the metal substrate being covered by an inorganic insulating layer

Industry

CPC
H05K1/053

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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K1/00Printed circuits

Current Industry

H05K1/053the metal substrate being covered by an inorganic insulating layer

Industries

Patents Grantslast 30 patents

Information Patent Grant
Plasma treatments for flexures of hard disk drives
- Patent number 12,129,567
- Issue date Oct 29, 2024
- Hutchinson Technology Incorporated
- Kurt F. Fischer
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Metal-ceramic substrate with a foil formed for direct cooling as su...
- Patent number 12,087,660
- Issue date Sep 10, 2024
- Heraeus Deutschland GmbH & Co. KG
- Peter Dietrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pure copper plate, copper/ceramic bonded body, and insulated circui...
- Patent number 12,035,469
- Issue date Jul 9, 2024
- Mitsubishi Materials Corporation
- Hirotaka Matsunaga
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Laminated electronic component with differing glass content electrodes
- Patent number 11,935,700
- Issue date Mar 19, 2024
- TDK Corporation
- Noriyuki Saito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal-ceramic substrate and method for producing a metal-ceramic su...
- Patent number 11,807,584
- Issue date Nov 7, 2023
- Rogers Germany GmbH
- Andreas Meyer
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Thermally conductive board
- Patent number 11,778,739
- Issue date Oct 3, 2023
- Polytronics Technology Corp.
- Kuo Hsun Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D-printed ceramics with conductor infusion for ultra-high-speed el...
- Patent number 11,770,906
- Issue date Sep 26, 2023
- Schlumberger Technology Corporation
- John Michael Beshears
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multi-layered diamond-like carbon coating for electronic components
- Patent number 11,729,909
- Issue date Aug 15, 2023
- Honeywell Federal Manufacturing & Technologies, LLC
- Thomas Matthew Selter
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Copper/ceramic bonded body, insulating circuit board, method for pr...
- Patent number 11,638,350
- Issue date Apr 25, 2023
- Mitsubishi Materials Corporation
- Nobuyuki Terasaki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Power semiconductor module and method for producing a power semicon...
- Patent number 11,598,904
- Issue date Mar 7, 2023
- Infineon Technologies AG
- Ivan Nikitin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Carrier substrate with a thick metal interlayer and a cooling struc...
- Patent number 11,564,307
- Issue date Jan 24, 2023
- Rogers Germany GmbH
- Andreas Meyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with a substrate having depressions formed the...
- Patent number 11,521,941
- Issue date Dec 6, 2022
- Fuji Electric Co., Ltd.
- Yoshinori Oda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring substrate and electronic device
- Patent number 11,395,405
- Issue date Jul 19, 2022
- Kyocera Corporation
- Seiichirou Itou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,337,306
- Issue date May 17, 2022
- Fuji Electric Co., Ltd.
- Kenshi Kai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Producing method of wired circuit board
- Patent number 11,091,850
- Issue date Aug 17, 2021
- Nitto Denko Corporation
- Yuu Sugimoto
- G11 - INFORMATION STORAGE
Information Patent Grant
Ceramic circuit board
- Patent number 11,096,278
- Issue date Aug 17, 2021
- DENKA COMPANY LIMITED
- Atsushi Sakai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit substrate arrangement with improved electrical contact
- Patent number 11,071,203
- Issue date Jul 20, 2021
- Robert Bosch GmbH
- Thomas Wiesa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metallic layer as carrier for component embedded in cavity of compo...
- Patent number 11,058,004
- Issue date Jul 6, 2021
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Mike Morianz
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Fluorine-containing substrate, copper clad laminate, and printed ci...
- Patent number 11,051,402
- Issue date Jun 29, 2021
