
Byron Ho
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Low resistance interconnect structure for semiconductor device
Patent number
12,199,036
Issue date
Jan 14, 2025
Taiwan Semiconductor Manufacturing Co., Ltd
Jason Huang
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Integrated circuit comprising trenches formed in a substrate
Patent number
12,198,973
Issue date
Jan 14, 2025
STMicroelectronics (Rousset) SAS
Franck Julien
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Semiconductor device with multi-layer etch stop structure
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12,198,979
Issue date
Jan 14, 2025
Taiwan Semiconductor Manufacturing Company, Ltd
Po-Cheng Shih
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Plugs for interconnect lines for advanced integrated circuit struct...
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12,199,168
Issue date
Jan 14, 2025
Intel Corporation
Andrew W. Yeoh
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Switching device and method for manufacturing the same
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12,191,150
Issue date
Jan 7, 2025
Denso Corporation
Hidemoto Tomita
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Method for forming a semiconductor structure
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12,191,377
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Jan 7, 2025
United Semiconductor (Xiamen) Co., Ltd.
Jun Wu
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Thin film transistor including a hydrogen-blocking dielectric barri...
Patent number
12,183,825
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Dec 31, 2024
Taiwan Semiconductor Manufacturing Company Limited
Neil Quinn Murray
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Semiconductor device and manufacturing method thereof
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12,183,832
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Dec 31, 2024
Semiconductor Energy Laboratory Co., Ltd.
Kengo Akimoto
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Integrated assemblies having vertically-spaced channel material seg...
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12,185,544
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Dec 31, 2024
John D. Hopkins
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Source/drain feature separation structure
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12,178,032
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Dec 24, 2024
Taiwan Semiconductor Manufacturing Co., Ltd
Wen-Chun Keng
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Methods and apparatuses for forming semiconductor devices containin...
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12,176,203
Issue date
Dec 24, 2024
SanDisk Technologies LLC
Fei Zhou
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Metal oxide composite as etch stop layer
Patent number
12,176,247
Issue date
Dec 24, 2024
Taiwan Semiconductor Manufacturing Co., Ltd
Kai-Fang Cheng
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Additive process for circular printing
Patent number
12,172,374
Issue date
Dec 24, 2024
Texas Instruments Incorporated
Daniel Lee Revier
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Cyclic low temperature film growth processes
Patent number
12,176,204
Issue date
Dec 24, 2024
Tokyo Electron Limited
Jianping Zhao
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Deposition method and plasma processing apparatus
Patent number
12,170,198
Issue date
Dec 17, 2024
Tokyo Electron Limited
Hiroyuki Matsuura
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ALD PULSE SEQUENCE ENGINEERING FOR IMPROVED CONFORMALITY FOR LOW TE...
Publication number
20250054751
Publication date
Feb 13, 2025
LAM RESEARCH CORPORATION
Awnish Gupta
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SYNAPTIC TRANSISTOR
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20250056845
Publication date
Feb 13, 2025
Kookmin University Industry Academy Cooperation Foundation
Dae Hwan KIM
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MEMORY ARRAYS AND METHODS USED IN FORMING A MEMORY ARRAY COMPRISING...
Publication number
20250056800
Publication date
Feb 13, 2025
Lodestar Licensing Group LLC
Jordan D. Greenlee
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EPITAXIAL OXIDE MATERIALS, STRUCTURES, AND DEVICES
Publication number
20250056927
Publication date
Feb 13, 2025
Silanna UV Technologies Pte Ltd
Petar Atanackovic
H01 - BASIC ELECTRIC ELEMENTS
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ADHESION IMPROVEMENTS IN METAL-CONTAINING HARDMASKS
Publication number
20250054748
Publication date
Feb 13, 2025
Applied Materials, Inc.
Guangyan Zhong
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SUBSTRATE PROCESSING METHOD
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20250054753
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Feb 13, 2025
ASM IP HOLDING B.V.
KiHun Kim
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SEMICONDUCTOR PHOTORESIST COMPOSITION AND METHOD OF FORMING PATTERN...
Publication number
20250054758
Publication date
Feb 13, 2025
Samsung SDI Co., Ltd.
Dong Wan RYU
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CONFORMAL DEPOSITION OF SILICON NITRIDE
Publication number
20250054747
Publication date
Feb 13, 2025
LAM RESEARCH CORPORATION
Awnish Gupta
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
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METHOD FOR FABRICATING A SEMICONDUCTOR DEVICE
Publication number
20250054766
Publication date
Feb 13, 2025
Infineon Technologies Austria AG
Clemens Ostermaier
H01 - BASIC ELECTRIC ELEMENTS
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SUBSTRATE PROCESSING APPARATUS, METHOD OF PROCESSING SUBSTRATE, AND...
