the material being a silicon nitride not containing oxygen

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H01L21/0217

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/0217the material being a silicon nitride not containing oxygen

Industries

Patents Grantslast 30 patents

Information Patent Grant
Deposition method and plasma processing apparatus
- Patent number 12,170,198
- Issue date Dec 17, 2024
- Tokyo Electron Limited
- Hiroyuki Matsuura
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Methods for forming a semiconductor device structure and related se...
- Patent number 12,166,099
- Issue date Dec 10, 2024
- ASM IP Holding B.V.
- Chiyu Zhu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Semiconductor device
- Patent number 12,166,131
- Issue date Dec 10, 2024
- Japan Display Inc.
- Hajime Watakabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated assemblies having thicker semiconductor material along o...
- Patent number 12,167,602
- Issue date Dec 10, 2024
- Kunal R. Parekh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dynamic multi zone flow control for a processing system
- Patent number 12,159,785
- Issue date Dec 3, 2024
- Applied Materials, Inc.
- Daemian Raj Benjamin Raj
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Deposition of oxide thin films
- Patent number 12,154,785
- Issue date Nov 26, 2024
- ASM IP Holding B.V.
- Suvi P. Haukka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dry etching method and method for producing semiconductor device
- Patent number 12,154,791
- Issue date Nov 26, 2024
- Central Glass Company, Limited
- Hiroyuki Oomori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
GaN/two-dimensional AlN heterojunction rectifier on silicon substra...
- Patent number 12,154,990
- Issue date Nov 26, 2024
- South China University of Technology
- Wenliang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device including isolation st...
- Patent number 12,154,821
- Issue date Nov 26, 2024
- NANYA TECHNOLOGY CORPORATION
- Ying-Cheng Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Epitaxial oxide materials, structures, and devices
- Patent number 12,155,009
- Issue date Nov 26, 2024
- SILANNA UV TECHNOLOGIES PTE LTD
- Petar Atanackovic
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silicon oxide layer for oxidation resistance and method forming same
- Patent number 12,148,652
- Issue date Nov 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wan-Yi Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device and semiconductor devices
- Patent number 12,148,656
- Issue date Nov 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsiao-Min Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structures and manufacturing methods thereof
- Patent number 12,148,613
- Issue date Nov 19, 2024
- ENKRIS SEMICONDUCTOR, INC.
- Kai Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Boron nitride layer, apparatus including the same, and method of fa...
- Patent number 12,139,814
- Issue date Nov 12, 2024
- Samsung Electronics Co., Ltd.
- Changseok Lee
- C30 - CRYSTAL GROWTH
Information Patent Grant
Active device substrate and fabrication method of active device sub...
- Patent number 12,142,687
- Issue date Nov 12, 2024
- Au Optronics Corporation
- Chen-Shuo Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sequential plasma and thermal treatment
- Patent number 12,142,475
- Issue date Nov 12, 2024
- Applied Materials, Inc.
- Ning Li
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Seam removal in high aspect ratio gap-fill
- Patent number 12,142,480
- Issue date Nov 12, 2024
- Applied Materials, Inc.
- Qinghua Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Transistor structures having conductive structures along pillars of...
- Patent number 12,142,680
- Issue date Nov 12, 2024
- Micron Technology, Inc.
- Sanh D. Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Staircase etch control in forming three-dimensional memory device
- Patent number 12,142,575
- Issue date Nov 12, 2024
- Yangtza Memory Technologies Co., Ltd.
- Zhenyu Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pre-deposition treatment for FET technology and devices formed thereby
- Patent number 12,142,531
- Issue date Nov 12, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Cheng-Yen Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chalcogen precursors for deposition of silicon nitride
- Patent number 12,142,477
- Issue date Nov 12, 2024
- Applied Materials, Inc.
- Chandan Kr Barik
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Apparatus and method for cleaning reaction vessel for processing su...
- Patent number 12,139,787
- Issue date Nov 12, 2024
- Kokusai Electric Corporation
- Shinya Ebata
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of processing substrate, method of manufacturing semiconduct...
- Patent number 12,142,476
- Issue date Nov 12, 2024
- Kokusai Electric Corporation
- Masayuki Asai
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Contact over active gate structures for advanced integrated circuit...
- Patent number 12,142,667
- Issue date Nov 12, 2024
- Intel Corporation
- Andrew W. Yeoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device, substrate processing...
- Patent number 12,136,545
- Issue date Nov 5, 2024
- Kokusai Electric Corporation
- Takashi Yahata
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Semiconductor device and manufacturing method of semiconductor device
- Patent number 12,136,663
- Issue date Nov 5, 2024
- Semiconductor Energy Laboratory Co., Ltd.
- Shunpei Yamazaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heterostructure including alternating sets of channel and barrier l...
- Patent number 12,136,668
- Issue date Nov 5, 2024
- ENKRIS SEMICONDUCTOR, INC.
- Kai Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Synaptic transistor with long-term and short-term memory
- Patent number 12,132,110
- Issue date Oct 29, 2024
- Kookmin University Industry Academy Cooperation Foundation
- Dae Hwan Kim
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Methods for depositing blocking layers on metal surfaces
- Patent number 12,131,900
- Issue date Oct 29, 2024
- Applied Materials, Inc.
- Bhaskar Jyoti Bhuyan
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Metallization lines on integrated circuit products
