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the material being a silicon nitride not containing oxygen
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Methods for patterning a silicon oxide-silicon nitride-silicon oxid...
Patent number
12,334,333
Issue date
Jun 17, 2025
Taiwan Semiconductor Manufacturing Company Limited
Yi-Ren Wang
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Inner spacers for gate-all-around semiconductor devices
Patent number
12,336,214
Issue date
Jun 17, 2025
Taiwan Semiconductor Manufacturing Co., Ltd
Yu-Yun Peng
H01 - BASIC ELECTRIC ELEMENTS
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Structures and methods for fabricating staircase regions of a three...
Patent number
12,334,399
Issue date
Jun 17, 2025
Yangtze Memory Technologies Co., Ltd.
Xiongyu Wang
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Methods and apparatus for selective etch stop capping and selective...
Patent number
12,334,394
Issue date
Jun 17, 2025
Applied Materials, Inc.
Suketu Parikh
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Etching gas mixture and method of manufacturing integrated circuit...
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12,327,731
Issue date
Jun 10, 2025
Samsung Electronics Co., Ltd.
Changgil Son
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Ultraviolet radiation activated atomic layer deposition
Patent number
12,327,721
Issue date
Jun 10, 2025
Taiwan Semiconductor Manufacturing Co., Ltd
Christine Y. Ouyang
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Method of processing substrate, substrate processing apparatus, rec...
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12,327,720
Issue date
Jun 10, 2025
Kokusai Electric Corporation
Toshiyuki Kikuchi
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Semiconductor device and method for manufacturing semiconductor device
Patent number
12,328,908
Issue date
Jun 10, 2025
Semiconductor Energy Laboratory Co., Ltd.
Tetsuya Kakehata
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Thin film deposition process
Patent number
12,322,591
Issue date
Jun 3, 2025
ASM IP Holding B.V.
Naoki Inoue
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Epitaxial oxide transistor
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12,324,276
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Jun 3, 2025
SILANNA UV TECHNOLOGIES PTE LTD
Petar Atanackovic
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Selective passivation and selective deposition
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12,322,593
Issue date
Jun 3, 2025
ASM IP Holding B.V.
Jan Willem Hub Maes
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Method of fabricating Fin-type field-effect transistor device havin...
Patent number
12,324,224
Issue date
Jun 3, 2025
Taiwan Semiconductor Manufacturing Company, Ltd
Chun-Hung Chen
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Semiconductor devices and methods
Patent number
12,322,647
Issue date
Jun 3, 2025
Taiwan Semiconductor Manufacturing Co., Ltd
Yu-Kai Lin
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Vertical thin-film transistor and application as bit-line connector...
Patent number
12,324,159
Issue date
Jun 3, 2025
SUNRISE MEMORY CORPORATION
Tianhong Yan
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Method of manufacturing a semiconductor device and a semiconductor...
Patent number
12,315,864
Issue date
May 27, 2025
Taiwan Semiconductor Manufacturing Company, Ltd
Chia-Chi Yu
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Methods of highly selective silicon oxide removal
Patent number
12,315,736
Issue date
May 27, 2025
Applied Materials, Inc.
Lala Zhu
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Method for manufacturing metal oxynitride film
Patent number
12,315,717
Issue date
May 27, 2025
Semiconductor Energy Laboratory Co., Ltd.
Kazuki Tanemura
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Substrate processing method, method of manufacturing semiconductor...
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12,315,719
Issue date
May 27, 2025
Kokusai Electric Corporation
Yoshiro Hirose
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Semiconductor structure having high breakdown voltage etch-stop layer
Patent number
12,315,812
Issue date
May 27, 2025
Taiwan Semiconductor Manufacturing Co., Ltd
Joung-Wei Liou
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Fin field-effect transistor device having contact plugs with re-ent...
Patent number
12,310,051
Issue date
May 20, 2025
Taiwan Semiconductor Manufacturing Company, Ltd
Yu-Lien Huang
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3D semiconductor device and array layout with isolated conductive p...
Patent number
12,310,023
Issue date
May 20, 2025
Macronix International Co., Ltd.
Hang-Ting Lue
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Plasma processing method and plasma processing apparatus
Patent number
12,308,241
Issue date
May 20, 2025
Tokyo Electron Limited
Masahiro Tabata
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Semiconductor devices having fins and multiple isolation regions
Patent number
12,300,696
Issue date
May 13, 2025
Taiwan Semiconductor Manufacturing Company, Ltd
Chia-Sheng Fan
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Warpage-reducing semiconductor structure and fabricating method of...
