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the material being a silicon nitride not containing oxygen
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Film forming method and film forming apparatus
Patent number
11,970,768
Issue date
Apr 30, 2024
Tokyo Electron Limited
Hideomi Hane
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Devices including vertical transistors, and related methods
Patent number
11,973,145
Issue date
Apr 30, 2024
Micron Technology, Inc.
Durai Vishak Nirmal Ramaswamy
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Atomic layer deposition of metal films
Patent number
11,970,776
Issue date
Apr 30, 2024
Lam Research Corporation
Joshua Collins
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Method of forming asymmetric differential spacers for optimized MOS...
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11,973,130
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Apr 30, 2024
X-FAB France SAS
Sébastien Daveau
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3D NAND gate stack reinforcement
Patent number
11,967,524
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Apr 23, 2024
Applied Materials, Inc.
Praket Prakash Jha
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Substrate processing apparatus and method of manufacturing semicond...
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11,967,501
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Apr 23, 2024
Kokusai Electric Corporation
Hiroaki Hiramatsu
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Amorphous layers for reducing copper diffusion and method forming same
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11,967,522
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Apr 23, 2024
Taiwan Semiconductor Manufacturing Co., Ltd
Jyh-Nan Lin
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Cleaning method, method of manufacturing semiconductor device, and...
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11,965,240
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Apr 23, 2024
Kokusai Electric Corporation
Keigo Nishida
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Plasma generating device, substrate processing apparatus, and metho...
Patent number
11,967,490
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Apr 23, 2024
Kokusai Electric Corporation
Akihiro Sato
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Method for making high-voltage thick gate oxide
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11,967,520
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Apr 23, 2024
Hua Hong Semiconductor (Wuxi) Limited
Junwen Liu
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Method for fabricating layer structure having target topological pr...
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11,961,741
Issue date
Apr 16, 2024
ASM IP Holding B.V.
Eiichiro Shiba
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Method and apparatus for controlling stress variation in a material...
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11,961,722
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Apr 16, 2024
SPTS Technologies Limited
Anthony Wilby
B81 - MICRO-STRUCTURAL TECHNOLOGY
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Cyclic plasma processing
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11,961,735
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Apr 16, 2024
Tokyo Electron Limited
Yun Han
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Negative capacitance transistor with external ferroelectric structure
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11,961,897
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Apr 16, 2024
Taiwan Semiconductor Manufacturing Co., Ltd
Chi-Hsing Hsu
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Display substrate and manufacturing method therefor, and display de...
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11,961,848
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Apr 16, 2024
Hefei Xinsheng Optoelectronics Technology Co., Ltd.
Jun Liu
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Controlling threshold voltages through blocking layers
Patent number
11,961,732
Issue date
Apr 16, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Chia-Ching Lee
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Semiconductor structure having high breakdown voltage etch-stop layer
Patent number
11,961,803
Issue date
Apr 16, 2024
Taiwan Semiconductor Manufacturing Co., Ltd
Joung-Wei Liou
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Semiconductor device and method for manufacturing semiconductor device
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11,961,918
Issue date
Apr 16, 2024
Semiconductor Energy Laboratory Co., Ltd.
Yasutaka Nakazawa
G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
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Substrate processing apparatus, substrate retainer and method of ma...
Patent number
11,961,715
Issue date
Apr 16, 2024
Kokusai Electric Corporation
Daisuke Hara
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Precursor supply unit, substrate processing system, and method of f...
Patent number
11,959,170
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Apr 16, 2024
Samsung Electronics Co., Ltd.
Soyoung Lee
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Semiconductor devices and methods of manufacture
Patent number
11,955,370
Issue date
Apr 9, 2024
Taiwan Semiconductor Manufacturing Co., Ltd
Bo-Cyuan Lu
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Dual metal gate structure having portions of metal gate layers in c...
Patent number
11,955,532
Issue date
Apr 9, 2024
Intel Corporation
Jeffrey S. Leib
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Semiconductor device
Patent number
11,955,550
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Apr 9, 2024
Semiconductor Manufacturing International (Shanghai) Corporation
Fei Zhou
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Heterogeneous metal line compositions for advanced integrated circu...
