the material being an electrical insulator

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

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H01L23/08the material being an electrical insulator

Industries

Patents Grantslast 30 patents

Information Patent Grant
Electronic component and method for manufacturing the same
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- Issue date Apr 30, 2024
- Kyocera Corporation
- Sinichiro Kitanishi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package with die cavity substrate
- Patent number 11,923,258
- Issue date Mar 5, 2024
- Texas Instruments Incorporated
- William Robert Morrison
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 11,915,924
- Issue date Feb 27, 2024
- Denso Corporation
- Megumi Suzuki
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor module with reinforced sealing resin
- Patent number 11,887,941
- Issue date Jan 30, 2024
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- Tomohiro Nishimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming integrated circuit package
- Patent number 11,876,026
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- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Airtight package including a package base and a glass cover hermeti...
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- Toru Shiragami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal transfer structures for semiconductor die assemblies
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- Issue date Jan 2, 2024
- Micron Technology, Inc.
- Ed A. Schrock
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hermetically sealed optically transparent wafer-level packages and...
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- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor device
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Information Patent Grant
Semiconductor device and manufacturing method for semiconductor device
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Information Patent Grant
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Information Patent Grant
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Information Patent Grant
Semiconductor device
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Information Patent Grant
Packaged die and assembling method
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Information Patent Grant
Semiconductor memory device
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Information Patent Grant
Semiconductor device including a groove within a resin insulating p...
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Information Patent Grant
Molded air-cavity package and device comprising the same
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- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
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- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display apparatus
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- Issue date Oct 18, 2022
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- Haeyeon Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package, semiconductor apparatus, and method for manu...
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- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lens cap for a transistor outline package
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- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor module embedded in a mold compounded with an op...
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Information Patent Grant
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Information Patent Grant
Package structure for semiconductor device, and semiconductor device
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Information Patent Grant
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- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring board, electronic device package, and electronic device
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- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
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- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method for semiconductor device
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- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal transfer structures for semiconductor die assemblies
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- Issue date Jan 11, 2022
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- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Assembly and method for mounting an electronic component to a subst...
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- Issue date Dec 28, 2021
- Infineon Technologies Austria AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE
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- Yuko NAKAMATA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND ELECTRONIC DEVICE HAVING THE SAME
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Information Patent Application
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Information Patent Application
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD
- Publication number 20230253275
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- Fuji Electric Co., Ltd.
- Nobuhiro HIGASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME
- Publication number 20230207427
- Publication date Jun 29, 2023
- Fuji Electric Co., Ltd.
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POLYCHLOROTRIFLUOROETHYLENE (PCTFE) POLYMER ENCLOSURE FOR AN IMPLAN...
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Information Patent Application
WIRING BASE AND ELECTRONIC DEVICE
- Publication number 20230057427
- Publication date Feb 23, 2023
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QFN PACKAGING STRUCTURE AND QFN PACKAGING METHOD
- Publication number 20230050018
- Publication date Feb 16, 2023
- JCET GROUP CO., LTD.
- YUN GAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HOUSING FOR AN OPTOELECTRONIC DEVICE,AND METHOD FOR PRODUCING SAME,...
- Publication number 20220384282
- Publication date Dec 1, 2022
- SCHOTT AG
- Robert Hettler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGING STRUCTURE, METHOD, DEVICE AND ELECTRONIC PR...
- Publication number 20220293504
- Publication date Sep 15, 2022
- Yibu Semiconductor Co., Ltd.
- Weiping LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE CASE AND METHOD FOR PRODUCING SEMICONDUCTOR MO...
- Publication number 20220293479
- Publication date Sep 15, 2022
- Fuji Electric Co., Ltd.
- Takanori SUGIYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT
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- Kazunori INOUE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GLASS COMPOUND ARRANGEMENT
- Publication number 20220241897
- Publication date Aug 4, 2022
- Schott Primoceler Oy
- Jens Ulrich Thomas
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
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SEMICONDUCTOR DEVICE PACKAGE WITH DIE CAVITY SUBSTRATE
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- TEXAS INSTRUMENTS INCORPORATED
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- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE AND METHOD OF FORMING SAME
- Publication number 20220157676
- Publication date May 19, 2022
- Medtronic, Inc.
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- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20220123713
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- KYOCERA CORPORATION
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- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE
- Publication number 20220108959
- Publication date Apr 7, 2022
- Fuji Electric Co., Ltd.
- Tomohiro NISHIMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL TRANSFER STRUCTURES FOR SEMICONDUCTOR DIE ASSEMBLIES
- Publication number 20220102317
- Publication date Mar 31, 2022
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- Ed A. Schrock
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
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- Publication number 20220044977
- Publication date Feb 10, 2022
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- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MEMORY DEVICE
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- Publication date Jan 6, 2022
- Toshiba Memory Corporation
- Masaru KOYANAGI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE FOR CONTAINING ELECTRONIC COMPONENT, AND ELECTRONIC DEVICE
- Publication number 20210398866
- Publication date Dec 23, 2021
- KYOCERA CORPORATION
- Hironobu FUJIWARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Molded Air-cavity Package and Device Comprising the Same
- Publication number 20210384092
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- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
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Information Patent Application
Packaged Die and Assembling Method
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- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Method of Packaging an Integrated Circuit
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- William C. HOLTON
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Information Patent Application
POWER SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING A POWER SEMIC...
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- Daisuke OYA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING OF A SEMICONDUCTOR DEVICE WITH DUAL SEALING MATERIALS
- Publication number 20210193546
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- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
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Information Patent Application
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- KYOCERA CORPORATION
- Makoto YAMAMOTO
- H01 - BASIC ELECTRIC ELEMENTS