- Nan Ya Plastics Corporation
- Te-Chao Liao
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Substrate for electrical circuits and method for producing a substr...
- Patent number 10,940,671
- Issue date Mar 9, 2021
- Rogers Germany GmbH
- Andreas Meyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Print circuit board and manufacturing method thereof
- Patent number 10,874,022
- Issue date Dec 22, 2020
- FULLPOWER TEK CO., LTD.
- Ying-Chih Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board for integrated LED driver
- Patent number 10,856,376
- Issue date Dec 1, 2020
- Lumileds LLC
- Zhihua Song
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Conformal 3D non-planar multi-layer circuitry
- Patent number 10,827,608
- Issue date Nov 3, 2020
- Lockheed Martin Corporation
- Stephen Gonya
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Substrate for electrical circuits and method for producing a substr...
- Patent number 10,821,704
- Issue date Nov 3, 2020
- Rogers Germany GmbH
- Andreas Meyer
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Printed circuit board for integrated LED driver
- Patent number 10,813,182
- Issue date Oct 20, 2020
- Lumileds LLC
- Zhihua Song
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wired circuit board and production method thereof
- Patent number 10,808,329
- Issue date Oct 20, 2020
- Nitto Denko Corporation
- Yuu Sugimoto
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Ceramic circuit plate and method of making same
- Patent number 10,757,806
- Issue date Aug 25, 2020
- Meng-Hsiu Hsieh
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Insulated metal printed circuit board
- Patent number 10,638,604
- Issue date Apr 28, 2020
- BorgWarner, Inc.
- Jeffrey Carter
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Conformal 3D non-planar multi-layer circuitry
- Patent number 10,568,204
- Issue date Feb 18, 2020
- Lockheed Martin Corporation
- Stephen Gonya
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Surface mount metal unit and electric device including same
- Patent number 10,542,646
- Issue date Jan 21, 2020
- Samsung Electronics Co., Ltd.
- Chang-Joon Lee
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
HEAT-DISSIPATING CIRCUIT BOARD, HEAT-DISSIPATING MEMBER, AND PRODUC...
- Publication number 20240268022
- Publication date Aug 8, 2024
- NOF Corporation
- Toshinobu FUJIMURA
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
PRINTED WIRING BOARD
- Publication number 20240260179
- Publication date Aug 1, 2024
- IBIDEN CO., LTD.
- Jun SAKAI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ASSEMBLY SHEET AND METHOD FOR PRODUCING ASSEMBLY SHEET
- Publication number 20240215155
- Publication date Jun 27, 2024
- Nitto Denko Corporation
- Makoto TSUNEKAWA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DEVICE FOR THERMAL CONDUCTION AND ELECTRICAL ISOLATION
- Publication number 20240121895
- Publication date Apr 11, 2024
- Nitride Global Inc.
- Jason Schmitt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240032201
- Publication date Jan 25, 2024
- Samsung Electro-Mechanics Co., Ltd.
- Do Jae Yoo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PURE COPPER PLATE, COPPER/CERAMIC BONDED BODY, AND INSULATED CIRCUI...
- Publication number 20230114969
- Publication date Apr 13, 2023
- MITSUBISHI MATERIALS CORPORATION
- Hirotaka MATSUNAGA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
3D-PRINTED CERAMICS WITH CONDUCTOR INFUSION FOR ULTRA-HIGH-SPEED EL...
- Publication number 20230069147
- Publication date Mar 2, 2023
- SCHLUMBERGER TECHNOLOGY CORPORATION
- John Michael Beshears
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTI-LAYERED DIAMOND-LIKE CARBON COATING FOR ELECTRONIC COMPONENTS
- Publication number 20230025748
- Publication date Jan 26, 2023
- HONEYWELL FEDERAL MANUFACTURING & TECHNOLOGIES, LLC
- Thomas Matthew Selter
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
COPPER/CERAMIC BONDED BODY, INSULATING CIRCUIT BOARD, METHOD FOR PR...
- Publication number 20220353989
- Publication date Nov 3, 2022
- MITSUBISHI MATERIALS CORPORATION
- Nobuyuki Terasaki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LAMINATED ELECTRONIC COMPONENT
- Publication number 20220319777
