the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/13138the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C

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Patents Grantslast 30 patents

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Information Patent Grant
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Information Patent Grant
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Information Patent Grant
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Patents Applicationslast 30 patents

Information Patent Application
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the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Advanced device assembly structures and methods

Dual solder methodologies for ultrahigh density first level interco...

Dual solder methodologies for ultrahigh density first level interco...

Core material, semiconductor package, and forming method of bump el...

Micro-pillar assisted semiconductor bonding

Method for producing metal ball, joining material, and metal ball

Bump electrode, board which has bump electrodes, and method for man...

Advanced device assembly structures and methods

MEMS devices and methods of forming same

MEMS devices and methods of forming same

Patents Applicationslast 30 patents

Advanced Device Assembly Structures And Methods

DEVICES WITH CONDUCTIVE OR MAGNETIC NANOWIRES FOR LOCALIZED HEATING...

SEMICONDUCTOR PACKAGE INCLUDING UNDERFILL AND METHOD OF FORMING THE...

Advanced Device Assembly Structures And Methods

DUAL SOLDER METHODOLOGIES FOR ULTRAHIGH DENSITY FIRST LEVEL INTERCO...

MEMS DEVICES AND METHODS OF FORMING SAME

ADVANCED DEVICE ASSEMBLY STRUCTURES AND METHODS

CONDUCTIVE INTERCONNECT INCLUDING AN INORGANIC COLLAR

MEMS Devices and Methods of Forming Same