the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C

Follow

Industry

CPC
H01L2224/83438

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/83438the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C

Industries

Patents Grantslast 30 patents

Information Patent Grant
Method and apparatus for creating a bond between objects based on f...
- Patent number 10,923,454
- Issue date Feb 16, 2021
- Seyed Amir Paknejad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die with integrated microphone device using through-silicon vias (T...
- Patent number 10,455,308
- Issue date Oct 22, 2019
- Intel Corporation
- Kevin J. Lee
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Clip and related methods
- Patent number 10,121,763
- Issue date Nov 6, 2018
- Semiconductor Components Industries, LLC
- Chee Hiong Chew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Clip and related methods
- Patent number 9,911,712
- Issue date Mar 6, 2018
- Semiconductor Components Industries, LLC
- Chee Hiong Chew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Composite substrate with alternating pattern of diamond and metal o...
- Patent number 9,812,375
- Issue date Nov 7, 2017
- II-VI Incorporated
- Wen-Qing Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package and a method for manufacturing a chip package
- Patent number 8,815,647
- Issue date Aug 26, 2014
- Infineon Technologies AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
INTEGRATED CIRCUIT PACKAGES WITH HYBRID BONDED DIES AND METHODS OF...
- Publication number 20240113088
- Publication date Apr 4, 2024
- Intel Corporation
- Omkar Karhade
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOLDED ELECTRONIC PACKAGE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20230326835
- Publication date Oct 12, 2023
- NEXPERIA B.V.
- Hing Suan Cheam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND APPARATUS FOR CREATING A BOND BETWEEN OBJECTS BASED ON F...
- Publication number 20210167035
- Publication date Jun 3, 2021
- Seyed Amir Paknejad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CLIP AND RELATED METHODS
- Publication number 20180197836
- Publication date Jul 12, 2018
- Semiconductor Components Industries, LLC
- Chee Hiong CHEW
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE AND A METHOD FOR MANUFACTURING A CHIP PACKAGE
- Publication number 20140061669
- Publication date Mar 6, 2014
- INFINEON TECHNOLOGIES AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE BONDING MATERIAL, METHOD OF MANUFACTURING THE SAME, AND...
- Publication number 20130313309
- Publication date Nov 28, 2013
- Masayuki KITAJIMA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR