Membership
Tour
Register
Log in
the principal constituent melting at a temperature of greater than or equal to 950 C and less than 1550 C
Follow
Industry
CPC
H01L2924/15738
This industry / category may be too specific. Please go to a parent level for more data
Parent Industries
H
ELECTRICITY
H01
Electric elements
H01L
SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
H01L2924/00
Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
Current Industry
H01L2924/15738
the principal constituent melting at a temperature of greater than or equal to 950 C and less than 1550 C
Industries
Overview
Organizations
People
Information
Impact
Please log in for detailed analytics
Patents Grants
last 30 patents
Information
Patent Grant
Semiconductor package with routing patch and conductive interconnec...
Patent number
11,901,335
Issue date
Feb 13, 2024
Amkor Technology Singapore Holding Pte Ltd.
Michael Kelly
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of forming a chip package and chip package
Patent number
11,862,600
Issue date
Jan 2, 2024
Infineon Technologies AG
Thorsten Scharf
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Silicon interposer sandwich structure for ESD, EMC, and EMC shieldi...
Patent number
11,810,893
Issue date
Nov 7, 2023
International Business Machines Corporation
William Emmett Bernier
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor element bonding structure, method for producing semic...
Patent number
11,810,885
Issue date
Nov 7, 2023
Waseda University
Kohei Tatsumi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Thermosetting silicone resin composition and die attach material fo...
Patent number
11,566,132
Issue date
Jan 31, 2023
Shin-Etsu Chemical Co., Ltd.
Tatsuya Yamazaki
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package system and related methods
Patent number
11,342,237
Issue date
May 24, 2022
Semiconductor Components Industries, LLC
Yushuang Yao
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and method of manufacturing semiconductor device
Patent number
11,315,854
Issue date
Apr 26, 2022
Fuji Electric Co., Ltd.
Ryoichi Kato
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Structures for providing electrical isolation in semiconductor devices
Patent number
11,296,055
Issue date
Apr 5, 2022
Taiwan Semiconductor Manufacturing Company Limited
Chan-Hong Chern
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package with high routing density patch
Patent number
11,289,451
Issue date
Mar 29, 2022
Amkor Technology Singapore Holding Pte Ltd.
Michael Kelly
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Circuit card attachment for enhanced robustness of thermal performance
Patent number
11,224,927
Issue date
Jan 18, 2022
International Business Machines Corporation
Michael Gaynes
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Silicon interposer sandwich structure for ESD, EMC, and EMC shieldi...
Patent number
11,049,841
Issue date
Jun 29, 2021
International Business Machines Corporation
William Emmett Bernier
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of fabricating packaging substrate
Patent number
11,031,329
Issue date
Jun 8, 2021
PHOENIX PIONEER TECHNOLOGY CO., LTD.
Chu-Chin Hu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device package and method of manufacturing the same
Patent number
10,903,151
Issue date
Jan 26, 2021
Advanced Semiconductor Engineering, Inc.
Wen-Long Lu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package with high routing density patch
Patent number
10,672,740
Issue date
Jun 2, 2020
Amkor Technology, Inc.
Michael Kelly
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor chip, method for manufacturing semiconductor chip, in...
Patent number
10,658,321
Issue date
May 19, 2020
Kabushiki Kaisha Toshiba
Hidekazu Inoto
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor die assemblies with heat sink and associated systems...
Patent number
10,636,678
Issue date
Apr 28, 2020
Micron Technology, Inc.
Wei Zhou
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Capacitive interconnect in a semiconductor package
Patent number
10,609,813
Issue date
Mar 31, 2020
Intel Corporation
Eng Huat Goh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Seed layer free nanoporous metal deposition for bonding
Patent number
10,566,214
Issue date
Feb 18, 2020
Facebook Technologies, LLC
John Michael Goward
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Grant
Structures and methods for providing electrical isolation in semico...
Patent number
10,504,874
Issue date
Dec 10, 2019
Taiwan Semiconductor Manufacturing Company Limited
Chan-Hong Chern
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Bonding wire for semiconductor device
Patent number
10,468,370
Issue date
Nov 5, 2019
Nippon Micrometal Corporation
Takashi Yamada
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Low cost substrates
Patent number
10,283,484
Issue date
May 7, 2019
Invensas Corporation
Cyprian Emeka Uzoh
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Grant
Semiconductor die assemblies with heat sink and associated systems...
Patent number
10,153,178
Issue date
Dec 11, 2018
Micron Technology, Inc.
Wei Zhou
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Bent-bridge semiconductive apparatus
Patent number
10,141,265
Issue date
Nov 27, 2018
Intel IP Corporation
Bernd Waidhas
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package including a semiconductor die having redistri...
Patent number
10,103,076
Issue date
Oct 16, 2018
Infineon Technologies Americas Corp.
Mark Pavier
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package with high routing density patch
Patent number
10,074,630
Issue date
Sep 11, 2018
Amkor Technology, Inc.
Michael Kelly
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor component support and semiconductor device
Patent number
10,068,821
Issue date
Sep 4, 2018
Nichia Corporation
Takeaki Shirase
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package having a trench penetrating a main body
Patent number
10,056,325
Issue date
Aug 21, 2018
Advanced Semiconductor Engineering, Inc.
Chin-Li Kao
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Interposers, semiconductor devices, method for manufacturing interp...
Patent number
10,056,322
Issue date
Aug 21, 2018
Toppan Printing Co., Ltd.
Koji Imayoshi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Power package lid
Patent number
10,008,473
Issue date
Jun 26, 2018
Qorvo US, Inc.
