the preform being at least partly pre-patterned

Industry

CPC
H01L2224/27438

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/27438the preform being at least partly pre-patterned

Industries

Patents Grantslast 30 patents

Information Patent Grant
Sintering materials and attachment methods using same
- Patent number 11,389,865
- Issue date Jul 19, 2022
- Alpha Assembly Solutions Inc.
- Shamik Ghoshal
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Method for manufacturing metal powder
- Patent number 10,130,995
- Issue date Nov 20, 2018
- Alpha Assembly Solutions Inc.
- Nirmalya Kumar Chaki
- C01 - INORGANIC CHEMISTRY
Information Patent Grant
Methods for bonding substrates
- Patent number 10,131,126
- Issue date Nov 20, 2018
- Applied Materials, Inc.
- Kadthala Ramaya Narendrnath
- B32 - LAYERED PRODUCTS
Information Patent Grant
Integrated device package comprising photo sensitive fill between a...
- Patent number 10,037,941
- Issue date Jul 31, 2018
- QUALCOMM Incorporated
- Vladimir Noveski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic devices with semiconductor die attached with sintered me...
- Patent number 9,875,987
- Issue date Jan 23, 2018
- NXP USA, INC.
- Lakshminarayan Viswanathan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for bonding substrates
- Patent number 9,627,231
- Issue date Apr 18, 2017
- Applied Materials, Inc.
- Kadthala Ramaya Narendrnath
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic devices with semiconductor die coupled to a thermally co...
- Patent number 9,589,860
- Issue date Mar 7, 2017
- NXP USA, INC.
- Lakshminarayan Viswanathan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packaging containing sintering die-attach material
- Patent number 9,583,453
- Issue date Feb 28, 2017
- Ormet Circuits, Inc.
- Catherine Shearer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including a polymer disposed on a carrier
- Patent number 9,318,473
- Issue date Apr 19, 2016
- Infineon Technologies AG
- Joachim Mahler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Preform including a groove extending to an edge of the preform
- Patent number 9,190,384
- Issue date Nov 17, 2015
- TriQuint Semiconductor, Inc.
- Shixi Louis Liu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Miniaturized electrical component comprising an MEMS and an ASIC an...
- Patent number 9,056,760
- Issue date Jun 16, 2015
- EPCOS AG
- Gregor Feiertag
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Die including a groove extending from a via to an edge of the die
- Patent number 8,718,720
- Issue date May 6, 2014
- TriQuint Semiconductor, Inc.
- Shixi Louis Liu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for fabricating flip-attached and underfilled semiconductor...
- Patent number 8,598,029
- Issue date Dec 3, 2013
- Texas Instruments Incorporated
- Masako Watanabe
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Porous adhesive sheet, semiconductor wafer with porous adhesive she...
- Patent number 7,056,406
- Issue date Jun 6, 2006
- Nitto Denko Corporation
- Miho Yamaguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Standoff/mask structure for electrical interconnect
- Patent number 6,998,539
- Issue date Feb 14, 2006
- Xerox Corporation
- John R. Andrews
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Porous adhesive sheet, semiconductor wafer with porous adhesive she...
- Patent number 6,890,617
- Issue date May 10, 2005
- Nitto Denko Corporation
- Miho Yamaguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of making anisotropic conductive elements for use in microe...
- Patent number 6,800,537
- Issue date Oct 5, 2004
- Tessera, Inc.
- Belgacem Haba
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Method of making anisotropic conductive elements for use in microel...
- Patent number 6,518,091
- Issue date Feb 11, 2003
- Tessera, Inc.
- Belgacem Haba
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Rigid adhesive underfill preform, as for a flip-chip device
- Patent number 6,399,178
- Issue date Jun 4, 2002
- Amerasia International Technology, Inc.
- Kevin Kwong-Tai Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of making anisotropic conductive elements for use in microe...
- Patent number 6,190,509
- Issue date Feb 20, 2001
- Tessera, Inc.
- Belgacem Haba
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Assembly aid for mounting packaged integrated circuit devices to pr...
- Patent number 6,084,781
- Issue date Jul 4, 2000
- Micron Electronics, Inc.
- Dean A. Klein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for mounting packaged integrated circuit devices to printed...
- Patent number 5,930,889
- Issue date Aug 3, 1999
- Micron Electronics, Inc.
- Dean A. Klein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnection of a carrier substrate and a semiconductor device
- Patent number 5,920,125
- Issue date Jul 6, 1999
- International Business Machines Corporation
- James Vernon Ellerson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnection of a carrier substrate and a semiconductor device
- Patent number 5,859,470
- Issue date Jan 12, 1999
- International Business Machines Corporation
- James Vernon Ellerson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Assembly aid for mounting packaged integrated circuit devices to pr...
- Patent number 5,796,590
- Issue date Aug 18, 1998
- Micron Electronics, Inc.
- Dean A. Klein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Tape with solder forms for semiconductor devices
- Patent number 5,751,068
- Issue date May 12, 1998
- Intel Corporation
- Jack McMahon
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Tape withh solder forms and methods for transferring solder forms t...
- Patent number 5,662,262
- Issue date Sep 2, 1997
- Intel Corporation
- John Francis McMahon
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Interconnection of a carrier substrate and a semiconductor device
- Patent number 5,553,769
- Issue date Sep 10, 1996
- International Business Machine Corporation
- James V. Ellerson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Tape with solder forms and methods for transferring solder to chip...
- Patent number 5,497,938
- Issue date Mar 12, 1996
- Intel Corporation
- John F. McMahon
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Direct attachment of semiconductor chips to a substrate with a subs...
- Patent number 5,086,558
- Issue date Feb 11, 1992
- International Business Machines Corporation
- Gary W. Grube
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SINTERING FILM FRAMES AND RELATED METHODS
- Publication number 20240304596
- Publication date Sep 12, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Dukyong LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING DOUBLE-SIDED COOLING TYPE POWER MODULE AND...
- Publication number 20230187403
- Publication date Jun 15, 2023
- Hyundai Motor Company
- Kyoung-Kook Hong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PREFORM INCLUDING A GROOVE EXTENDING TO AN EDGE OF THE PREFORM
- Publication number 20140206149
- Publication date Jul 24, 2014
- TriQuint Semiconductor, Inc.
- Shixi Louis Liu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR PACKAGING CONTAINING SINTERING DIE-ATTACH MATERIAL
- Publication number 20140131898
- Publication date May 15, 2014
- Catherine Shearer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR BONDING SUBSTRATES
- Publication number 20140099485
- Publication date Apr 10, 2014
- Kadthala Ramaya NARENDRNATH
- B32 - LAYERED PRODUCTS
Information Patent Application
Manufacturing Method for Semiconductor Device and Semiconductor Device
- Publication number 20130277824
- Publication date Oct 24, 2013
- INFINEON TECHNOLOGIES AG
- Joachim Mahler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Miniaturized Electrical Component Comprising an MEMS and an ASIC an...
- Publication number 20130119492
- Publication date May 16, 2013
- EPCOS AG
- Gregor Feiertag
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Method for Fabricating Flip-Attached and Underfilled Semiconductor...
- Publication number 20120220080
- Publication date Aug 30, 2012
- TEXAS INSTRUMENTS INCORPORATED
- Masako Watanabe
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Application
LOW-COST FLIP-CHIP INTERCONNECT WITH AN INTEGRATED WAFER-APPLIED PH...
- Publication number 20100159644
- Publication date Jun 24, 2010
- Rajiv Carl Dunne
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated circuit die and substrate coupling
- Publication number 20050212105
- Publication date Sep 29, 2005
- Michael J. Walk
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Porous adhesive sheet, semiconductor wafer with porous adhesive she...
- Publication number 20050153101
- Publication date Jul 14, 2005
- NITTO DENKO CORPORATION
- Miho Yamaguchi
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Porous adhesive sheet, semiconductor wafer with porous adhesive she...
- Publication number 20050074578
- Publication date Apr 7, 2005
- NITTO DENKO CORPORATION
- Miho Yamaguchi
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Standoff/mask structure for electrical interconnect
- Publication number 20040238208
- Publication date Dec 2, 2004
- Xerox Corporation.
- John R. Andrews
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Methods of making anisotropic conductive elements for use in microe...
- Publication number 20030102154
- Publication date Jun 5, 2003
- Tessera, Inc.
- Belgacem Haba
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL

