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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

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H01L23/4926the materials containing semiconductor material

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Patents Grantslast 30 patents

Information Patent Grant
Electronic devices with a redistribution layer and methods of manuf...
- Patent number 11,908,761
- Issue date Feb 20, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Seung Nam Son
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrionic devices with interposer and redistribution layer
- Patent number 11,562,936
- Issue date Jan 24, 2023
- Amkor Technology Singapore Holding Pte Ltd.
- Seung Nam Son
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silicon wafer manufacturing method
- Patent number 10,910,328
- Issue date Feb 2, 2021
- Sumco Corporation
- Bong-Gyun Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 10,643,922
- Issue date May 5, 2020
- Mitsubishi Electric Corporation
- Yoshitaka Otsubo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and manufacturing method of semiconductor pac...
- Patent number 10,553,456
- Issue date Feb 4, 2020
- J-Devices Corporation
- Yasuyuki Takehara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat sink for cooling of power semiconductor modules
- Patent number 10,186,470
- Issue date Jan 22, 2019
- Vestas Wind Systems A/S
- Tusitha Abeyasekera
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Methods of fabricating fan-out wafer level packages and packages fo...
- Patent number 9,202,716
- Issue date Dec 1, 2015
- Samsung Electronics Co., Ltd.
- Jin-Woo Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having an element mounted on a substrate and a...
- Patent number 8,148,738
- Issue date Apr 3, 2012
- Shinko Electric Industries Co., Ltd.
- Kei Murayama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip module
- Patent number 5,365,405
- Issue date Nov 15, 1994
- Siemens Aktiengesellschaft
- Wolfgang Hoenlein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High power multi-layer semiconductive switching device having multi...
- Patent number 4,885,630
- Issue date Dec 5, 1989
- Electric Power Research Institute
- Victor A. K. Temple
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having silicon conductor tracks connected by a...
- Patent number 4,680,619
- Issue date Jul 14, 1987
- U.S. Philips Corporation
- Jan Lohstroh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 4,646,126
- Issue date Feb 24, 1987
- Kabushiki Kaisha Toshiba
- Tetsuya Iizuka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a doped amorphous silicon adhesive layer
- Patent number 4,476,483
- Issue date Oct 9, 1984
- U.S. Philips Corporation
- Everhardus P. G. T. van de Ven
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device using SiC as supporter of a semiconductor element
- Patent number 4,352,120
- Issue date Sep 28, 1982
- Hitachi, Ltd.
- Yasutoshi Kurihara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for forming compound semiconductor bodies
- Patent number 4,261,781
- Issue date Apr 14, 1981
- International Business Machines Corporation
- Harold D. Edmonds
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
3925808
- Patent number 3,925,808
- Issue date Dec 9, 1975
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE,...
- Publication number 20240321774
- Publication date Sep 26, 2024
- Samsung Electronics Co., Ltd.
- Kitae Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE SUPPORT
- Publication number 20240282649
- Publication date Aug 22, 2024
- Tokyo Ohka Kogyo Co., Ltd.
- Yubun Kikuchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICES WITH A REDISTRIBUTION LAYER AND METHODS OF MANUF...
- Publication number 20240194550
- Publication date Jun 13, 2024
- Amkor Technology Singapore Holding Pte. Ltd.
- Seung Nam Son
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPOSITE SUBSTRATE AND SEMICONDUCTOR STRUCTURE
- Publication number 20240047284
- Publication date Feb 8, 2024
- ENKRIS SEMICONDUCTOR, INC.
- Kai CHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICES AND METHODS OF MANUFACTURING ELECTRONIC DEVICES
- Publication number 20230230890
- Publication date Jul 20, 2023
- Amkor Technology Singapore Holding Pte. Ltd.
- Seung Nam Son
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR COMPONENT INCLUDING BACK SIDE INPUT/OUTPUT SIGNAL ROU...
- Publication number 20230170297
- Publication date Jun 1, 2023
- IMEC vzw
- Shih-Hung CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20230040727
- Publication date Feb 9, 2023
- Mitsubishi Electric Corporation
- Yuki HATA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRIONIC DEVICES WITH INTERPOSER AND REDISTRIBUTION LAYER
- Publication number 20220068739
- Publication date Mar 3, 2022
- Amkor Technology Singapore Holding Pte. Ltd.
- Seung Nam Son
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLUX TRANSFER TOOL AND FLUX TRANSFER METHOD
- Publication number 20190275600
- Publication date Sep 12, 2019
- Powertech Technology Inc.
- Kun-Chi Hsu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
PACKAGING STRUCTURE AND PACKAGING METHOD
- Publication number 20190259634
- Publication date Aug 22, 2019
- China Wafer Level CSP Co., Ltd.
- Zhiqi Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20190157182
- Publication date May 23, 2019
- Mitsubishi Electric Corporation
- Yoshitaka OTSUBO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT SINK FOR COOLING OF POWER SEMICONDUCTOR MODULES
- Publication number 20170263534
- Publication date Sep 14, 2017
- VESTAS WIND SYSTEMS A/S
- Tusitha Abeyasekera
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREFOR
- Publication number 20150333041
- Publication date Nov 19, 2015
- PS5 LUXCO S.A.R.L.
- Atsushi Tomohiro
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF LOWERING CAPACITANCES OF CONDUCTIVE APERTURES AND AN INTE...
- Publication number 20130154109
- Publication date Jun 20, 2013
- LSI Corporation
- Ramnath Venkatraman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FABRICATING FAN-OUT WAFER LEVEL PACKAGES AND PACKAGES FO...
- Publication number 20130147063
- Publication date Jun 13, 2013
- Samsung Electronics Co., LTD
- Jin-Woo PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and method of manufacturing semiconductor device
- Publication number 20070290329
- Publication date Dec 20, 2007
- Shinko Electric Industries Co., Ltd.
- Kei Murayama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Thin-film electronic device, in particular power device, and method...
- Publication number 20050242367
- Publication date Nov 3, 2005
- Laurent Clavelier
- H01 - BASIC ELECTRIC ELEMENTS

