the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C

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H01L2224/83438

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/83438the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C

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the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method and apparatus for creating a bond between objects based on f...

Die with integrated microphone device using through-silicon vias (T...

Clip and related methods

Clip and related methods

Composite substrate with alternating pattern of diamond and metal o...

Chip package and a method for manufacturing a chip package

Patents Applicationslast 30 patents

STACKED SEMICONDUCTOR DEVICE HAVING A HEAT DISSIPATION STRUCTURE

INTEGRATED CIRCUIT PACKAGES WITH HYBRID BONDED DIES AND METHODS OF...

MOLDED ELECTRONIC PACKAGE AND METHOD FOR MANUFACTURING THE SAME

METHOD AND APPARATUS FOR CREATING A BOND BETWEEN OBJECTS BASED ON F...

CLIP AND RELATED METHODS

CHIP PACKAGE AND A METHOD FOR MANUFACTURING A CHIP PACKAGE

CONDUCTIVE BONDING MATERIAL, METHOD OF MANUFACTURING THE SAME, AND...