- Publication date Oct 6, 2022
- TDK Corporation
- Noriyuki SAITO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20220322525
- Publication date Oct 6, 2022
- Samsung Electro-Mechanics Co., Ltd.
- Jin Uk Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
INSULATION LAYER FORMATION METHOD, MEMBER WITH INSULATION LAYER, RE...
- Publication number 20220251712
- Publication date Aug 11, 2022
- NEXT INNOVATION INC.
- Hiroshi Michiwaki
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
THERMALLY CONDUCTIVE BOARD
- Publication number 20220201856
- Publication date Jun 23, 2022
- POLYTRONICS TECHNOLOGY CORP.
- KUO HSUN CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Carrier with Downsized Through-Via
- Publication number 20220141954
- Publication date May 5, 2022
- Osram Opto Semiconductors GmbH
- Michael Schumann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20210251075
- Publication date Aug 12, 2021
- Fuji Electric Co., Ltd.
- Kenshi KAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING SUBSTRATE AND ELECTRONIC DEVICE
- Publication number 20210243892
- Publication date Aug 5, 2021
- KYOCERA CORPORATION
- Seiichirou ITOU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METAL-CERAMIC SUBSTRATE AND METHOD FOR PRODUCING A METAL-CERAMIC SU...
- Publication number 20210188719
- Publication date Jun 24, 2021
- Rogers Germany GmbH
- Andreas Meyer
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Application
Component Carrier Having a Double Dielectric Layer and Method of Ma...
- Publication number 20210195735
- Publication date Jun 24, 2021
- AT&S (Chongqing) Company Limited
- Jeesoo Mok
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METAL-CERAMIC SUBSTRATE COMPRISING A FOIL AS A BOTTOM SUBSTRATE FAC...
- Publication number 20210125895
- Publication date Apr 29, 2021
- Heraeus Deutschland GmbH & Co. KG
- Peter DIETRICH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20210118822
- Publication date Apr 22, 2021
- Fuji Electric Co., Ltd.
- Yoshinori ODA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CARRIER SUBSTRATE WITH A THICK METAL INTERLAYER AND A COOLING STRUC...
- Publication number 20210084748
- Publication date Mar 18, 2021
- Rogers Germany GmbH
- Vitalij GIL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT SUBSTRATE ARRANGEMENT WITH IMPROVED ELECTRICAL CONTACT
- Publication number 20210076497
- Publication date Mar 11, 2021
- ROBERT BOSCH GmbH
- Thomas Wiesa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLUORINE-CONTAINING SUBSTRATE, COPPER CLAD LAMINATE, AND PRINTED CI...
- Publication number 20200389974
- Publication date Dec 10, 2020
- Nan Ya Plastics Corporation
- TE-CHAO LIAO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CERAMIC CIRCUIT BOARD
- Publication number 20200375029
- Publication date Nov 26, 2020
- DENKA COMPANY LIMITED
- Atsushi SAKAI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DEVICE FOR THERMAL CONDUCTION AND ELECTRICAL ISOLATION
- Publication number 20200352028
- Publication date Nov 5, 2020
- NITRIDE SOLUTIONS INC.
- Jason Schmitt
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CERAMIC CIRCUIT PLATE AND METHOD OF MAKING SAME
- Publication number 20200107438
- Publication date Apr 2, 2020
- MENG-HSIU HSIEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL-CERAMIC BONDED SUBSTRATE, AND MANUFACTURING METHOD THEREOF
- Publication number 20190350078
- Publication date Nov 14, 2019
- MITSUBISHI ELECTRIC CORPORATION
- Yuki WAKABAYASHI
- B22 - CASTING POWDER METALLURGY
Information Patent Application
Metallic Layer as Carrier For Component Embedded in Cavity of Compo...
- Publication number 20190246501
- Publication date Aug 8, 2019
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Mike Morianz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINT CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
- Publication number 20190230798
- Publication date Jul 25, 2019
- FULLPOWER TEK CO.,LTD.
- Ying-Chih Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONFORMAL 3D NON-PLANAR MULTI-LAYER CIRCUITRY
- Publication number 20190215955
- Publication date Jul 11, 2019
- Lockheed Martin Corporation
- Stephen Gonya
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

