the material being an electrical insulator

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

Current Industry

H01L23/08the material being an electrical insulator

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package system and related methods
- Patent number 12,033,904
- Issue date Jul 9, 2024
- Semiconductor Components Industries, L.L.C.
- Yushuang Yao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component and method for manufacturing the same
- Patent number 11,973,486
- Issue date Apr 30, 2024
- Kyocera Corporation
- Sinichiro Kitanishi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package with die cavity substrate
- Patent number 11,923,258
- Issue date Mar 5, 2024
- Texas Instruments Incorporated
- William Robert Morrison
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 11,915,924
- Issue date Feb 27, 2024
- Denso Corporation
- Megumi Suzuki
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor module with reinforced sealing resin
- Patent number 11,887,941
- Issue date Jan 30, 2024
- Fuji Electric Co., Ltd.
- Tomohiro Nishimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming integrated circuit package
- Patent number 11,876,026
- Issue date Jan 16, 2024
- Medtronic, Inc.
- Chunho Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Airtight package including a package base and a glass cover hermeti...
- Patent number 11,871,676
- Issue date Jan 9, 2024
- Nippon Electric Glass Co., Ltd.
- Toru Shiragami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal transfer structures for semiconductor die assemblies
- Patent number 11,862,611
- Issue date Jan 2, 2024
- Micron Technology, Inc.
- Ed A. Schrock
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hermetically sealed optically transparent wafer-level packages and...
- Patent number 11,764,117
- Issue date Sep 19, 2023
- Corning Incorporated
- Robert Alan Bellman
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor device
- Patent number 11,694,938
- Issue date Jul 4, 2023
- Mitsubishi Electric Corporation
- Mariko Ohara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method for semiconductor device
- Patent number 11,676,871
- Issue date Jun 13, 2023
- Mitsubishi Electric Corporation
- Yasutaka Shimizu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor device and method for fabricating a power semic...
- Patent number 11,652,028
- Issue date May 16, 2023
- Infineon Technologies AG
- Andre Wedi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device manufacturing method and semiconductor device
- Patent number 11,640,926
- Issue date May 2, 2023
- Fuji Electric Co., Ltd.
- Yuji Ichimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,626,333
- Issue date Apr 11, 2023
- Fuji Electric Co., Ltd.
- Nobuhiro Higashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged die and assembling method
- Patent number 11,597,647
- Issue date Mar 7, 2023
- TDK Corporation
- Andreas Barbul
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor memory device
- Patent number 11,594,523
- Issue date Feb 28, 2023
- Kioxia Corporation
- Masaru Koyanagi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including a groove within a resin insulating p...
- Patent number 11,569,141
- Issue date Jan 31, 2023
- Mitsubishi Electric Corporation
- Daisuke Oya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Molded air-cavity package and device comprising the same
- Patent number 11,527,451
- Issue date Dec 13, 2022
- Ampleon Netherlands B.V.
- Leonardus Theodorus Maria Raben
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Housing for an optoelectronic device, and method for producing same...
- Patent number 11,515,221
- Issue date Nov 29, 2022
- Schott AG
- Robert Hettler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display apparatus
- Patent number 11,476,297
- Issue date Oct 18, 2022
- Samsung Display Co., Ltd.
- Haeyeon Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package, semiconductor apparatus, and method for manu...
- Patent number 11,437,296
- Issue date Sep 6, 2022
- Kyocera Corporation
- Hiroshi Matsumoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lens cap for a transistor outline package
- Patent number 11,367,692
- Issue date Jun 21, 2022
- Schott AG
- Robert Hettler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor module embedded in a mold compounded with an op...
- Patent number 11,362,008
- Issue date Jun 14, 2022
- Hitachi Energy Switzerland AG
- Dominik Trüssel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Crystal resonator device
- Patent number 11,342,899
- Issue date May 24, 2022
- Daishinku Corporation
- Takuya Kojo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure for semiconductor device, and semiconductor device
- Patent number 11,309,439
- Issue date Apr 19, 2022
- He Bei Sinopack Electronic Tech Co., Ltd.
- Yao Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package and method of forming same
- Patent number 11,270,920
- Issue date Mar 8, 2022
- Medtronic, Inc.
- Chunho Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring board, electronic device package, and electronic device
- Patent number 11,264,293
- Issue date Mar 1, 2022
- Kyocera Corporation
- Makoto Yamamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,244,922
- Issue date Feb 8, 2022
- Mitsubishi Electric Corporation
- Takumi Shigemoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method for semiconductor device
- Patent number 11,244,875
- Issue date Feb 8, 2022
- Mitsubishi Electric Corporation
- Yasutaka Shimizu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal transfer structures for semiconductor die assemblies
- Patent number 11,222,868
- Issue date Jan 11, 2022
- Micron Technology, Inc.