the material being an electrical insulator

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Electronic component and method for manufacturing the same

Semiconductor device package with die cavity substrate

Semiconductor device and method for manufacturing the same

Semiconductor module with reinforced sealing resin

Method of forming integrated circuit package

Airtight package including a package base and a glass cover hermeti...

Thermal transfer structures for semiconductor die assemblies

Hermetically sealed optically transparent wafer-level packages and...

Semiconductor device

Semiconductor device and manufacturing method for semiconductor device

Power semiconductor device and method for fabricating a power semic...

Semiconductor device manufacturing method and semiconductor device

Semiconductor device

Packaged die and assembling method

Semiconductor memory device

Semiconductor device including a groove within a resin insulating p...

Molded air-cavity package and device comprising the same

Housing for an optoelectronic device, and method for producing same...

Display apparatus

Semiconductor package, semiconductor apparatus, and method for manu...

Lens cap for a transistor outline package

Power semiconductor module embedded in a mold compounded with an op...

Crystal resonator device

Package structure for semiconductor device, and semiconductor device

Integrated circuit package and method of forming same

Wiring board, electronic device package, and electronic device

Semiconductor device

Semiconductor device and manufacturing method for semiconductor device

Thermal transfer structures for semiconductor die assemblies

Assembly and method for mounting an electronic component to a subst...

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGE AND ELECTRONIC DEVICE HAVING THE SAME

PACKAGING ARCHITECTURE WITH ACTIVE COOLING

SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME

POLYCHLOROTRIFLUOROETHYLENE (PCTFE) POLYMER ENCLOSURE FOR AN IMPLAN...

WIRING BASE AND ELECTRONIC DEVICE

QFN PACKAGING STRUCTURE AND QFN PACKAGING METHOD

HOUSING FOR AN OPTOELECTRONIC DEVICE,AND METHOD FOR PRODUCING SAME,...

SEMICONDUCTOR PACKAGING STRUCTURE, METHOD, DEVICE AND ELECTRONIC PR...

SEMICONDUCTOR MODULE CASE AND METHOD FOR PRODUCING SEMICONDUCTOR MO...

ELECTRONIC COMPONENT

GLASS COMPOUND ARRANGEMENT

SEMICONDUCTOR DEVICE PACKAGE WITH DIE CAVITY SUBSTRATE

INTEGRATED CIRCUIT PACKAGE AND METHOD OF FORMING SAME

ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR MODULE

THERMAL TRANSFER STRUCTURES FOR SEMICONDUCTOR DIE ASSEMBLIES

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE

SEMICONDUCTOR MEMORY DEVICE

PACKAGE FOR CONTAINING ELECTRONIC COMPONENT, AND ELECTRONIC DEVICE

Molded Air-cavity Package and Device Comprising the Same

SEMICONDUCTOR DEVICE

Packaged Die and Assembling Method

Method of Packaging an Integrated Circuit

POWER SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING A POWER SEMIC...

SEMICONDUCTOR DEVICE

PACKAGING OF A SEMICONDUCTOR DEVICE WITH DUAL SEALING MATERIALS

Package Structure for Semiconductor Device, and Semiconductor Device

WIRING BOARD, ELECTRONIC DEVICE PACKAGE, AND ELECTRONIC DEVICE