the material containing tantalum

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H01L21/02183

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

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H01L21/02183the material containing tantalum

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Organometallic compounds and thin film using same
- Patent number 12,195,488
- Issue date Jan 14, 2025
- Merck Patent GmbH
- Seung Won Ha
- C07 - ORGANIC CHEMISTRY
Information Patent Grant
Source/drain feature separation structure
- Patent number 12,178,032
- Issue date Dec 24, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Wen-Chun Keng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing a semiconductor de...
- Patent number 12,176,421
- Issue date Dec 24, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Cheng Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of modifying portions of layer stacks
- Patent number 12,142,487
- Issue date Nov 12, 2024
- Applied Materials, Inc.
- Suketu Arun Parikh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Formation of metal vias on metal lines
- Patent number 12,113,020
- Issue date Oct 8, 2024
- Applied Materials, Inc.
- Ryan Scott Smith
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor Fin cutting process and structures formed thereby
- Patent number 11,990,375
- Issue date May 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shih-Wen Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cuprous oxide devices and formation methods
- Patent number 11,984,315
- Issue date May 14, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Marcus Johannes Henricus van Dal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Voltage regulator circuit including one or more thin-film transistors
- Patent number 11,923,371
- Issue date Mar 5, 2024
- Intel Corporation
- Abhishek A. Sharma
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Methods for depositing an oxide film on a substrate by a cyclical d...
- Patent number 11,923,192
- Issue date Mar 5, 2024
- ASM IP Holding B.V.
- Fu Tang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Integrated circuit device with low threshold voltage
- Patent number 11,901,241
- Issue date Feb 13, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chung-Liang Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and precursors for selective deposition of metal films
- Patent number 11,887,847
- Issue date Jan 30, 2024
- Applied Materials, Inc.
- Kurt Fredrickson
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Semiconductor device, method and machine of manufacture
- Patent number 11,851,749
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jen-Chun Wang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Semiconductor device and method of manufacturing a semiconductor de...
- Patent number 11,757,023
- Issue date Sep 12, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yu-Cheng Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal-containing liner process
- Patent number 11,699,741
- Issue date Jul 11, 2023
- Tokyo Electron Limited
- Yusuke Yoshida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and formation method of semiconductor device with fin str...
- Patent number 11,688,645
- Issue date Jun 27, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kun-Yu Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of modifying portions of layer stacks
- Patent number 11,658,041
- Issue date May 23, 2023
- Applied Materials, Inc.
- Suketu Arun Parikh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Source/drain feature separation structure
- Patent number 11,637,109
- Issue date Apr 25, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Wen-Chun Keng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vertical capacitor structure having capacitor in cavity, and method...
- Patent number 11,631,734
- Issue date Apr 18, 2023
- Advanced Semiconductor Engineering, Inc.
- Syu-Tang Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for filling a gap
- Patent number 11,610,775
- Issue date Mar 21, 2023
- ASM IP Holding B.V.
- Viljami Pore
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Semiconductor device and method of manufacturing a semiconductor de...
- Patent number 11,538,926
- Issue date Dec 27, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yu-Cheng Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and precursors for selective deposition of metal films
- Patent number 11,515,151
- Issue date Nov 29, 2022
- Applied Materials, Inc.
- Kurt Fredrickson
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Semiconductor constructions comprising dielectric material, and met...
- Patent number 11,515,198
- Issue date Nov 29, 2022
- Micron Technology, Inc.
- Gurtej S. Sandhu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and system for forming metal-insulator-metal capacitors
- Patent number 11,502,160
- Issue date Nov 15, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Wei-Liang Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for depositing an oxide film on a substrate by a cyclical d...
- Patent number 11,469,098
- Issue date Oct 11, 2022
- ASM IP Holding B.V.
- Fu Tang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method and apparatus for a thin film dielectric stack
- Patent number 11,444,150
- Issue date Sep 13, 2022
- NXP USA, INC.
- Marina Zelner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor fin cutting process and structures formed thereby
- Patent number 11,380,593
- Issue date Jul 5, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shih-Wen Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, method and machine of manufacture
- Patent number 11,345,991
- Issue date May 31, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jen-Chun Wang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Integrated circuit device with low threshold voltage
- Patent number 11,342,231
- Issue date May 24, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chung-Liang Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating a thick oxide feature on a semiconductor wafer
- Patent number 11,205,695
- Issue date Dec 21, 2021
- Texas Instruments Incorporated
- Elizabeth C. Stewart
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for reducing defects in semiconductor plug in three-dimensi...
- Patent number 11,205,662
- Issue date Dec 21, 2021