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11,955,534
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Apr 9, 2024
Intel Corporation
Andrew W. Yeoh
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Deposition method
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11,952,661
Issue date
Apr 9, 2024
Tokyo Electron Limited
Hitoshi Kato
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Method of forming silicon nitride films using microwave plasma
Patent number
11,955,331
Issue date
Apr 9, 2024
Applied Materials, Inc.
Hanhong Chen
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Laminate of aluminum nitride single-crystal substrate
Patent number
11,952,677
Issue date
Apr 9, 2024
Tokuyama Corporation
Masao Ariyuki
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Semiconductor structure and method of forming the same
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11,955,522
Issue date
Apr 9, 2024
Vanguard International Semiconductor Corporation
Cheng-Wei Chou
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Method of etching and apparatus for plasma processing
Patent number
11,955,342
Issue date
Apr 9, 2024
Tokyo Electron Limited
Masanori Hosoya
H01 - BASIC ELECTRIC ELEMENTS
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Selective deposition of barrier layer
Patent number
11,948,834
Issue date
Apr 2, 2024
Taiwan Semiconductor Manufacturing Co., Ltd
Hsin-Yen Huang
H01 - BASIC ELECTRIC ELEMENTS
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SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
Publication number
20240145527
Publication date
May 2, 2024
SK HYNIX INC.
Jun Hyuk SEO
G06 - COMPUTING CALCULATING COUNTING
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Fin Field-Effect Transistor Device Having Contact Plugs with Re-Ent...
Publication number
20240145597
Publication date
May 2, 2024
Taiwan Semiconductor Manufacturing Co., Ltd.
Yu-Lien Huang
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SIN GAP FILL VIA NUCLEATION INHIBITION
Publication number
20240145235
Publication date
May 2, 2024
Applied Materials, Inc.
Zeqing SHEN
H01 - BASIC ELECTRIC ELEMENTS
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PROCESSING METHOD, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, PR...
Publication number
20240145233
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May 2, 2024
Kokusai Electric Corporation
Daigo YAMAGUCHI
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TRANSISTOR STRUCTURE AND METHOD FOR FABRICATING THE SAME
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20240145559
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May 2, 2024
Industrial Technology Research Institute
Chang-Yan HSIEH
H01 - BASIC ELECTRIC ELEMENTS
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CRYSTALLOGRAPHIC- AND OXYNITRIDE-BASED SURFACE
Publication number
20240141519
Publication date
May 2, 2024
The Regents of the University of Michigan
Francesca Maria Toma
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
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INSERTING INHIBITION LAYER FOR INDUCING ANTIFERROELECTRICITY TO FER...
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20240145571
Publication date
May 2, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Po-Ting Lin
H01 - BASIC ELECTRIC ELEMENTS
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INNER SPACERS FOR GATE-ALL-AROUND SEMICONDUCTOR DEVICES
Publication number
20240136438
Publication date
Apr 25, 2024
Taiwan Semiconductor Manufacturing Co., Ltd.
Yu-Yun Peng
H01 - BASIC ELECTRIC ELEMENTS
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METHOD FOR PREPARING A SURFACE FOR DIRECT-BONDING
Publication number
20240136196
Publication date
Apr 25, 2024
ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
Jeremy Alfred Theil
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METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
Publication number
20240128351
Publication date
Apr 18, 2024
Mitsubishi Electric Corporation
Hiroyuki OKAZAKI
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METHOD OF PRODUCING RAW MATERIAL SOLUTION, METHOD OF FILM-FORMING A...
Publication number
20240124974
Publication date
Apr 18, 2024
Shin-Etsu Chemical Co., Ltd.
Takenori WATABE
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SEMICONDUCTOR MEMORY DEVICE AND METHOD OF MANUFACTURING THE SAME
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20240130135
Publication date
Apr 18, 2024
KIOXIA Corporation
Kyungmin JANG
H01 - BASIC ELECTRIC ELEMENTS
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VOLTAGE REGULATOR CIRCUIT INCLUDING ONE OR MORE THIN-FILM TRANSISTORS
Publication number
20240128269
Publication date
Apr 18, 2024
Intel Corporation
Abhishek A. SHARMA
G06 - COMPUTING CALCULATING COUNTING
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METHOD OF FABRICATING A CAPACITOR
Publication number
20240128311
Publication date
Apr 18, 2024
STMicroelectronics (Tours) SAS
Mohamed Boufnichel
H01 - BASIC ELECTRIC ELEMENTS
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METHOD FOR FABRICATING LAYER STRUCTURE HAVING TARGET TOPOLOGICAL PR...