- Ed A. Schrock
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
BIOCOMPATIBLE GLASS SUBSTRATE WITH THROUGH ELECTRODE AND BIOCOMPATI...
- Publication number 20240262738
- Publication date Aug 8, 2024
- Schott Japan Corporation
- Yutaka ONEZAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE MEMBER AND SEMICONDUCTOR DEVICE
- Publication number 20240258249
- Publication date Aug 1, 2024
- Rohm Co., Ltd.
- Shunsuke Akasaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HALF BRIDGE CERAMIC HERMETIC PACKAGE STRUCTURE
- Publication number 20240194546
- Publication date Jun 13, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Kwang-Soo Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GLASS EMBEDDED TRUE AIR CORE INDUCTORS
- Publication number 20240177918
- Publication date May 30, 2024
- Intel Corporation
- Suddhasattwa NAD
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE AND METHOD OF FORMING SAME
- Publication number 20240145322
- Publication date May 2, 2024
- Medtronic, Inc.
- Chunho KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20230411229
- Publication date Dec 21, 2023
- Fuji Electric Co., Ltd.
- Yuko NAKAMATA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND ELECTRONIC DEVICE HAVING THE SAME
- Publication number 20230326817
- Publication date Oct 12, 2023
- DENSO CORPORATION
- Noboru NAGASE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING ARCHITECTURE WITH ACTIVE COOLING
- Publication number 20230282546
- Publication date Sep 7, 2023
- Intel Corporation
- Bernd Waidhas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD
- Publication number 20230253275
- Publication date Aug 10, 2023
- Fuji Electric Co., Ltd.
- Nobuhiro HIGASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME
- Publication number 20230207427
- Publication date Jun 29, 2023
- Fuji Electric Co., Ltd.
- Hideaki TAKAHASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POLYCHLOROTRIFLUOROETHYLENE (PCTFE) POLYMER ENCLOSURE FOR AN IMPLAN...
- Publication number 20230154809
- Publication date May 18, 2023
- Neuralink Corp.
- John W.F. To
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING BASE AND ELECTRONIC DEVICE
- Publication number 20230057427
- Publication date Feb 23, 2023
- KYOCERA CORPORATION
- Toshihiko KITAMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
QFN PACKAGING STRUCTURE AND QFN PACKAGING METHOD
- Publication number 20230050018
- Publication date Feb 16, 2023
- JCET GROUP CO., LTD.
- YUN GAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HOUSING FOR AN OPTOELECTRONIC DEVICE,AND METHOD FOR PRODUCING SAME,...
- Publication number 20220384282
- Publication date Dec 1, 2022
- SCHOTT AG
- Robert Hettler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGING STRUCTURE, METHOD, DEVICE AND ELECTRONIC PR...
- Publication number 20220293504
- Publication date Sep 15, 2022
- Yibu Semiconductor Co., Ltd.
- Weiping LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE CASE AND METHOD FOR PRODUCING SEMICONDUCTOR MO...
- Publication number 20220293479
- Publication date Sep 15, 2022
- Fuji Electric Co., Ltd.
- Takanori SUGIYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT
- Publication number 20220278007
- Publication date Sep 1, 2022
- Murata Manufacturing Co., Ltd.
- Kazunori INOUE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GLASS COMPOUND ARRANGEMENT
- Publication number 20220241897
- Publication date Aug 4, 2022
- Schott Primoceler Oy
- Jens Ulrich Thomas
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE WITH DIE CAVITY SUBSTRATE
- Publication number 20220189836
- Publication date Jun 16, 2022
- TEXAS INSTRUMENTS INCORPORATED
- William Robert Morrison
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE AND METHOD OF FORMING SAME
- Publication number 20220157676
- Publication date May 19, 2022
- Medtronic, Inc.
- Chunho KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20220123713
- Publication date Apr 21, 2022
- KYOCERA CORPORATION
- Sinichiro KITANISHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE
- Publication number 20220108959
- Publication date Apr 7, 2022
- Fuji Electric Co., Ltd.
- Tomohiro NISHIMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL TRANSFER STRUCTURES FOR SEMICONDUCTOR DIE ASSEMBLIES
- Publication number 20220102317
- Publication date Mar 31, 2022
- Micron Technology, Inc.
- Ed A. Schrock
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE
- Publication number 20220044977
- Publication date Feb 10, 2022
- Mitsubishi Electric Corporation
- Yasutaka SHIMIZU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MEMORY DEVICE
- Publication number 20220005789
- Publication date Jan 6, 2022
- Toshiba Memory Corporation
- Masaru KOYANAGI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE FOR CONTAINING ELECTRONIC COMPONENT, AND ELECTRONIC DEVICE
- Publication number 20210398866
- Publication date Dec 23, 2021
- KYOCERA CORPORATION
- Hironobu FUJIWARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Molded Air-cavity Package and Device Comprising the Same
- Publication number 20210384092
- Publication date Dec 9, 2021
- Ampleon Netherlands B.V.
- Leonardus Theodorus Maria Raben
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20210366796
- Publication date Nov 25, 2021
- Fuji Electric Co., Ltd.
- Nobuhiro HIGASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Packaged Die and Assembling Method
- Publication number 20210238028
- Publication date Aug 5, 2021
- TDK Corporation
- Andreas Barbul
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Method of Packaging an Integrated Circuit
- Publication number 20210242097
- Publication date Aug 5, 2021
- Carbon, Inc.
- William C. HOLTON
- B33 - ADDITIVE MANUFACTURING TECHNOLOGY