- Yangtze Memory Technologies Co., Ltd.
- Fandong Liu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SILICON CARBIDE DEVICE
- Publication number 20250006814
- Publication date Jan 2, 2025
- INFINEON TECHNOLOGIES AG
- Wolfgang LEHNERT
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CUPROUS OXIDE DEVICES AND FORMATION METHODS
- Publication number 20240297037
- Publication date Sep 5, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Marcus Johannes Henricus van Dal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Layered Substrate with Ruthenium Layer and Method for Producing
- Publication number 20240282709
- Publication date Aug 22, 2024
- Zhaoxuan WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Fin Cutting Process and Structures Formed Thereby
- Publication number 20240282638
- Publication date Aug 22, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shih-Wen Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INHIBITOR FOR SELECTIVELY DEPOSITING THIN FILM AND METHOD FOR SELEC...
- Publication number 20240243010
- Publication date Jul 18, 2024
- ADEKA CORPORATION
- JIHYUN LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DEVICE WITH LOW THRESHOLD VOLTAGE
- Publication number 20240186189
- Publication date Jun 6, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chung-Liang CHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR DEPOSITING AN OXIDE FILM ON A SUBSTRATE BY A CYCLICAL D...
- Publication number 20240186138
- Publication date Jun 6, 2024
- ASM IP HOLDING B.V.
- Fu Tang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
VOLTAGE REGULATOR CIRCUIT INCLUDING ONE OR MORE THIN-FILM TRANSISTORS
- Publication number 20240128269
- Publication date Apr 18, 2024
- Intel Corporation
- Abhishek A. SHARMA
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Semiconductor Device, Method and Machine of Manufacture
- Publication number 20240093357
- Publication date Mar 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jen-Chun Wang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
ETCHING METHOD
- Publication number 20240047222
- Publication date Feb 8, 2024
- Hitachi High-Tech Corporation
- Kazunori Shinoda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF DEPOSITING ATOMIC LAYER AND METHOD OF MANUFACTURING SEMIC...
- Publication number 20230420248
- Publication date Dec 28, 2023
- Samsung Electronics Co., Ltd.
- Hyunjun AHN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR PATTERNING SUBSTRATES TO ADJUST VOLTAGE PROPERTIES
- Publication number 20230402291
- Publication date Dec 14, 2023
- Applied Materials, Inc.
- Steven C. H. HUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH BANDWIDTH PACKAGE STRUCTURE
- Publication number 20230395466
- Publication date Dec 7, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Harry-Haklay Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING REGION-SELECTIVE THIN FILM USING SELECTIVATING A...
- Publication number 20230366080
- Publication date Nov 16, 2023
- EGTM CO., LTD.
- Jae Min KIM
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING A SEMICONDUCTOR DE...
- Publication number 20230369464
- Publication date Nov 16, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Cheng SHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device And Method For Manufacturing Semiconductor Device
- Publication number 20230343856
- Publication date Oct 26, 2023
- SEMICONDUCTOR ENERGY LABORATORY CO., LTD.
- Tetsuya KAKEHATA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE
- Publication number 20230326977
- Publication date Oct 12, 2023
- TOKYO ELECTRON LIMITED
- Koji AKIYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHOTORESISTS CONTAINING TANTALUM
- Publication number 20230288798
- Publication date Sep 14, 2023
- LAM RESEARCH CORPORATION
- Eric Calvin Hansen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH FIN STRUCTURES
- Publication number 20230282521
- Publication date Sep 7, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kun-Yu Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND APPARATUS FOR FILLING A GAP
- Publication number 20230207309
- Publication date Jun 29, 2023
- ASM IP HOLDING B.V.
- Viljami PORE
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Methods and Precursors for Selective Deposition of Metal Films
- Publication number 20230170210
- Publication date Jun 1, 2023
- Applied Materials, Inc.
- Kurt Fredrickson
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING A SEMICONDUCTOR DE...
- Publication number 20230132175
- Publication date Apr 27, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Cheng SHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING METAL FLUORIDE-CONTAINING ORGANIC POLYMER...
- Publication number 20230089206
- Publication date Mar 23, 2023
- KIOXIA Corporation
- Norikatsu SASAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING THIN FILM USING SURFACE PROTECTION MATERIAL
- Publication number 20230057512
- Publication date Feb 23, 2023
- EGTM CO., LTD.
- Geun Su LEE
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHODS FOR DEPOSITING AN OXIDE FILM ON A SUBSTRATE BY A CYCLICAL D...
- Publication number 20230015724
- Publication date Jan 19, 2023
- ASM IP HOLDING B.V.
- Fu Tang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
STRUCTURE AND FORMATION METHOD OF SEMICONDUCTOR DEVICE WITH FIN STR...
- Publication number 20220406663
- Publication date Dec 22, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kun-Yu Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Source/Drain Feature Separation Structure
- Publication number 20220367482
- Publication date Nov 17, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wen-Chun Keng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND SYSTEM FOR FORMING METAL-INSULATOR-METAL CAPACITORS
- Publication number 20220367604
- Publication date Nov 17, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wei-Liang CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Fin Cutting Process and Structures Formed Thereby
- Publication number 20220328360
- Publication date Oct 13, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shih-Wen Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device, Method and Machine of Manufacture
- Publication number 20220290291
- Publication date Sep 15, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jen-Chun Wang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

