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the material being a silicon nitride not containing oxygen
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Nitride semiconductor device and manufacturing method thereof
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12,289,914
Issue date
Apr 29, 2025
United Microelectronics Corp.
Chih Tung Yeh
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Pulsed DC power for deposition of film
Patent number
12,288,670
Issue date
Apr 29, 2025
Applied Materials, Inc.
Abhijeet Laxman Sangle
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Method of manufacturing semiconductor device, substrate processing...
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12,288,683
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Apr 29, 2025
Kokusai Electric Corporation
Yasunobu Koshi
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Gate-all-around integrated circuit structures having insulator fin...
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12,288,813
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Apr 29, 2025
Intel Corporation
Aaron D. Lilak
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Film deposition apparatus for fine pattern forming
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12,288,671
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Apr 29, 2025
Tokyo Electron Limited
Kazuhide Hasebe
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Selective deposition method to form air gaps
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12,283,520
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Apr 22, 2025
ASM IP Holding B.V.
Chiyu Zhu
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Methods for depositing blocking layers on conductive surfaces
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12,281,382
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Apr 22, 2025
Applied Materials, Inc.
Lakmal C. Kalutarage
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Method of manufacturing a semiconductor device
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12,283,477
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Apr 22, 2025
Taiwan Semiconductor Manufacturing Company Ltd.
Shih-Wei Peng
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Substrate processing method
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12,283,479
Issue date
Apr 22, 2025
ASM IP Holding B.V.
JaeOk Ko
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Etching composition and method for selectively removing silicon nit...
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12,281,251
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Apr 22, 2025
VERSUM MATERIALS US, LLC
Jhih Kuei Ge
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Method for manufacturing metal gate
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12,284,824
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Apr 22, 2025
Shanghai Huali Integrated Circuit Corporation
Yanxia Hao
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Manufacturing method for compound semiconductor device
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12,283,922
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Apr 22, 2025
Fujitsu Limited
Kozo Makiyama
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Method of manufacturing semiconductor device, substrate processing...
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12,283,476
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Apr 22, 2025
Kokusai Electric Corporation
Hiroshi Ashihara
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Method for manufacturing semiconductor device
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12,283,481
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Apr 22, 2025
United Microelectronics Corp.
Yu Cheng Lin
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Integrated assemblies and methods of forming integrated assemblies
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12,279,431
Issue date
Apr 15, 2025
Ramey M. Abdelrahaman
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Semiconductor device with silicon nitride passivation film
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12,278,102
Issue date
Apr 15, 2025
Sumitomo Electric Industries, Ltd.
Kazuhide Sumiyoshi
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Fin field-effect transistor and method of forming the same
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12,278,277
Issue date
Apr 15, 2025
Taiwan Semiconductor Manufacturing Company, Ltd
Sheng-Liang Pan
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Treatment liquid and substrate treatment method
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12,275,921
Issue date
Apr 15, 2025
FUJIFILM Corporation
Tomonori Takahashi
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Method for manufacturing semiconductor memory device and semiconduc...
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12,279,432
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Apr 15, 2025
Kioxia Corporation
Hirotaka Tsuda
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Semiconductor device with helmet structure between two semiconducto...
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12,278,236
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Apr 15, 2025
Taiwan Semiconductor Manufacturing Co., Ltd
Kuo-Cheng Ching
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Selective laser annealing method
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12,278,275
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Apr 15, 2025
Infineon Technologies AG
Albert Birner
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Integrated circuit device with low threshold voltage
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12,272,604
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Apr 8, 2025
Taiwan Semiconductor Manufacturing Co., Ltd
Chung-Liang Cheng
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Integrated assemblies and methods of forming integrated assemblies
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12,274,063
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Apr 8, 2025
Jordan D. Greenlee
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Station-to-station control of backside bow compensation deposition
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12,272,608
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Apr 8, 2025
Lam Research Corporation
Yanhui Huang
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Method of forming an electronic structure using reforming gas, syst...