Publication number
20240128090
Publication date
Apr 18, 2024
ASM IP HOLDING B.V.
Eiichiro Shiba
H01 - BASIC ELECTRIC ELEMENTS
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GATE-ALL-AROUND INTEGRATED CIRCUIT STRUCTURES FABRICATED USING ALTE...
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20240120335
Publication date
Apr 11, 2024
Intel Corporation
Sudipto NASKAR
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BACKSIDE WAFER TREATMENTS TO REDUCE DISTORTIONS AND OVERLAY ERRORS...
Publication number
20240113039
Publication date
Apr 4, 2024
Intel Corporation
Tayseer Mahdi
H01 - BASIC ELECTRIC ELEMENTS
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VARIABLE SELECTIVE ETCHING TECHNOLOGY FOR THICK SOI DEVICES
Publication number
20240112914
Publication date
Apr 4, 2024
University of Electronic Science and Technology of China
Bo ZHANG
H01 - BASIC ELECTRIC ELEMENTS
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ADDITIVE PROCESS FOR CIRCULAR PRINTING
Publication number
20240109247
Publication date
Apr 4, 2024
TEXAS INSTRUMENTS INCORPORATED
Daniel Lee Revier
B22 - CASTING POWDER METALLURGY
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SELECTIVE OXIDATION OF A SUBSTRATE
Publication number
20240112903
Publication date
Apr 4, 2024
Applied Materials, Inc.
Hansel Lo
H01 - BASIC ELECTRIC ELEMENTS
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Tuning Threshold Voltage in Field-Effect Transistors
Publication number
20240105813
Publication date
Mar 28, 2024
Taiwan Semiconductor Manufacturing Co., LTD
Hsueh Wen Tsau
H01 - BASIC ELECTRIC ELEMENTS
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CORRECTION OF GLOBAL CURVATURE DURING STRESS MANAGEMENT
Publication number
20240105641
Publication date
Mar 28, 2024
Applied Materials, Inc.
Pradeep K. SUBRAHMANYAN
H01 - BASIC ELECTRIC ELEMENTS
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Method of Improving Package Creepage Distance
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20240105447
Publication date
Mar 28, 2024
NEXPERIA B.V.
Hans-Juergen Funke
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METHOD FOR REDUCING CONTACT RESISTANCE
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20240105464
Publication date
Mar 28, 2024
Shanghai Huali Integrated Circuit Corporation
Wensheng Xu
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Methods for Forming Low Resistivity Contacts
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20240105444
Publication date
Mar 28, 2024
Applied Materials, Inc.
Jiang LU
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GROUP III-V SEMICONDUCTOR DEVICE AND METHOD OF FABRICATION OF SAME...
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20240105450
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Mar 28, 2024
TEXAS INSTRUMENTS INCORPORATED
Yoganand Saripalli
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FINFET STRUCTURE AND METHOD WITH REDUCED FIN BUCKLING
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20240097033
Publication date
Mar 21, 2024
Taiwan Semiconductor Manufacturing Co., Ltd.
Wei-Jen Lai
H01 - BASIC ELECTRIC ELEMENTS
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SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
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20240096990
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Mar 21, 2024
Fuji Electric Co., Ltd.
Tomohiro MORIYA
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FILM DEPOSITION APPARATUS FOR FINE PATTERN FORMING
Publication number
20240096595
Publication date
Mar 21, 2024
TOKYO ELECTRON LIMITED
Kazuhide HASEBE
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Deposition of Thick Layers of Silicon Dioxide
Publication number
20240096616
Publication date
Mar 21, 2024
SPTS TECHNOLOGIES LIMITED
Matt Edmonds
H01 - BASIC ELECTRIC ELEMENTS