the material being a silicon oxide

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H01L21/02164

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

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H01L21/02164the material being a silicon oxide

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Capacitive coupling in a direct-bonded interface for microelectroni...
- Patent number 12,272,673
- Issue date Apr 8, 2025
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Station-to-station control of backside bow compensation deposition
- Patent number 12,272,608
- Issue date Apr 8, 2025
- Lam Research Corporation
- Yanhui Huang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Integrated assemblies and methods of forming integrated assemblies
- Patent number 12,274,063
- Issue date Apr 8, 2025
- Jordan D. Greenlee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for fabricating the same
- Patent number 12,272,693
- Issue date Apr 8, 2025
- United Microelectronics Corp.
- Chun-Ya Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate processing apparatus, substrate suppport and method of ma...
- Patent number 12,272,579
- Issue date Apr 8, 2025
- Kokusai Electric Corporation
- Yusaku Okajima
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Sacrificial capping layer for contact etch
- Patent number 12,266,533
- Issue date Apr 1, 2025
- Tokyo Electron Limited
- Yun Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Oxide-nitride-oxide stack having multiple oxynitride layers
- Patent number 12,266,521
- Issue date Apr 1, 2025
- LONGITUDE FLASH MEMORY SOLUTIONS LTD.
- Sagy Charel Levy
- G11 - INFORMATION STORAGE
Information Patent Grant
Method for manufacturing semiconductor device using etchant composi...
- Patent number 12,266,538
- Issue date Apr 1, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chia-Chien Kuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method
- Patent number 12,266,541
- Issue date Apr 1, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Sung-En Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with source/drain contact formed using bottom-...
- Patent number 12,266,688
- Issue date Apr 1, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Sung-Li Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating layer structure having target topological pr...
- Patent number 12,266,540
- Issue date Apr 1, 2025
- ASM IP Holding B.V.
- Eiichiro Shiba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Gapfill of variable aspect ratio features with a composite PEALD an...
- Patent number 12,261,038
- Issue date Mar 25, 2025
- Lam Research Corporation
- Hu Kang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Forming nitrogen-containing layers as oxidation blocking layers
- Patent number 12,261,042
- Issue date Mar 25, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wan-Yi Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for preparing interlayer insulating layer and method for man...
- Patent number 12,261,179
- Issue date Mar 25, 2025
- BOE Technology Group Co., Ltd.
- Ming Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact over active gate structures with etch stop layers for advan...
- Patent number 12,261,122
- Issue date Mar 25, 2025
- Intel Corporation
- Atul Madhavan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Source-body self-aligned method of a vertical double diffused metal...
- Patent number 12,256,559
- Issue date Mar 18, 2025
- NATIONAL YANG MING CHIAO TUNG UNIVERSITY
- Bing-Yue Tsui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Trench contact structures for advanced integrated circuit structure...
- Patent number 12,255,247
- Issue date Mar 18, 2025
- Intel Corporation
- Subhash M. Joshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
CMP safe alignment mark
- Patent number 12,255,150
- Issue date Mar 18, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Huang-Jen Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multigate device structure with engineered cladding and method maki...
- Patent number 12,249,539
- Issue date Mar 11, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shu-Wen Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,249,660
- Issue date Mar 11, 2025
- Kabushiki Kaisha Toshiba
- Kumiko Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for processing a substrate
- Patent number 12,243,742
- Issue date Mar 4, 2025
- ASM IP Holding B.V.
- SeungHyun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conformal oxidation for gate all around nanosheet I/O device
- Patent number 12,243,941
- Issue date Mar 4, 2025
- Applied Materials, Inc.
- Myungsun Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having STI region
- Patent number 12,238,924
- Issue date Feb 25, 2025
- Micron Technology, Inc.
- Kunihiro Tsubomi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for increasing germanium concentration of surfaces of a sil...
- Patent number 12,237,404
- Issue date Feb 25, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Che-Yu Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including device isolation layer with multiple...
- Patent number 12,237,208
- Issue date Feb 25, 2025
- Samsung Electronics Co., Ltd.
- Hyunchul Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional field effect device
- Patent number 12,237,325
- Issue date Feb 25, 2025
- International Business Machines Corporation
- Huimei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Organoaminosilane precursors and methods for depositing films compr...
- Patent number 12,230,496
- Issue date Feb 18, 2025
- VERSUM MATERIALS US, LLC
- Mark Leonard O'Neill
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Word line structure of three-dimensional memory device
- Patent number 12,232,320
- Issue date Feb 18, 2025
- Yangtze Memory Technologies Co., Ltd.
- Qiang Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate supporting apparatus, substrate processing apparatus incl...
- Patent number 12,230,531
- Issue date Feb 18, 2025
- ASM IP Holding B.V.
- Seung Woo Choi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Metal-insulator-metal structure
- Patent number 12,230,566
- Issue date Feb 18, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yuan-Yang Hsiao