Patent number
12,300,633
Issue date
May 13, 2025
United Microelectronics Corp.
Da-Jun Lin
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Conformal low temperature hermetic dielectric diffusion barriers
Patent number
12,300,537
Issue date
May 13, 2025
Intel Corporation
Sean King
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FinFET structure with a composite stress layer and reduced fin buck...
Patent number
12,302,611
Issue date
May 13, 2025
Taiwan Semiconductor Manufacturing Co., Ltd
Wei-Jen Lai
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UV cure for local stress modulation
Patent number
12,300,489
Issue date
May 13, 2025
Lam Research Corporation
Anirvan Sircar
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Deposition of semiconductor integration films
Patent number
12,300,491
Issue date
May 13, 2025
Applied Materials, Inc.
Lakmal Charidu Kalutarage
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Deposition of organic films
Patent number
12,300,505
Issue date
May 13, 2025
ASM IP Holding B.V.
Eva E. Tois
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High resistivity silicon-on-insulator substrate comprising an isola...
Patent number
12,300,535
Issue date
May 13, 2025
GlobalWafers Co., Ltd.
Igor Peidous
H01 - BASIC ELECTRIC ELEMENTS
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last 30 patents
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TRENCH CONTACT STRUCTURES FOR ADVANCED INTEGRATED CIRCUIT STRUCTURE...
Publication number
20250194201
Publication date
Jun 12, 2025
Intel Corporation
Subhash M. JOSHI
H01 - BASIC ELECTRIC ELEMENTS
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SEMICONDUCTOR DEVICE HAVING STI REGION
Publication number
20250194085
Publication date
Jun 12, 2025
Micron Technology, Inc.
Kunihiro Tsubomi
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SELF-ALIGNED INNER SPACER ON GATE-ALL-AROUND STRUCTURE AND METHODS...
Publication number
20250194203
Publication date
Jun 12, 2025
Taiwan Semiconductor Manufacturing Co., Ltd.
Tsungyu Hung
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UNIFICATION OF BACKSIDE STRESS MITIGATION WITH FRONTSIDE PROTECTION...
Publication number
20250194165
Publication date
Jun 12, 2025
Applied Materials, Inc.
Changwoo Sun
H01 - BASIC ELECTRIC ELEMENTS
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DIELECTRIC STRUCTURE, SEMICONDUCTOR DEVICE STRUCTURE AND MANUFACTUR...
Publication number
20250194192
Publication date
Jun 12, 2025
ENKRIS SEMICONDUCTOR, INC.
Kai CHENG
H01 - BASIC ELECTRIC ELEMENTS
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Metal-Insulator-Metal Structure
Publication number
20250192026
Publication date
Jun 12, 2025
Taiwan Semiconductor Manufacturing Co., Ltd.
Yuan-Yang Hsiao
H01 - BASIC ELECTRIC ELEMENTS
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METHOD OF FORMING SILICON NITRIDE FILM AND FILM FORMING APPARATUS
Publication number
20250179625
Publication date
Jun 5, 2025
TOKYO ELECTRON LIMITED
Munehito KAGAYA
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
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ORGANOAMINOSILANE PRECURSORS AND METHODS FOR DEPOSITING FILMS COMPR...
Publication number
20250183029
Publication date
Jun 5, 2025
VERSUM MATERIALS US, LLC
Mark Leonard O'Neill
C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
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PLASMA PROCESS FOR ETCHING A MULTILAYER STACK
Publication number
20250183046
Publication date
Jun 5, 2025
TOKYO ELECTRON LIMITED
Jason Marion
H01 - BASIC ELECTRIC ELEMENTS
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ROBUST ONO FILMS AND METHODS OF MAKING THEREOF
Publication number
20250185263
Publication date
Jun 5, 2025
TEXAS INSTRUMENTS INCORPORATED
Saiful Islam
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
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INTEGRATED CIRCUIT WITH SILICIDE FORMATION BLOCKING
Publication number
20250183039
Publication date
Jun 5, 2025
TEXAS INSTRUMENTS INCORPORATED
Brian Ellingwood
H01 - BASIC ELECTRIC ELEMENTS
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SURFACE TREATMENT METHOD, METHOD FOR PRODUCING SEMICONDUCTOR SUBSTR...
Publication number
20250183044
Publication date
Jun 5, 2025
FUJIMI INCORPORATED
Tsutomu YOSHINO
H01 - BASIC ELECTRIC ELEMENTS
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METHOD FOR TREATING OBJECT TO BE TREATED, TREATMENT LIQUID, AND MET...
