The principal constituent being an elastomer

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H01L2224/05191

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/05191The principal constituent being an elastomer

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor apparatus
- Patent number 11,410,946
- Issue date Aug 9, 2022
- Mitsubishi Electric Corporation
- Daisuke Hirata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Final passivation for wafer level warpage and ULK stress reduction
- Patent number 10,622,319
- Issue date Apr 14, 2020
- International Business Machines Corporation
- Ekta Misra
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Final passivation for wafer level warpage and ULK stress reduction
- Patent number 9,754,905
- Issue date Sep 5, 2017
- International Business Machines Corporation
- Ekta Misra
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Compliant interconnects in wafers
- Patent number 9,224,649
- Issue date Dec 29, 2015
- Tessera, Inc.
- Vage Oganesian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Compliant interconnects in wafers
- Patent number 8,796,828
- Issue date Aug 5, 2014
- Tessera, Inc.
- Vage Oganesian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Compliant interconnects in wafers
- Patent number 8,610,264
- Issue date Dec 17, 2013
- Tessera, Inc.
- Vage Oganesian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component mounting structure
- Patent number 8,497,432
- Issue date Jul 30, 2013
- Seiko Epson Corporation
- Nobuaki Hashimoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
FINAL PASSIVATION FOR WAFER LEVEL WARPAGE AND ULK STRESS REDUCTION
- Publication number 20180108626
- Publication date Apr 19, 2018
- International Business Machines Corporation
- Ekta Misra
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPLIANT INTERCONNECTS IN WAFERS
- Publication number 20140342503
- Publication date Nov 20, 2014
- Tessera, Inc.
- Vage Oganesian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPLIANT INTERCONNECTS IN WAFERS
- Publication number 20140099754
- Publication date Apr 10, 2014
- Tessera, Inc.
- Vage Oganesian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP AND FLIP-CHIP PACKAGE COMPRISING THE SAME
- Publication number 20130009286
- Publication date Jan 10, 2013
- Samsung Electronics Co., Ltd.
- Young-lyong Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPLIANT INTERCONNECTS IN WAFERS
- Publication number 20120146210
- Publication date Jun 14, 2012
- Tessera Research LLC
- Vage Oganesian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT MOUNTING STRUCTURE
- Publication number 20100071946
- Publication date Mar 25, 2010
- SEIKO EPSON CORPORATION
- Nobuaki HASHIMOTO
- G02 - OPTICS