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR STRUCTURE, SEMICONDUCTOR DEVICE WITH AIR SPACERS, AND...
- Publication number 20250112169
- Publication date Apr 3, 2025
- NANYA TECHNOLOGY CORPORATION
- FENG-WEN HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE, SEMICONDUCTOR DEVICE WITH AIR SPACERS, AND...
- Publication number 20250112171
- Publication date Apr 3, 2025
- NANYA TECHNOLOGY CORPORATION
- FENG-WEN HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INHERENT AREA SELECTIVE DEPOSITION OF SILICON-CONTAINING DIELECTRIC...
- Publication number 20250112041
- Publication date Apr 3, 2025
- Gelest, Inc.
- Chad Michael BRICK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESSING METHOD, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, PR...
- Publication number 20250104998
- Publication date Mar 27, 2025
- Kokusai Electric Corporation
- Shoma MIYATA
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, SUBSTRATE PROCESSING...
- Publication number 20250105000
- Publication date Mar 27, 2025
- Kokusai Electric Corporation
- Hiroshi ASHIHARA
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20250107091
- Publication date Mar 27, 2025
- SK HYNIX INC.
- Moon Sik SEO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF VIA FILLING
- Publication number 20250105059
- Publication date Mar 27, 2025
- TOKYO ELECTRON LIMITED
- Ryota Yonezawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, SUBSTRATE PROCESSING...
- Publication number 20250105001
- Publication date Mar 27, 2025
- Kokusai Electric Corporation
- Hiroshi ASHIHARA
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
INHERENT AREA SELECTIVE DEPOSITION OF SILICON-CONTAINING DIELECTRIC...
- Publication number 20250095982
- Publication date Mar 20, 2025
- Gelest, Inc.
- Chad Michael BRICK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FILM FORMING METHOD AND FILM FORMING APPARATUS
- Publication number 20250095985
- Publication date Mar 20, 2025
- TOKYO ELECTRON LIMITED
- Tomohiro NAKAGAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL-CONTAINING HARDMASK OPENING METHODS USING BORON-AND-HALOGEN-C...
- Publication number 20250095990
- Publication date Mar 20, 2025
- Applied Materials, Inc.
- Han Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED ASSEMBLIES HAVING VERTICALLY-SPACED CHANNEL MATERIAL SEG...
- Publication number 20250098168
- Publication date Mar 20, 2025
- Lodestar Licensing Group LLC
- John D. Hopkins
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND SEMICONDUCTOR MANUFAC...
- Publication number 20250098248
- Publication date Mar 20, 2025
- Kioxia Corporation
- Masaya NAKATA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLUGS FOR INTERCONNECT LINES FOR ADVANCED INTEGRATED CIRCUIT STRUCT...
- Publication number 20250098258
- Publication date Mar 20, 2025
- Intel Corporation
- Andrew W. YEOH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLASMA-ENHANCED ATOMIC LAYER DEPOSITION APPARATUS AND METHOD THEREOF
- Publication number 20250087480
- Publication date Mar 13, 2025
- Beijing NAURA Microelectronics Equipment Co., Ltd.
- Haifeng QIN
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
INCREASING DEPOSITION RATES OF OXIDE FILMS
- Publication number 20250087481
- Publication date Mar 13, 2025
- Awnish Gupta
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20250087482
- Publication date Mar 13, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chun-Yi CHOU
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
LAMINATED SUBSTRATE, MANUFACTURING METHOD THEREFOR, AND LIQUID DISC...
- Publication number 20250074054
- Publication date Mar 6, 2025
- Canon Kabushiki Kaisha
- YUKI KOMORI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE ARCHITECTURES WITH TENSILE AND COMPRESSIVE STRAINED SUBSTRATES
- Publication number 20250081561
- Publication date Mar 6, 2025
- SOITEC
- Bich-Yen Nguyen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RF SWITCH DEVICE WITH A SIDEWALL SPACER HAVING A LOW DIELECTRIC CON...
- Publication number 20250081570
- Publication date Mar 6, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Ta Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING INTEGRATED CIRCUIT DEVICE
- Publication number 20250079154
- Publication date Mar 6, 2025
- TES CO., LTD.
- Joonyoung Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20250079158
- Publication date Mar 6, 2025
- Sumitomo Electric Industries, Ltd.
- Takahide HIRASAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR IMPROVED SILICON DEPOSITION
- Publication number 20250079159
- Publication date Mar 6, 2025
- ASM IP HOLDING, B.V.
- Dieter Pierreux
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEAM PERFORMANCE IMPROVEMENT USING HYDROXYLATION FOR GAPFILL
- Publication number 20250066913
- Publication date Feb 27, 2025
- Applied Materials, Inc.
- Supriya Ghosh
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SELECTIVE DEPOSITION OF OXIDE MATERIAL AND A DEPOSITION ASSEMBLY
- Publication number 20250069883
- Publication date Feb 27, 2025
- ASM IP HOLDING B.V.
- Vincent Vandalon
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
HETEROGENEOUS METAL LINE COMPOSITIONS FOR ADVANCED INTEGRATED CIRCU...
- Publication number 20250072078
- Publication date Feb 27, 2025
- Intel Corporation
- Andrew W. YEOH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLASMA ETCHING IN SEMICONDUCTOR PROCESSING
- Publication number 20250062131
- Publication date Feb 20, 2025
- Applied Materials, Inc.
- Hanbyul Jin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRENCH CAPACITOR PROFILE TO DECREASE SUBSTRATE WARPAGE
- Publication number 20250063744
- Publication date Feb 20, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsin-Li Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD TO SMOOTH SIDEWALL ROUGHNESS AND MAINTAIN REENTRANT STRUCTUR...
- Publication number 20250054752
- Publication date Feb 13, 2025
- LAM RESEARCH CORPORATION
- Dustin Zachary Austin
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
MEMORY ARRAYS AND METHODS USED IN FORMING A MEMORY ARRAY COMPRISING...
- Publication number 20250056800
- Publication date Feb 13, 2025
- Lodestar Licensing Group LLC
- Jordan D. Greenlee
- H01 - BASIC ELECTRIC ELEMENTS

