the material being a silicon oxide

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

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H01L21/02164the material being a silicon oxide

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Electronic devices comprising a compressive dielectric material, an...
- Patent number 12,205,900
- Issue date Jan 21, 2025
- Micron Technology, Inc.
- Jivaan Kishore Jhothiraman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for depositing film and film deposition system
- Patent number 12,205,817
- Issue date Jan 21, 2025
- Tokyo Electron Limited
- Hitoshi Kato
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Semiconductor device and a manufacturing method thereof
- Patent number 12,199,014
- Issue date Jan 14, 2025
- Samsung Electronics Co., Ltd.
- Kyeong Bin Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silicon nitride films having reduced interfacial strain
- Patent number 12,198,926
- Issue date Jan 14, 2025
- PSIQUANTUM, CORP.
- Yong Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device, substrate processing...
- Patent number 12,198,929
- Issue date Jan 14, 2025
- Kokusai Electric Corporation
- Hiroshi Ashihara
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Gate line plug structures for advanced integrated circuit structure...
- Patent number 12,199,167
- Issue date Jan 14, 2025
- Intel Corporation
- Byron Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plugs for interconnect lines for advanced integrated circuit struct...
- Patent number 12,199,168
- Issue date Jan 14, 2025
- Intel Corporation
- Andrew W. Yeoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing semiconductor device
- Patent number 12,200,937
- Issue date Jan 14, 2025
- SK hynix Inc.
- Moon Sik Seo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 12,191,144
- Issue date Jan 7, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chun-Yi Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Switching device and method for manufacturing the same
- Patent number 12,191,150
- Issue date Jan 7, 2025
- Denso Corporation
- Hidemoto Tomita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plasma etching method using perfluoroisopropyl vinyl ether
- Patent number 12,191,141
- Issue date Jan 7, 2025
- Ajou University Industry-Academic Cooperation Foundation
- Chang-Koo Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of depositing silicon oxide films
- Patent number 12,188,121
- Issue date Jan 7, 2025
- ASM Genitech Korea Ltd.
- Tae Ho Yoon
- C01 - INORGANIC CHEMISTRY
Information Patent Grant
Multi process air gap formation
- Patent number 12,183,627
- Issue date Dec 31, 2024
- Applied Materials, Inc.
- John Hautala
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 12,183,832
- Issue date Dec 31, 2024
- Semiconductor Energy Laboratory Co., Ltd.
- Kengo Akimoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated assemblies having vertically-spaced channel material seg...
- Patent number 12,185,544
- Issue date Dec 31, 2024
- John D. Hopkins
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
RF switch device with a sidewall spacer having a low dielectric con...
- Patent number 12,183,804
- Issue date Dec 31, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Cheng-Ta Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Additive process for circular printing
- Patent number 12,172,374
- Issue date Dec 24, 2024
- Texas Instruments Incorporated
- Daniel Lee Revier
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Trench capacitor profile to decrease substrate warpage
- Patent number 12,176,387
- Issue date Dec 24, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsin-Li Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cyclic spin-on coating process for forming dielectric material
- Patent number 12,170,199
- Issue date Dec 17, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Je-Ming Kuo
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Grant
Semiconductor device and method
- Patent number 12,165,929
- Issue date Dec 10, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chun-Han Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Deposition method and deposition apparatus
- Patent number 12,163,220
- Issue date Dec 10, 2024
- Tokyo Electron Limited
- Yu Komai
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Integrated assemblies having thicker semiconductor material along o...
- Patent number 12,167,602
- Issue date Dec 10, 2024
- Kunal R. Parekh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dynamic multi zone flow control for a processing system
- Patent number 12,159,785
- Issue date Dec 3, 2024
- Applied Materials, Inc.
- Daemian Raj Benjamin Raj
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Dry etching method and method for producing semiconductor device
- Patent number 12,154,791
- Issue date Nov 26, 2024
- Central Glass Company, Limited
- Hiroyuki Oomori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Etching method and plasma processing apparatus
- Patent number 12,154,790
- Issue date Nov 26, 2024
- Tokyo Electron Limited
- Seiichi Watanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High voltage transistor structures
- Patent number 12,148,752
- Issue date Nov 19, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Meng-Han Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silicon oxide deposition method
- Patent number 12,148,609
- Issue date Nov 19, 2024
- ASM IP Holding B.V.
- Varun Sharma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device and semiconductor devices
- Patent number 12,148,656
- Issue date Nov 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsiao-Min Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structures and manufacturing methods thereof
- Patent number 12,148,613
- Issue date Nov 19, 2024
- ENKRIS SEMICONDUCTOR, INC.
- Kai Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Transistor structures having conductive structures along pillars of...
- Patent number 12,142,680
- Issue date Nov 12, 2024
- Micron Technology, Inc.