- Patent number 12,131,994
- Issue date Oct 29, 2024
- GLOBALFOUNDRIES U.S. Inc.
- Ruilong Xie
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD, SYSTEM, AND APPARATUS FOR DEPOSITION OF TRANSITION METAL FILM
- Publication number 20240420958
- Publication date Dec 19, 2024
- ASM IP HOLDING B.V.
- Venkata Surya Naga Raju Chava
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT EMITTING DIODE CONTAINING PINHOLE MASKING LAYER AND METHOD OF...
- Publication number 20240421246
- Publication date Dec 19, 2024
- Samsung Electronics Co., Ltd.
- Saket CHADDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DENSIFIED SEAM-FREE SILICON-CONTAINING MATERIAL GAP FILL PROCESSES
- Publication number 20240420950
- Publication date Dec 19, 2024
- Applied Materials, Inc.
- Xiang Ji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MATERIAL MONITORING SYSTEM, PROCESSING APPARATUS, METHOD OF MANUFAC...
- Publication number 20240421007
- Publication date Dec 19, 2024
- Kokusai Electric Corporation
- Kentaro GOSHIMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD
- Publication number 20240421235
- Publication date Dec 19, 2024
- Huawei Digital Power Technologies Co., Ltd.
- Yi YU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING FILM, METHOD OF MANUFACTURING SEMICONDUCTOR DEVIC...
- Publication number 20240412969
- Publication date Dec 12, 2024
- Kokusai Electric Corporation
- Yuki TAIRA
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METALLIZATION LINES ON INTEGRATED CIRCUIT PRODUCTS
- Publication number 20240413082
- Publication date Dec 12, 2024
- GLOBALFOUNDRIES U.S. Inc.
- Ruilong Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GALLIUM NITRIDE SEMICONDUCTOR DEVICE
- Publication number 20240413233
- Publication date Dec 12, 2024
- UNITED MICROELECTRONICS CORP.
- Yi-Chuan Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER MOISTURE REPELLING FILMS FOR FRONT END FET APPLICATIONS
- Publication number 20240413098
- Publication date Dec 12, 2024
- Qorvo US, Inc.
- Christo Bojkov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEMT DEVICE HAVING AN IMPROVED CONDUCTIVITY AND MANUFACTURING PROCE...
- Publication number 20240405115
- Publication date Dec 5, 2024
- STMicroelectronics International N.V.
- Maria Eloisa CASTAGNA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FUNCTIONALIZED CYCLOSILAZANES AS PRECURSORS FOR HIGH GROWTH RATE SI...
- Publication number 20240395541
- Publication date Nov 28, 2024
- VERSUM MATERIALS US, LLC
- Manchao Xiao
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
ETCHING GAS COMPOSITION AND METHOD OF MANUFACTURING INTEGRATED CIRC...
- Publication number 20240392191
- Publication date Nov 28, 2024
- SEMES CO., LTD.
- Kyungseok MIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ETCHING GAS COMPOSITION AND METHOD OF MANUFACTURING INTEGRATED CIRC...
- Publication number 20240392192
- Publication date Nov 28, 2024
- SEMES CO., LTD.
- Kyungseok MIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING
- Publication number 20240395559
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wan Hsuan Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER MASKING LAYER AND METHOD OF FORMING SAME
- Publication number 20240395907
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wen-Ju Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR MEMORY DEVICE
- Publication number 20240395605
- Publication date Nov 28, 2024
- Fujian Jinhua Integrated Circuit Co., Ltd.
- Janbo Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF PLASMA ETCHING
- Publication number 20240395560
- Publication date Nov 28, 2024
- NANYA TECHNOLOGY CORPORATION
- Shih Pin KUO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICES
- Publication number 20240395609
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsiao-Min CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE TREATING APPARATUS AND METHOD
- Publication number 20240392438
- Publication date Nov 28, 2024
- JIANGSU LEADMICRO NANO TECHNOLOGY CO., LTD.
- Xinyuan WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method
- Publication number 20240395598
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shiang-Bau Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Microelectromechanical Systems (MEMS) Fabrication Process Including...
- Publication number 20240395540
- Publication date Nov 28, 2024
- StethX Microsystems
- Farrokh Ayazi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SILICON OXIDE LAYER FOR OXIDATION RESISTANCE AND METHOD FORMING SAME
- Publication number 20240387238
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wan-Yi Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FILM STACK SIMPLIFICATION FOR HIGH ASPECT RATIO PATTERNING AND VERT...
- Publication number 20240387258
- Publication date Nov 21, 2024
- LAM RESEARCH CORPORATION
- Hui-Jung Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH ELECTRON MOBILITY TRANSISTOR AND METHOD FOR FABRICATING THE SAME
- Publication number 20240387720
- Publication date Nov 21, 2024
- UNITED MICROELECTRONICS CORP.
- Po-Yu Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REMOTE PLASMA DEPOSITION WITH ELECTROSTATIC CLAMPING
- Publication number 20240387226
- Publication date Nov 21, 2024
- LAM RESEARCH CORPORATION
- Aaron Blake MILLER
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SELF-ALIGNED INTERCONNECTION STRUCTURE AND MANUFACTURING METHOD THE...
- Publication number 20240387250
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kai-Fang CHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MODULATING STRESS OF DIELECTRIC LAYERS
- Publication number 20240387729
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chung-Ting Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CMP SAFE ALIGNMENT MARK
- Publication number 20240387398
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Huang-Jen HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PROCESSING TOOL AND METHODS OF OPERATION
- Publication number 20240379471
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuang-Wei CHENG
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
FORMING LOW-STRESS SILICON NITRIDE LAYER THROUGH HYDROGEN TREATMENT
- Publication number 20240379346
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wei-Che Hsieh
- H01 - BASIC ELECTRIC ELEMENTS

