The principal constituent being an elastomer

Follow

Industry

CPC
H01L2224/13691

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/13691The principal constituent being an elastomer

Industries

Please log in for detailed analytics

Patents Grantslast 30 patents

Information Patent Grant
Module, method for manufacturing the same, and electronic device
- Patent number 10,115,691
- Issue date Oct 30, 2018
- Canon Kabushiki Kaisha
- Ichiro Kataoka
- H04 - ELECTRIC COMMUNICATION TECHNIQUE

Patents Applicationslast 30 patents

Information Patent Application
MODULE, METHOD FOR MANUFACTURING THE SAME, AND ELECTRONIC DEVICE
- Publication number 20170330852
- Publication date Nov 16, 2017
- Canon Kabushiki Kaisha
- Ichiro Kataoka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package Structure To Enhance Yield of TMI Interconnections
- Publication number 20150255415
- Publication date Sep 10, 2015
- Thomas J. De Bonis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOUNTING STRUCTURE OF CHIP AND MODULE USING THE SAME
- Publication number 20120133042
- Publication date May 31, 2012
- Panasonic Electric Works Co., Ltd.
- Shintarou Hayashi
- B81 - MICRO-STRUCTURAL TECHNOLOGY