Publication number
20250183050
Publication date
Jun 5, 2025
FUJIFILM CORPORATION
Atsushi Mizutani
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
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CIRCUIT DIE WITH CHAMFERED PASSIVATION LAYER
Publication number
20250183108
Publication date
Jun 5, 2025
NXP USA, Inc.
Darrell Glenn Hill
H01 - BASIC ELECTRIC ELEMENTS
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TOPOLOGY SELECTIVE AND SACRIFICIAL SILICON NITRIDE LAYER FOR GENERA...
Publication number
20250185338
Publication date
Jun 5, 2025
Taiwan Semiconductor Manufacturing Company, Ltd.
Tzu-Yang HO
H01 - BASIC ELECTRIC ELEMENTS
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TYPE III-V SEMICONDUCTOR DEVICE WITH STRUCTURED PASSIVATION
Publication number
20250176206
Publication date
May 29, 2025
Infineon Technologies Austria AG
Simone Lavanga
H01 - BASIC ELECTRIC ELEMENTS
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HIGH QUALITY NITRIDE AND OXIDE FABRICATION AND SYSTEM
Publication number
20250174455
Publication date
May 29, 2025
TEXAS INSTRUMENTS INCORPORATED
Saiful Islam
H01 - BASIC ELECTRIC ELEMENTS
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SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING SYSTEM
Publication number
20250174462
Publication date
May 29, 2025
TOKYO ELECTRON LIMITED
Takuya SEINO
H01 - BASIC ELECTRIC ELEMENTS
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SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
Publication number
20250169140
Publication date
May 22, 2025
UNITED MICROELECTRONICS CORP.
Chia-Ming Kuo
H01 - BASIC ELECTRIC ELEMENTS
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PROTECTIVE PASSIVATION LAYER FOR MAGNETIC TUNNEL JUNCTIONS
Publication number
20250169372
Publication date
May 22, 2025
Taiwan Semiconductor Manufacturing Company, Ltd.
Jodi Mari Iwata
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SURFACE OXIDATION LAYER FOR METAL VOIDING REDUCTION
Publication number
20250167086
Publication date
May 22, 2025
Taiwan Semiconductor Manufacturing Company, Ltd.
Man-Yun Wu
H01 - BASIC ELECTRIC ELEMENTS
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SILICON NITRIDE FILMS HAVING REDUCED INTERFACIAL STRAIN
Publication number
20250166988
Publication date
May 22, 2025
Psiquantum, Corp.
Yong Liang
H01 - BASIC ELECTRIC ELEMENTS
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ELECTRONIC DEVICES COMPRISING A COMPRESSIVE DIELECTRIC MATERIAL
Publication number
20250157935
Publication date
May 15, 2025
Micron Technology, Inc.
Jivaan Kishore Jhothiraman
H01 - BASIC ELECTRIC ELEMENTS
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METHODS AND APPARATUS UTILIZING INDIUM-BASED PRECURSORS FOR INTEGRA...
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20250157808
Publication date
May 15, 2025
Intel Corporation
Charles Mokhtarzadeh
H01 - BASIC ELECTRIC ELEMENTS
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METHODS FOR PATTERNING A SEMICONDUCTOR SUBSTRATE USING METALATE SAL...
Publication number
20250157810
Publication date
May 15, 2025
TOKYO ELECTRON LIMITED
Paul Abel
H01 - BASIC ELECTRIC ELEMENTS
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SILICON NITRIDE FILM FORMATION METHOD AND PLASMA PROCESSING APPARATUS
Publication number
20250154649
Publication date
May 15, 2025
TOKYO ELECTRON LIMITED
Kenichi KOTE
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SUBSTRATE PROCESSING METHOD
Publication number
20250157811
Publication date
May 15, 2025
ASM IP HOLDING B.V.
Jeonghoon Jang
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SEMICONDUCTOR DEVICE
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20250157852
Publication date
May 15, 2025
Samsung Electronics Co., Ltd.
Hyunchul LEE
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THIN-FILM FORMING COMPOSITION INCLUDING ALUMINUM COMPOUND, METHOD O...
Publication number
20250157809
Publication date
May 15, 2025
Samsung Electronics Co., Ltd.
Daeun Kim
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CONFORMAL BORON DOPING METHOD FOR THREE-DIMENSIONAL STRUCTURE AND U...
Publication number
20250149339
Publication date
May 8, 2025
Beijing Superstring Academy of Memory Technology
Jianfeng Gao
H01 - BASIC ELECTRIC ELEMENTS