The principal constituent being an elastomer

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H01L2224/13191

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/13191The principal constituent being an elastomer

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Patents Grantslast 30 patents

Information Patent Grant
Method for manufacturing package structure having elastic bump
- Patent number 10,580,665
- Issue date Mar 3, 2020
- NANYA TECHNOLOGY CORPORATION
- Po-Chun Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages with socket plug interconnection structures
- Patent number 9,842,822
- Issue date Dec 12, 2017
- SK hynix Inc.
- Hyeong Seok Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated antennas in wafer level package
- Patent number 9,064,787
- Issue date Jun 23, 2015
- Infineon Technologies AG
- Josef Boeck
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Fine pitch microelectronic contact array and method of making same
- Patent number 8,917,106
- Issue date Dec 23, 2014
- Advantest America, Inc
- Laksmi Namburi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and fabricating method thereof
- Patent number 8,618,658
- Issue date Dec 31, 2013
- Amkor Technology, Inc.
- Jong Sik Paek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated antennas in wafer level package
- Patent number 8,451,618
- Issue date May 28, 2013
- Infineon Technologies AG
- Josef Boeck
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and method of manufacturing semiconductor device
- Patent number 8,378,486
- Issue date Feb 19, 2013
- Renesas Electronics Corporation
- Fumihiro Bekku
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated device and electronic system
- Patent number 7,221,053
- Issue date May 22, 2007
- Infineon Technologies AG
- Thorsten Meyer
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Ball contact for flip-chip device
- Patent number 5,955,784
- Issue date Sep 21, 1999
- Texas Instruments Incorporated
- Anthony M. Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ball contact for flip-chip devices
- Patent number 5,849,132
- Issue date Dec 15, 1998
- Texas Instruments Incorporated
- Anthony M. Chiu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
FINE PITCH MICROELECTRONIC CONTACT ARRAY AND METHOD OF MAKING SAME
- Publication number 20140232427
- Publication date Aug 21, 2014
- TOUCHDOWN TECHNOLOGIES, INC.
- Laksmi Namburi
- G01 - MEASURING TESTING
Information Patent Application
Integrated Antennas in Wafer Level Package
- Publication number 20130241059
- Publication date Sep 19, 2013
- INFINEON TECHNOLOGIES AG
- Josef Boeck
- G01 - MEASURING TESTING
Information Patent Application
SEMICONDUCTOR CHIP AND FLIP-CHIP PACKAGE COMPRISING THE SAME
- Publication number 20130009286
- Publication date Jan 10, 2013
- Samsung Electronics Co., Ltd.
- Young-lyong Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOUNTING STRUCTURE OF CHIP AND MODULE USING THE SAME
- Publication number 20120133042
- Publication date May 31, 2012
- Panasonic Electric Works Co., Ltd.
- Shintarou Hayashi
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
INTEGRATED ANTENNAS IN WAFER LEVEL PACKAGE
- Publication number 20120104574
- Publication date May 3, 2012
- INFINEON TECHNOLOGIES AG
- Josef Boeck
- G01 - MEASURING TESTING
Information Patent Application
Semiconductor device and method of manufacturing semiconductor device
- Publication number 20110095420
- Publication date Apr 28, 2011
- RENESAS ELECTRONICS CORPORATION
- Fumihiro Bekku
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated device and electronic system
- Publication number 20060208357
- Publication date Sep 21, 2006
- Thorsten Meyer
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

The principal constituent being an elastomer

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method for manufacturing package structure having elastic bump

Semiconductor packages with socket plug interconnection structures

Integrated antennas in wafer level package

Fine pitch microelectronic contact array and method of making same

Semiconductor device and fabricating method thereof

Integrated antennas in wafer level package

Semiconductor device and method of manufacturing semiconductor device

Integrated device and electronic system

Ball contact for flip-chip device

Ball contact for flip-chip devices

Patents Applicationslast 30 patents

FINE PITCH MICROELECTRONIC CONTACT ARRAY AND METHOD OF MAKING SAME

Integrated Antennas in Wafer Level Package

SEMICONDUCTOR CHIP AND FLIP-CHIP PACKAGE COMPRISING THE SAME

MOUNTING STRUCTURE OF CHIP AND MODULE USING THE SAME

INTEGRATED ANTENNAS IN WAFER LEVEL PACKAGE

Semiconductor device and method of manufacturing semiconductor device

Integrated device and electronic system