the material being an electrical insulator

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor package system and related methods

Electronic component and method for manufacturing the same

Semiconductor device package with die cavity substrate

Semiconductor device and method for manufacturing the same

Semiconductor module with reinforced sealing resin

Method of forming integrated circuit package

Airtight package including a package base and a glass cover hermeti...

Thermal transfer structures for semiconductor die assemblies

Hermetically sealed optically transparent wafer-level packages and...

Semiconductor device

Semiconductor device and manufacturing method for semiconductor device

Power semiconductor device and method for fabricating a power semic...

Semiconductor device manufacturing method and semiconductor device

Semiconductor device

Packaged die and assembling method

Semiconductor memory device

Semiconductor device including a groove within a resin insulating p...

Molded air-cavity package and device comprising the same

Housing for an optoelectronic device, and method for producing same...

Display apparatus

Semiconductor package, semiconductor apparatus, and method for manu...

Lens cap for a transistor outline package

Power semiconductor module embedded in a mold compounded with an op...

Crystal resonator device

Package structure for semiconductor device, and semiconductor device

Integrated circuit package and method of forming same

Wiring board, electronic device package, and electronic device

Semiconductor device

Semiconductor device and manufacturing method for semiconductor device

Thermal transfer structures for semiconductor die assemblies

Patents Applicationslast 30 patents

BIOCOMPATIBLE GLASS SUBSTRATE WITH THROUGH ELECTRODE AND BIOCOMPATI...

SEMICONDUCTOR PACKAGE MEMBER AND SEMICONDUCTOR DEVICE

HALF BRIDGE CERAMIC HERMETIC PACKAGE STRUCTURE

GLASS EMBEDDED TRUE AIR CORE INDUCTORS

INTEGRATED CIRCUIT PACKAGE AND METHOD OF FORMING SAME

SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGE AND ELECTRONIC DEVICE HAVING THE SAME

PACKAGING ARCHITECTURE WITH ACTIVE COOLING

SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME

POLYCHLOROTRIFLUOROETHYLENE (PCTFE) POLYMER ENCLOSURE FOR AN IMPLAN...

WIRING BASE AND ELECTRONIC DEVICE

QFN PACKAGING STRUCTURE AND QFN PACKAGING METHOD

HOUSING FOR AN OPTOELECTRONIC DEVICE,AND METHOD FOR PRODUCING SAME,...

SEMICONDUCTOR PACKAGING STRUCTURE, METHOD, DEVICE AND ELECTRONIC PR...

SEMICONDUCTOR MODULE CASE AND METHOD FOR PRODUCING SEMICONDUCTOR MO...

ELECTRONIC COMPONENT

GLASS COMPOUND ARRANGEMENT

SEMICONDUCTOR DEVICE PACKAGE WITH DIE CAVITY SUBSTRATE

INTEGRATED CIRCUIT PACKAGE AND METHOD OF FORMING SAME

ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR MODULE

THERMAL TRANSFER STRUCTURES FOR SEMICONDUCTOR DIE ASSEMBLIES

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE

SEMICONDUCTOR MEMORY DEVICE

PACKAGE FOR CONTAINING ELECTRONIC COMPONENT, AND ELECTRONIC DEVICE

Molded Air-cavity Package and Device Comprising the Same

SEMICONDUCTOR DEVICE

Packaged Die and Assembling Method

Method of Packaging an Integrated Circuit