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12,272,548
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Apr 8, 2025
ASM IP Holding B.V.
Shinya Yoshimoto
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High-resistance resistor based on silicon carbide and manufacturing...
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12,268,013
Issue date
Apr 1, 2025
Talyuan University of Technology
Yuying Xi
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Transistor with dielectric spacers and method of fabrication therefor
Patent number
12,266,713
Issue date
Apr 1, 2025
NXP USA, INC.
Darrell Glenn Hill
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Substrate processing apparatus, method of manufacturing semiconduct...
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12,266,522
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Apr 1, 2025
Kokusai Electric Corporation
Kazuyuki Okuda
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Semiconductor device with source/drain contact formed using bottom-...
Patent number
12,266,688
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Apr 1, 2025
Taiwan Semiconductor Manufacturing Co., Ltd
Sung-Li Wang
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Method for fabricating layer structure having target topological pr...
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12,266,540
Issue date
Apr 1, 2025
ASM IP Holding B.V.
Eiichiro Shiba
H01 - BASIC ELECTRIC ELEMENTS
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SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS
Publication number
20250140552
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May 1, 2025
TOKYO ELECTRON LIMITED
Motoki SHINDEN
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Semiconductor Device Having Dielectric Material Treated with Microw...
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20250140553
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May 1, 2025
Taiwan Semiconductor Manufacturing Company, Ltd.
Szu-Hua Chen
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LOW RESISTIVITY METAL STACKS AND METHODS OF DEPOSITING THE SAME
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20250140562
Publication date
May 1, 2025
Applied Materials, Inc.
Zhaoxuan Wang
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SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
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20250142934
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May 1, 2025
Mitsubishi Electric Corporation
Asuka MATSUYAMA
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Assemblies Having Conductive Structures Along Pillars of Semiconduc...
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20250142875
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May 1, 2025
Micron Technology, Inc.
Sanh D. Tang
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METAL OXIDE COMPOSITE AS ETCH STOP LAYER
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20250132197
Publication date
Apr 24, 2025
Taiwan Semiconductor Manufacturing Company, Ltd.
Kai-Feng Cheng
H01 - BASIC ELECTRIC ELEMENTS
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SOURCE/DRAIN FEATURE SEPARATION STRUCTURE
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20250133716
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Apr 24, 2025
Taiwan Semiconductor Manufacturing Co., Ltd.
Wen-Chun Keng
H01 - BASIC ELECTRIC ELEMENTS
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HARDMASK INTEGRATION FOR HIGH ASPECT RATIO APPLICATIONS
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20250132159
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Apr 24, 2025
TOKYO ELECTRON LIMITED
Joshua Baillargeon
H01 - BASIC ELECTRIC ELEMENTS
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METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
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20250125144
Publication date
Apr 17, 2025
NANYA TECHNOLOGY CORPORATION
Yubon CHIANG
H01 - BASIC ELECTRIC ELEMENTS
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EPITAXIAL SOURCE OR DRAIN STRUCTURES FOR ADVANCED INTEGRATED CIRCUI...
Publication number
20250126869
Publication date
Apr 17, 2025
Intel Corporation
Subhash JOSHI
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METHOD OF BONDING MULTIPLE COPPER ELEMENTS AND METHOD OF BONDING MU...
Publication number
20250125185
Publication date
Apr 17, 2025
National Cheng Kung University
Shih-kang LIN
H01 - BASIC ELECTRIC ELEMENTS
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SUBSTRATE-PROCESSING METHOD AND SUBSTRATE-PROCESSING APPARATUS
Publication number
20250118550
Publication date
Apr 10, 2025
TOKYO ELECTRON LIMITED
Munehito KAGAYA
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METHODS OF FORMING MEMORY STRUCTURES FOR THREE-DIMENSIONAL NONVOLAT...
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20250118547
Publication date
Apr 10, 2025
IMEC vzw
Sana Rachidi
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HEMT TRANSISTOR
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20250118613
Publication date
Apr 10, 2025
STMicroelectronics International N.V.