the material containing tantalum

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Organometallic compounds and thin film using same

Source/drain feature separation structure

Semiconductor device and method of manufacturing a semiconductor de...

Methods of modifying portions of layer stacks

Formation of metal vias on metal lines

Semiconductor Fin cutting process and structures formed thereby

Cuprous oxide devices and formation methods

Voltage regulator circuit including one or more thin-film transistors

Methods for depositing an oxide film on a substrate by a cyclical d...

Integrated circuit device with low threshold voltage

Methods and precursors for selective deposition of metal films

Semiconductor device, method and machine of manufacture

Semiconductor device and method of manufacturing a semiconductor de...

Metal-containing liner process

Structure and formation method of semiconductor device with fin str...

Methods of modifying portions of layer stacks

Source/drain feature separation structure

Vertical capacitor structure having capacitor in cavity, and method...

Method and apparatus for filling a gap

Semiconductor device and method of manufacturing a semiconductor de...

Methods and precursors for selective deposition of metal films

Semiconductor constructions comprising dielectric material, and met...

Method and system for forming metal-insulator-metal capacitors

Methods for depositing an oxide film on a substrate by a cyclical d...

Method and apparatus for a thin film dielectric stack

Semiconductor fin cutting process and structures formed thereby

Semiconductor device, method and machine of manufacture

Integrated circuit device with low threshold voltage

Method of fabricating a thick oxide feature on a semiconductor wafer

Methods for reducing defects in semiconductor plug in three-dimensi...

Patents Applicationslast 30 patents

SILICON CARBIDE DEVICE

CUPROUS OXIDE DEVICES AND FORMATION METHODS

Layered Substrate with Ruthenium Layer and Method for Producing

Semiconductor Fin Cutting Process and Structures Formed Thereby

INHIBITOR FOR SELECTIVELY DEPOSITING THIN FILM AND METHOD FOR SELEC...

INTEGRATED CIRCUIT DEVICE WITH LOW THRESHOLD VOLTAGE

METHODS FOR DEPOSITING AN OXIDE FILM ON A SUBSTRATE BY A CYCLICAL D...

VOLTAGE REGULATOR CIRCUIT INCLUDING ONE OR MORE THIN-FILM TRANSISTORS

Semiconductor Device, Method and Machine of Manufacture

ETCHING METHOD

METHOD OF DEPOSITING ATOMIC LAYER AND METHOD OF MANUFACTURING SEMIC...

METHODS FOR PATTERNING SUBSTRATES TO ADJUST VOLTAGE PROPERTIES

HIGH BANDWIDTH PACKAGE STRUCTURE

METHOD FOR FORMING REGION-SELECTIVE THIN FILM USING SELECTIVATING A...

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING A SEMICONDUCTOR DE...

Semiconductor Device And Method For Manufacturing Semiconductor Device

MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE

PHOTORESISTS CONTAINING TANTALUM

SEMICONDUCTOR DEVICE WITH FIN STRUCTURES

METHOD AND APPARATUS FOR FILLING A GAP

Methods and Precursors for Selective Deposition of Metal Films

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING A SEMICONDUCTOR DE...

METHOD FOR MANUFACTURING METAL FLUORIDE-CONTAINING ORGANIC POLYMER...

METHOD FOR FORMING THIN FILM USING SURFACE PROTECTION MATERIAL

METHODS FOR DEPOSITING AN OXIDE FILM ON A SUBSTRATE BY A CYCLICAL D...

STRUCTURE AND FORMATION METHOD OF SEMICONDUCTOR DEVICE WITH FIN STR...

Source/Drain Feature Separation Structure

METHOD AND SYSTEM FOR FORMING METAL-INSULATOR-METAL CAPACITORS

Semiconductor Fin Cutting Process and Structures Formed Thereby

Semiconductor Device, Method and Machine of Manufacture