- Sanh D. Tang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHODS OF FORMING ABRUPT INTERFACES BETWEEN SILICON-AND-CARBON-CON...
- Publication number 20250037987
- Publication date Jan 30, 2025
- Applied Materials, Inc.
- Stephen Weeks
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SILICON OXIDE DEPOSITION METHOD
- Publication number 20250037988
- Publication date Jan 30, 2025
- ASM IP HOLDING B.V.
- Varun Sharma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH VOLTAGE THREE-DIMENSIONAL DEVICES HAVING DIELECTRIC LINERS
- Publication number 20250031446
- Publication date Jan 23, 2025
- Intel Corporation
- Walid M. HAFEZ
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Assemblies Having Conductive Structures Along Pillars of Semiconduc...
- Publication number 20250022955
- Publication date Jan 16, 2025
- Micron Technology, Inc.
- Sanh D. Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTACT OVER ACTIVE GATE STRUCTURES FOR ADVANCED INTEGRATED CIRCUIT...
- Publication number 20250022939
- Publication date Jan 16, 2025
- Intel Corporation
- Andrew W. Yeoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIRECTIONAL SELECTIVE FILL OF SILICON OXIDE MATERIALS
- Publication number 20250022704
- Publication date Jan 16, 2025
- Applied Materials, Inc.
- Qiang Ma
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
LOW-PRESSURE OXIDATION TREATMENT METHOD AND DEVICE FOR SEMICONDUCTO...
- Publication number 20250014892
- Publication date Jan 9, 2025
- Beijing E-Town Semiconductor Technology Co., Ltd.
- Jianmin JI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PROTECTING ACTIVE LAYERS OF ELECTRONIC CHIPS
- Publication number 20250014912
- Publication date Jan 9, 2025
- Commissariat A L'Energie Atomique et Aux Energies Alternatives
- Emilie BOURJOT
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20250014913
- Publication date Jan 9, 2025
- Innolux Corporation
- Yi-Hung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND DEVICE FOR ETCHING SILICON OXIDE
- Publication number 20250014906
- Publication date Jan 9, 2025
- Central Glass Company, Limited
- Shoi SUZUKI
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
ETCHING METHOD
- Publication number 20250014907
- Publication date Jan 9, 2025
- HITACHI HIGH-TECH CORPORATION
- Takashi Hattori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR DEPOSITING A LAYER ONTO A SUBSTRATE AND SEMICONDUCTOR PR...
- Publication number 20250014895
- Publication date Jan 9, 2025
- ASM IP HOLDING B.V.
- René Henricus Jozef Vervuurt
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR STACK STRUCTURE WITH ULTRA T...
- Publication number 20250014942
- Publication date Jan 9, 2025
- Nexthin Technology
- Tzu-wei CHIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE DEPOSITION PROCESSES ON SEMICONDUCTOR SUBSTRATES
- Publication number 20250006485
- Publication date Jan 2, 2025
- Applied Materials, Inc.
- Mark Saly
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND ASSEMBLIES FOR DEPOSITING MATERIAL IN A GAP
- Publication number 20250006489
- Publication date Jan 2, 2025
- ASM IP HOLDING B.V.
- Ranjit Borude
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD
- Publication number 20250006500
- Publication date Jan 2, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ya-Lan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-LAYERED INSULATING FILM STACK
- Publication number 20250006560
- Publication date Jan 2, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chieh-Ping Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DYNAMIC MULTI ZONE FLOW CONTROL FOR A PROCESSING SYSTEM
- Publication number 20250006487
- Publication date Jan 2, 2025
- Applied Materials, Inc.
- Daemian Raj BENJAMIN RAJ
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
HIGH-K ISOLATION OF FIN STRUCTURES
- Publication number 20240429312
- Publication date Dec 26, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kang Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF FABRICATING THE SAME
- Publication number 20240429317
- Publication date Dec 26, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsiao Po-Kai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ATOMIC LAYER ETCH AND SELECTIVE DEPOSITION PROCESS FOR EXTREME ULTR...
- Publication number 20240429045
- Publication date Dec 26, 2024
- LAM RESEARCH CORPORATION
- Jengyi Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PROCESSING METHOD
- Publication number 20240429044
- Publication date Dec 26, 2024
- ASM IP HOLDING B.V.
- Yan Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
- Publication number 20240429093
- Publication date Dec 26, 2024
- UNITED MICROELECTRONICS CORP.
- Chien-Ting Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF PROCESSING SUBSTRATE, METHOD OF MANUFACTURING SEMICONDUCT...
- Publication number 20240425972
- Publication date Dec 26, 2024
- Kokusai Electric Corporation
- Tomoya NAGAHASHI
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20240429319
- Publication date Dec 26, 2024
- Semiconductor Energy Laboratory Co., Ltd.
- Shunpei YAMAZAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
- Publication number 20240421213
- Publication date Dec 19, 2024
- UNITED MICROELECTRONICS CORP.
- Fu-Jung Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NESTED-LOOP PLASMA ENHANCED ATOMIC LAYER DEPOSITION
- Publication number 20240420952
- Publication date Dec 19, 2024
- Applied Materials, Inc.
- Bhaskar Soman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IN-SITU ETCH AND INHIBITION IN PLASMA ENHANCED ATOMIC LAYER DEPOSITION
- Publication number 20240420934
- Publication date Dec 19, 2024
- Applied Materials, Inc.
- Bhaskar Soman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DOPED SILICON OXIDE FOR BOTTOM-UP DEPOSITION
- Publication number 20240420949
- Publication date Dec 19, 2024
- Applied Materials, Inc.
- Woongsik Nam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DENSIFIED SEAM-FREE SILICON-CONTAINING MATERIAL GAP FILL PROCESSES
- Publication number 20240420950
- Publication date Dec 19, 2024
- Applied Materials, Inc.
- Xiang Ji
- H01 - BASIC ELECTRIC ELEMENTS