the material being a silicon nitride not containing oxygen

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Deposition method and plasma processing apparatus

Methods for forming a semiconductor device structure and related se...

Semiconductor device

Integrated assemblies having thicker semiconductor material along o...

Dynamic multi zone flow control for a processing system

Deposition of oxide thin films

Dry etching method and method for producing semiconductor device

GaN/two-dimensional AlN heterojunction rectifier on silicon substra...

Method of manufacturing semiconductor device including isolation st...

Epitaxial oxide materials, structures, and devices

Silicon oxide layer for oxidation resistance and method forming same

Method of manufacturing semiconductor device and semiconductor devices

Semiconductor structures and manufacturing methods thereof

Boron nitride layer, apparatus including the same, and method of fa...

Active device substrate and fabrication method of active device sub...

Sequential plasma and thermal treatment

Seam removal in high aspect ratio gap-fill

Transistor structures having conductive structures along pillars of...

Staircase etch control in forming three-dimensional memory device

Pre-deposition treatment for FET technology and devices formed thereby

Chalcogen precursors for deposition of silicon nitride

Apparatus and method for cleaning reaction vessel for processing su...

Method of processing substrate, method of manufacturing semiconduct...

Contact over active gate structures for advanced integrated circuit...

Method of manufacturing semiconductor device, substrate processing...

Semiconductor device and manufacturing method of semiconductor device

Heterostructure including alternating sets of channel and barrier l...

Synaptic transistor with long-term and short-term memory

Methods for depositing blocking layers on metal surfaces

Metallization lines on integrated circuit products

Patents Applicationslast 30 patents

METHOD, SYSTEM, AND APPARATUS FOR DEPOSITION OF TRANSITION METAL FILM

LIGHT EMITTING DIODE CONTAINING PINHOLE MASKING LAYER AND METHOD OF...

DENSIFIED SEAM-FREE SILICON-CONTAINING MATERIAL GAP FILL PROCESSES

MATERIAL MONITORING SYSTEM, PROCESSING APPARATUS, METHOD OF MANUFAC...

SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD

METHOD OF FORMING FILM, METHOD OF MANUFACTURING SEMICONDUCTOR DEVIC...

METALLIZATION LINES ON INTEGRATED CIRCUIT PRODUCTS

GALLIUM NITRIDE SEMICONDUCTOR DEVICE

MULTILAYER MOISTURE REPELLING FILMS FOR FRONT END FET APPLICATIONS

HEMT DEVICE HAVING AN IMPROVED CONDUCTIVITY AND MANUFACTURING PROCE...

FUNCTIONALIZED CYCLOSILAZANES AS PRECURSORS FOR HIGH GROWTH RATE SI...

ETCHING GAS COMPOSITION AND METHOD OF MANUFACTURING INTEGRATED CIRC...

ETCHING GAS COMPOSITION AND METHOD OF MANUFACTURING INTEGRATED CIRC...

SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING

MULTILAYER MASKING LAYER AND METHOD OF FORMING SAME

METHOD OF MANUFACTURING SEMICONDUCTOR MEMORY DEVICE

METHOD OF PLASMA ETCHING

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICES

SUBSTRATE TREATING APPARATUS AND METHOD

Semiconductor Device and Method

Microelectromechanical Systems (MEMS) Fabrication Process Including...

SILICON OXIDE LAYER FOR OXIDATION RESISTANCE AND METHOD FORMING SAME

FILM STACK SIMPLIFICATION FOR HIGH ASPECT RATIO PATTERNING AND VERT...

HIGH ELECTRON MOBILITY TRANSISTOR AND METHOD FOR FABRICATING THE SAME

REMOTE PLASMA DEPOSITION WITH ELECTROSTATIC CLAMPING

SELF-ALIGNED INTERCONNECTION STRUCTURE AND MANUFACTURING METHOD THE...

METHOD OF MODULATING STRESS OF DIELECTRIC LAYERS

CMP SAFE ALIGNMENT MARK

SEMICONDUCTOR PROCESSING TOOL AND METHODS OF OPERATION

FORMING LOW-STRESS SILICON NITRIDE LAYER THROUGH HYDROGEN TREATMENT