the material being a silicon oxide

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Capacitive coupling in a direct-bonded interface for microelectroni...

Station-to-station control of backside bow compensation deposition

Integrated assemblies and methods of forming integrated assemblies

Semiconductor device and method for fabricating the same

Substrate processing apparatus, substrate suppport and method of ma...

Sacrificial capping layer for contact etch

Oxide-nitride-oxide stack having multiple oxynitride layers

Method for manufacturing semiconductor device using etchant composi...

Semiconductor device and method

Semiconductor device with source/drain contact formed using bottom-...

Method for fabricating layer structure having target topological pr...

Gapfill of variable aspect ratio features with a composite PEALD an...

Forming nitrogen-containing layers as oxidation blocking layers

Method for preparing interlayer insulating layer and method for man...

Contact over active gate structures with etch stop layers for advan...

Source-body self-aligned method of a vertical double diffused metal...

Trench contact structures for advanced integrated circuit structure...

CMP safe alignment mark

Multigate device structure with engineered cladding and method maki...

Semiconductor device

Method for processing a substrate

Conformal oxidation for gate all around nanosheet I/O device

Semiconductor device having STI region

Methods for increasing germanium concentration of surfaces of a sil...

Semiconductor device including device isolation layer with multiple...

Three-dimensional field effect device

Organoaminosilane precursors and methods for depositing films compr...

Word line structure of three-dimensional memory device

Substrate supporting apparatus, substrate processing apparatus incl...

Metal-insulator-metal structure

Patents Applicationslast 30 patents

SEMICONDUCTOR STRUCTURE, SEMICONDUCTOR DEVICE WITH AIR SPACERS, AND...

SEMICONDUCTOR STRUCTURE, SEMICONDUCTOR DEVICE WITH AIR SPACERS, AND...

INHERENT AREA SELECTIVE DEPOSITION OF SILICON-CONTAINING DIELECTRIC...

PROCESSING METHOD, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, PR...

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, SUBSTRATE PROCESSING...

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

METHOD OF VIA FILLING

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, SUBSTRATE PROCESSING...

INHERENT AREA SELECTIVE DEPOSITION OF SILICON-CONTAINING DIELECTRIC...

FILM FORMING METHOD AND FILM FORMING APPARATUS

METAL-CONTAINING HARDMASK OPENING METHODS USING BORON-AND-HALOGEN-C...

INTEGRATED ASSEMBLIES HAVING VERTICALLY-SPACED CHANNEL MATERIAL SEG...

SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND SEMICONDUCTOR MANUFAC...

PLUGS FOR INTERCONNECT LINES FOR ADVANCED INTEGRATED CIRCUIT STRUCT...

PLASMA-ENHANCED ATOMIC LAYER DEPOSITION APPARATUS AND METHOD THEREOF

INCREASING DEPOSITION RATES OF OXIDE FILMS

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

LAMINATED SUBSTRATE, MANUFACTURING METHOD THEREFOR, AND LIQUID DISC...

DEVICE ARCHITECTURES WITH TENSILE AND COMPRESSIVE STRAINED SUBSTRATES

RF SWITCH DEVICE WITH A SIDEWALL SPACER HAVING A LOW DIELECTRIC CON...

METHOD OF MANUFACTURING INTEGRATED CIRCUIT DEVICE

METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

METHOD FOR IMPROVED SILICON DEPOSITION

SEAM PERFORMANCE IMPROVEMENT USING HYDROXYLATION FOR GAPFILL

SELECTIVE DEPOSITION OF OXIDE MATERIAL AND A DEPOSITION ASSEMBLY

HETEROGENEOUS METAL LINE COMPOSITIONS FOR ADVANCED INTEGRATED CIRCU...

PLASMA ETCHING IN SEMICONDUCTOR PROCESSING

TRENCH CAPACITOR PROFILE TO DECREASE SUBSTRATE WARPAGE

METHOD TO SMOOTH SIDEWALL ROUGHNESS AND MAINTAIN REENTRANT STRUCTUR...

MEMORY ARRAYS AND METHODS USED IN FORMING A MEMORY ARRAY COMPRISING...