the preform being at least partly pre-patterned

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Sintering materials and attachment methods using same

Method for manufacturing metal powder

Methods for bonding substrates

Integrated device package comprising photo sensitive fill between a...

Electronic devices with semiconductor die attached with sintered me...

Methods for bonding substrates

Electronic devices with semiconductor die coupled to a thermally co...

Semiconductor packaging containing sintering die-attach material

Semiconductor device including a polymer disposed on a carrier

Preform including a groove extending to an edge of the preform

Miniaturized electrical component comprising an MEMS and an ASIC an...

Die including a groove extending from a via to an edge of the die

Method for fabricating flip-attached and underfilled semiconductor...

Porous adhesive sheet, semiconductor wafer with porous adhesive she...

Standoff/mask structure for electrical interconnect

Porous adhesive sheet, semiconductor wafer with porous adhesive she...

Methods of making anisotropic conductive elements for use in microe...

Method of making anisotropic conductive elements for use in microel...

Rigid adhesive underfill preform, as for a flip-chip device

Methods of making anisotropic conductive elements for use in microe...

Assembly aid for mounting packaged integrated circuit devices to pr...

Method for mounting packaged integrated circuit devices to printed...

Interconnection of a carrier substrate and a semiconductor device

Interconnection of a carrier substrate and a semiconductor device

Assembly aid for mounting packaged integrated circuit devices to pr...

Tape with solder forms for semiconductor devices

Tape withh solder forms and methods for transferring solder forms t...

Interconnection of a carrier substrate and a semiconductor device

Tape with solder forms and methods for transferring solder to chip...

Direct attachment of semiconductor chips to a substrate with a subs...

Patents Applicationslast 30 patents

SINTERING FILM FRAMES AND RELATED METHODS

METHOD FOR MANUFACTURING DOUBLE-SIDED COOLING TYPE POWER MODULE AND...

PREFORM INCLUDING A GROOVE EXTENDING TO AN EDGE OF THE PREFORM

SEMICONDUCTOR PACKAGING CONTAINING SINTERING DIE-ATTACH MATERIAL

METHODS FOR BONDING SUBSTRATES

Manufacturing Method for Semiconductor Device and Semiconductor Device

Miniaturized Electrical Component Comprising an MEMS and an ASIC an...

Method for Fabricating Flip-Attached and Underfilled Semiconductor...

LOW-COST FLIP-CHIP INTERCONNECT WITH AN INTEGRATED WAFER-APPLIED PH...

Integrated circuit die and substrate coupling

Porous adhesive sheet, semiconductor wafer with porous adhesive she...

Porous adhesive sheet, semiconductor wafer with porous adhesive she...

Standoff/mask structure for electrical interconnect

Methods of making anisotropic conductive elements for use in microe...