the materials containing semiconductor material

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Electronic devices with a redistribution layer and methods of manuf...

Electrionic devices with interposer and redistribution layer

Silicon wafer manufacturing method

Semiconductor device

Semiconductor package and manufacturing method of semiconductor pac...

Heat sink for cooling of power semiconductor modules

Methods of fabricating fan-out wafer level packages and packages fo...

Semiconductor device having an element mounted on a substrate and a...

Multi-chip module

High power multi-layer semiconductive switching device having multi...

Semiconductor device having silicon conductor tracks connected by a...

Semiconductor device

Semiconductor device having a doped amorphous silicon adhesive layer

Semiconductor device using SiC as supporter of a semiconductor element

Process for forming compound semiconductor bodies

3925808

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE,...

SUBSTRATE SUPPORT

ELECTRONIC DEVICES WITH A REDISTRIBUTION LAYER AND METHODS OF MANUF...

COMPOSITE SUBSTRATE AND SEMICONDUCTOR STRUCTURE

ELECTRONIC DEVICES AND METHODS OF MANUFACTURING ELECTRONIC DEVICES

SEMICONDUCTOR COMPONENT INCLUDING BACK SIDE INPUT/OUTPUT SIGNAL ROU...

SEMICONDUCTOR DEVICE

ELECTRIONIC DEVICES WITH INTERPOSER AND REDISTRIBUTION LAYER

FLUX TRANSFER TOOL AND FLUX TRANSFER METHOD

PACKAGING STRUCTURE AND PACKAGING METHOD

SEMICONDUCTOR DEVICE

HEAT SINK FOR COOLING OF POWER SEMICONDUCTOR MODULES

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREFOR

METHOD OF LOWERING CAPACITANCES OF CONDUCTIVE APERTURES AND AN INTE...

METHODS OF FABRICATING FAN-OUT WAFER LEVEL PACKAGES AND PACKAGES FO...

Semiconductor device and method of manufacturing semiconductor device

Thin-film electronic device, in particular power device, and method...