Paolo COLPANI
H01 - BASIC ELECTRIC ELEMENTS
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HEAT DISSIPATION FOR FIELD EFFECT TRANSISTORS
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20250118548
Publication date
Apr 10, 2025
Taiwan Semiconductor Manufacturing Company, Ltd.
Kai-Fang Cheng
H01 - BASIC ELECTRIC ELEMENTS
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SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME
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20250120083
Publication date
Apr 10, 2025
KIOXIA Corporation
Shinya ARAI
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SEMICONDUCTOR STRUCTURE, SEMICONDUCTOR DEVICE WITH AIR SPACERS, AND...
Publication number
20250112169
Publication date
Apr 3, 2025
NANYA TECHNOLOGY CORPORATION
FENG-WEN HSU
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SELECTIVE DIELECTRIC GROWTH FOR DIRECTING CONTACT TO GATE OR CONTAC...
Publication number
20250112037
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Apr 3, 2025
Intel Corporation
Mark KOEPER
H01 - BASIC ELECTRIC ELEMENTS
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SEMICONDUCTOR STRUCTURE, SEMICONDUCTOR DEVICE WITH AIR SPACERS, AND...
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20250112171
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Apr 3, 2025
NANYA TECHNOLOGY CORPORATION
FENG-WEN HSU
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METHOD FOR PRODUCING A POWER SEMICONDUCTOR COMPONENT HAVING A PLURA...
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20250113514
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Apr 3, 2025
ROBERT BOSCH GmbH
Daniel Krebs
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PROCESS FOR SYNTHESIS OF MONOLAYER TRANSITION METAL DICHALOCOGENIDE
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20250105006
Publication date
Mar 27, 2025
INDIAN INSTITUTE OF SCIENCE EDUCATION AND RESEARCH, PUNE (IISER PUNE)
Gokul M. A
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SUBSTRATE PROCESSING APPARATUS AND METHOD OF MANUFACTURING SEMICOND...
Publication number
20250101583
Publication date
Mar 27, 2025
Kokusai Electric Corporation
Hidetoshi Mimura
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LOW RESISTANCE INTERCONNECT STRUCTURE FOR SEMICONDUCTOR DEVICE
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20250105147
Publication date
Mar 27, 2025
Taiwan Semiconductor Manufacturing Co., Ltd.
Jason HUANG
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CYCLIC LOW TEMPERATURE FILM GROWTH PROCESSES
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20250095983
Publication date
Mar 20, 2025
TOKYO ELECTRON LIMITED
Jianping Zhao
H01 - BASIC ELECTRIC ELEMENTS
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INTEGRATED ASSEMBLIES HAVING VERTICALLY-SPACED CHANNEL MATERIAL SEG...
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20250098168
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Mar 20, 2025
Lodestar Licensing Group LLC
John D. Hopkins
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PLUGS FOR INTERCONNECT LINES FOR ADVANCED INTEGRATED CIRCUIT STRUCT...
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20250098258
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Mar 20, 2025
Intel Corporation
Andrew W. YEOH
H01 - BASIC ELECTRIC ELEMENTS
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METAL-INSULATOR-METAL (MIM) CAPACITORS WITH IMPROVED RELIABILITY
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20250089277
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Mar 13, 2025
Taiwan Semiconductor Manufacturing Company, Ltd.
Chia-Yueh Chou
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METHODS OF FORMING SILICON NITRIDE FILMS
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20250087477
Publication date
Mar 13, 2025
Applied Materials, Inc.
Joseph AuBuchon
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THIN FILM TRANSISTOR INCLUDING A HYDROGEN-BLOCKING DIELECTRIC BARRI...
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20250089294
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Mar 13, 2025
Taiwan Semiconductor Manufacturing Company Limited
Neil Quinn Murray
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FILM-FORMING METHOD AND FILM-FORMING APPARATUS
Publication number
20250084530
Publication date
Mar 13, 2025
TOKYO ELECTRON LIMITED
Yohei MATSUYAMA
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...