The principal constituent being an elastomer

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H01L2224/81491

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/81491The principal constituent being an elastomer

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Patents Grantslast 30 patents

Information Patent Grant
Method to provide die attach stress relief using gold stud bumps
- Patent number 9,754,914
- Issue date Sep 5, 2017
- Rosemount Aerospace Inc.
- Jim Golden
- H01 - BASIC ELECTRIC ELEMENTS