the material being a silicon oxide

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Electronic devices comprising a compressive dielectric material, an...

Method for depositing film and film deposition system

Semiconductor device and a manufacturing method thereof

Silicon nitride films having reduced interfacial strain

Method of manufacturing semiconductor device, substrate processing...

Gate line plug structures for advanced integrated circuit structure...

Plugs for interconnect lines for advanced integrated circuit struct...

Semiconductor device and method of manufacturing semiconductor device

Semiconductor device and manufacturing method thereof

Switching device and method for manufacturing the same

Plasma etching method using perfluoroisopropyl vinyl ether

Method of depositing silicon oxide films

Multi process air gap formation

Semiconductor device and manufacturing method thereof

Integrated assemblies having vertically-spaced channel material seg...

RF switch device with a sidewall spacer having a low dielectric con...

Additive process for circular printing

Trench capacitor profile to decrease substrate warpage

Cyclic spin-on coating process for forming dielectric material

Semiconductor device and method

Deposition method and deposition apparatus

Integrated assemblies having thicker semiconductor material along o...

Dynamic multi zone flow control for a processing system

Dry etching method and method for producing semiconductor device

Etching method and plasma processing apparatus

High voltage transistor structures

Silicon oxide deposition method

Method of manufacturing semiconductor device and semiconductor devices

Semiconductor structures and manufacturing methods thereof

Transistor structures having conductive structures along pillars of...

Patents Applicationslast 30 patents

METHODS OF FORMING ABRUPT INTERFACES BETWEEN SILICON-AND-CARBON-CON...

SILICON OXIDE DEPOSITION METHOD

HIGH VOLTAGE THREE-DIMENSIONAL DEVICES HAVING DIELECTRIC LINERS

Assemblies Having Conductive Structures Along Pillars of Semiconduc...

CONTACT OVER ACTIVE GATE STRUCTURES FOR ADVANCED INTEGRATED CIRCUIT...

DIRECTIONAL SELECTIVE FILL OF SILICON OXIDE MATERIALS

LOW-PRESSURE OXIDATION TREATMENT METHOD AND DEVICE FOR SEMICONDUCTO...

METHOD FOR PROTECTING ACTIVE LAYERS OF ELECTRONIC CHIPS

ELECTRONIC DEVICE

METHOD AND DEVICE FOR ETCHING SILICON OXIDE

ETCHING METHOD

METHOD FOR DEPOSITING A LAYER ONTO A SUBSTRATE AND SEMICONDUCTOR PR...

METHOD FOR MANUFACTURING SEMICONDUCTOR STACK STRUCTURE WITH ULTRA T...

SELECTIVE DEPOSITION PROCESSES ON SEMICONDUCTOR SUBSTRATES

METHODS AND ASSEMBLIES FOR DEPOSITING MATERIAL IN A GAP

SEMICONDUCTOR DEVICE AND METHOD

MULTI-LAYERED INSULATING FILM STACK

DYNAMIC MULTI ZONE FLOW CONTROL FOR A PROCESSING SYSTEM

HIGH-K ISOLATION OF FIN STRUCTURES

SEMICONDUCTOR DEVICES AND METHODS OF FABRICATING THE SAME

ATOMIC LAYER ETCH AND SELECTIVE DEPOSITION PROCESS FOR EXTREME ULTR...

SUBSTRATE PROCESSING METHOD

SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME

METHOD OF PROCESSING SUBSTRATE, METHOD OF MANUFACTURING SEMICONDUCT...

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME

NESTED-LOOP PLASMA ENHANCED ATOMIC LAYER DEPOSITION

IN-SITU ETCH AND INHIBITION IN PLASMA ENHANCED ATOMIC LAYER DEPOSITION

DOPED SILICON OXIDE FOR BOTTOM-UP DEPOSITION

DENSIFIED SEAM-FREE SILICON-CONTAINING MATERIAL GAP FILL PROCESSES