Publication number
20250043424
Publication date
Feb 6, 2025
Kokusai Electric Corporation
Atsushi HIRANO
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Atomic Layer Deposition of Passivation Layer
Publication number
20250046603
Publication date
Feb 6, 2025
TOKYO ELECTRON LIMITED
Du Zhang
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PECVD Method and Apparatus
Publication number
20250046604
Publication date
Feb 6, 2025
SPTS TECHNOLOGIES LIMITED
Giorgos ANTONIOU
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REACTIVE-ION DEPOSITION PROCESSES FOR DIELECTRIC MATERIAL FORMATION
Publication number
20250046602
Publication date
Feb 6, 2025
Applied Materials, Inc.
Bhaskar Jyoti Bhuyan
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SUBSTRATE PROCESSING METHOD
Publication number
20250046607
Publication date
Feb 6, 2025
TOKYO ELECTRON LIMITED
Takashi FUSE
H01 - BASIC ELECTRIC ELEMENTS
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DEPOSITION OF HIGH COMPRESSIVE STRESS THERMALLY STABLE NITRIDE FILM
Publication number
20250037992
Publication date
Jan 30, 2025
LAM RESEARCH CORPORATION
Soumana HAMMA
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SEAM REMOVAL IN HIGH ASPECT RATIO GAP-FILL
Publication number
20250037996
Publication date
Jan 30, 2025
Applied Materials, Inc.
Qinghua Zhao
H01 - BASIC ELECTRIC ELEMENTS
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METHOD FOR MANUFACTURING SILICON NITROGENOUS FILM ON SUBSTRATE HAVI...
Publication number
20250037990
Publication date
Jan 30, 2025
Merck Patent GmbH
ISSEI SAKURAI
H01 - BASIC ELECTRIC ELEMENTS
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DEPOSITION OF OXIDE THIN FILMS
Publication number
20250037995
Publication date
Jan 30, 2025
ASM IP HOLDING B.V.
Suvi P. Haukka
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
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SEQUENTIAL PLASMA AND THERMAL TREATMENT
Publication number
20250037989
Publication date
Jan 30, 2025
Applied Materials, Inc.
Ning Li
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METHOD FOR FORMING SILICON NITRIDE FILM SELECTIVELY ON SIDEWALLS OF...
Publication number
20250037993
Publication date
Jan 30, 2025
ASM IP HOLDING B.V.
Tomomi Ban
H01 - BASIC ELECTRIC ELEMENTS
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METHOD OF PROCESSING SUBSTRATE, METHOD OF MANUFACTURING SEMICONDUCT...
Publication number
20250022702
Publication date
Jan 16, 2025
Kokusai Electric Corporation
Masayuki ASAI
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Assemblies Having Conductive Structures Along Pillars of Semiconduc...
Publication number
20250022955
Publication date
Jan 16, 2025
Micron Technology, Inc.
Sanh D. Tang
H01 - BASIC ELECTRIC ELEMENTS
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CONTACT OVER ACTIVE GATE STRUCTURES FOR ADVANCED INTEGRATED CIRCUIT...
Publication number
20250022939
Publication date
Jan 16, 2025
Intel Corporation
Andrew W. Yeoh
H01 - BASIC ELECTRIC ELEMENTS
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FILM-FORMING METHOD AND FILM-FORMING APPARATUS
Publication number
20250019815
Publication date
Jan 16, 2025
TOKYO ELECTRON LIMITED
Shimon OTSUKI
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METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, SUBSTRATE PROCESSING...
Publication number
20250022705
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Jan 16, 2025
Kokusai Electric Corporation
Takashi YAHATA
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SUBSTRATE PROCESSING APPARATUS, SUBSTRATE PROCESSING METHOD, METHOD...
Publication number
20250011931
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Jan 9, 2025
Kokusai Electric Corporation
Shun MATSUI
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METHOD OF PROCESSING SUBSTRATE, METHOD OF MANUFACTURING SEMICONDUCT...
Publication number
20250014891
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Jan 9, 2025
Kokusai Electric Corporation
Hiroyuki KOIDE
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Substrate Processing Method, Method of Manufacturing Semiconductor...
Publication number
20250014894
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Jan 9, 2025
Kokusai Electric Corporation
Hiroki HATTA
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SELECTIVE PROCESSING WITH ETCH RESIDUE-BASED INHIBITORS
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20250014904
Publication date
Jan 9, 2025
LAM RESEARCH CORPORATION
Kashish Sharma
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SUBSTRATE PROCESSING APPARATUS, METHOD OF PROCESSING SUBSTRATE, MET...
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20250014930
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Jan 9, 2025
Kokusai Electric Corporation
Tsukasa KAMAKURA
H01 - BASIC ELECTRIC ELEMENTS