the metal substrate being covered by an inorganic insulating layer

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Plasma treatments for flexures of hard disk drives

Metal-ceramic substrate with a foil formed for direct cooling as su...

Pure copper plate, copper/ceramic bonded body, and insulated circui...

Laminated electronic component with differing glass content electrodes

Metal-ceramic substrate and method for producing a metal-ceramic su...

Thermally conductive board

3D-printed ceramics with conductor infusion for ultra-high-speed el...

Multi-layered diamond-like carbon coating for electronic components

Copper/ceramic bonded body, insulating circuit board, method for pr...

Power semiconductor module and method for producing a power semicon...

Carrier substrate with a thick metal interlayer and a cooling struc...

Semiconductor device with a substrate having depressions formed the...

Wiring substrate and electronic device

Semiconductor device

Producing method of wired circuit board

Ceramic circuit board

Circuit substrate arrangement with improved electrical contact

Metallic layer as carrier for component embedded in cavity of compo...

Fluorine-containing substrate, copper clad laminate, and printed ci...

Substrate for electrical circuits and method for producing a substr...

Print circuit board and manufacturing method thereof

Printed circuit board for integrated LED driver

Conformal 3D non-planar multi-layer circuitry

Substrate for electrical circuits and method for producing a substr...

Printed circuit board for integrated LED driver

Wired circuit board and production method thereof

Ceramic circuit plate and method of making same

Insulated metal printed circuit board

Conformal 3D non-planar multi-layer circuitry

Surface mount metal unit and electric device including same

Patents Applicationslast 30 patents

HEAT-DISSIPATING CIRCUIT BOARD, HEAT-DISSIPATING MEMBER, AND PRODUC...

PRINTED WIRING BOARD

ASSEMBLY SHEET AND METHOD FOR PRODUCING ASSEMBLY SHEET

DEVICE FOR THERMAL CONDUCTION AND ELECTRICAL ISOLATION

PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME

PURE COPPER PLATE, COPPER/CERAMIC BONDED BODY, AND INSULATED CIRCUI...

3D-PRINTED CERAMICS WITH CONDUCTOR INFUSION FOR ULTRA-HIGH-SPEED EL...

MULTI-LAYERED DIAMOND-LIKE CARBON COATING FOR ELECTRONIC COMPONENTS

COPPER/CERAMIC BONDED BODY, INSULATING CIRCUIT BOARD, METHOD FOR PR...

LAMINATED ELECTRONIC COMPONENT

PRINTED CIRCUIT BOARD

INSULATION LAYER FORMATION METHOD, MEMBER WITH INSULATION LAYER, RE...

THERMALLY CONDUCTIVE BOARD

Carrier with Downsized Through-Via

SEMICONDUCTOR DEVICE

WIRING SUBSTRATE AND ELECTRONIC DEVICE

METAL-CERAMIC SUBSTRATE AND METHOD FOR PRODUCING A METAL-CERAMIC SU...

Component Carrier Having a Double Dielectric Layer and Method of Ma...

METAL-CERAMIC SUBSTRATE COMPRISING A FOIL AS A BOTTOM SUBSTRATE FAC...

SEMICONDUCTOR DEVICE

CARRIER SUBSTRATE WITH A THICK METAL INTERLAYER AND A COOLING STRUC...

CIRCUIT SUBSTRATE ARRANGEMENT WITH IMPROVED ELECTRICAL CONTACT

FLUORINE-CONTAINING SUBSTRATE, COPPER CLAD LAMINATE, AND PRINTED CI...

CERAMIC CIRCUIT BOARD

DEVICE FOR THERMAL CONDUCTION AND ELECTRICAL ISOLATION

CERAMIC CIRCUIT PLATE AND METHOD OF MAKING SAME

METAL-CERAMIC BONDED SUBSTRATE, AND MANUFACTURING METHOD THEREOF

Metallic Layer as Carrier For Component Embedded in Cavity of Compo...

PRINT CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF

CONFORMAL 3D NON-PLANAR MULTI-LAYER CIRCUITRY