Robert Charles Dry
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Packaging substrate and method of fabricating the same
Patent number
10,002,823
Issue date
Jun 19, 2018
PHOENIX & CORPORATION
Chu-Chin Hu
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
INTEGRATED CIRCUIT STRUCTURES HAVING ALTERNATIVE CARRIERS FOR DUAL-...
Publication number
20250006568
Publication date
Jan 2, 2025
Intel Corporation
Ehren MANNEBACH
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE WITH HIGH ROUTING DENSITY PATCH
Publication number
20240266324
Publication date
Aug 8, 2024
Amkor Technology Singapore Holding Pte. Ltd.
Michael Kelly
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
HYBRID BONDING OF A THIN SEMICONDUCTOR DIE
Publication number
20240170442
Publication date
May 23, 2024
ASMPT Singapore Pte. Ltd.
Yiu Ming CHEUNG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CHIP ARRANGEMENT AND METHOD FOR FORMING A SINTERED CONTACT CONNECTION
Publication number
20230369284
Publication date
Nov 16, 2023
Pac Tech - Packaging Technologies GmbH
RICARDO GEELHAAR
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Structures for Providing Electrical Isolation in Semiconductor Devices
Publication number
20220271015
Publication date
Aug 25, 2022
Taiwan Semiconductor Manufacturing Company Limited
Chan-Hong Chern
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE SYSTEM AND RELATED METHODS
Publication number
20220246486
Publication date
Aug 4, 2022
Semiconductor Components Industries, LLC
Yushuang YAO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE WITH HIGH ROUTING DENSITY PATCH
Publication number
20220223563
Publication date
Jul 14, 2022
Amkor Technology Singapore Holding Pte. Ltd.
Michael Kelly
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD OF FORMING A CHIP PACKAGE AND CHIP PACKAGE
Publication number
20220108974
Publication date
Apr 7, 2022
Thorsten Scharf
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Silicon Interposer Sandwich Structure for ESD, EMC, and EMC Shieldi...
Publication number
20210288022
Publication date
Sep 16, 2021
International Business Machines Corporation
William EMMETT BERNIER
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR ELEMENT BONDING STRUCTURE, METHOD FOR PRODUCING SEMIC...
Publication number
20210225794
Publication date
Jul 22, 2021
Waseda University
Kohei Tatsumi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD FOR PRODUCING A SUBSTRATE PLATE, SUBSTRATE PLATE, METHOD FOR...
Publication number
20210210416
Publication date
Jul 8, 2021
Heraeus Deutschland GmbH & Co. KG
Ronald EISELE
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
Publication number
20210066158
Publication date
Mar 4, 2021
Fuji Electric Co., Ltd.
Ryoichi KATO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
THERMOSETTING SILICONE RESIN COMPOSITION AND DIE ATTACH MATERIAL FO...
Publication number
20210062002
Publication date
Mar 4, 2021
Shin-Etsu Chemical Co., Ltd.
Tatsuya YAMAZAKI
C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information
Patent Application
SEMICONDUCTOR PACKAGE WITH HIGH ROUTING DENSITY PATCH
Publication number
20200411475
Publication date
Dec 31, 2020
Amkor Technology, Inc.
Michael Kelly
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Structures for Providing Electrical Isolation in Semiconductor Devices
Publication number
20200066685
Publication date
Feb 27, 2020
Taiwan Semiconductor Manufacturing Company Limited
Chan-Hong Chern
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME
Publication number
20190363040
Publication date
Nov 28, 2019
Advanced Semiconductor Engineering, Inc.
Wen-Long LU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DIE ASSEMBLIES WITH HEAT SINK AND ASSOCIATED SYSTEMS...
Publication number
20190109019
Publication date
Apr 11, 2019
Micron Technology, Inc.
Wei Zhou
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE WITH HIGH ROUTING DENSITY PATCH
Publication number
20190043829
Publication date
Feb 7, 2019
Amkor Technology, Inc.
Michael Kelly
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE INCLUDING A SEMICONDUCTOR DIE HAVING REDISTRI...
Publication number
20180366380
Publication date
Dec 20, 2018
Infineon Technologies Americas Corp.
Mark Pavier
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Silicon Interposer Sndwich Structure for ESD, EMI, and EMC Shieldin...
Publication number
20180350768
Publication date
Dec 6, 2018
International Business Machines Corporation
WILLIAM E. BERNIER
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGING SUBSTRATE AND METHOD OF FABRICATING THE SAME
Publication number
20180240747
Publication date
Aug 23, 2018
PHOENIX & CORPORATION
Chu-Chin Hu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGING SUBSTRATE AND METHOD OF FABRICATING THE SAME
Publication number
20180240748
Publication date
Aug 23, 2018
PHOENIX & CORPORATION
Chu-Chin Hu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
BENT-BRIDGE SEMICONDUCTIVE APPARATUS
Publication number
20180190589
Publication date
Jul 5, 2018
Bernd Waidhas
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR SYSTEM AND DEVICE PACKAGE INCLUDING INTERCONNECT STRU...
Publication number
20180138113
Publication date
May 17, 2018
Advanced Semiconductor Engineering, Inc.
Chien-Hua Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
STRUCTURES AND METHODS FOR PROVIDING ELECTRICAL ISOLATION IN SEMICO...
Publication number
20180033776
Publication date
Feb 1, 2018
Taiwan Semiconductor Manufacturing Company Limited
Chan-Hong Chern
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Silicon Interposer Sandwich Structure for ESD, EMC, and EMC Shieldi...
Publication number
20170358552
Publication date
Dec 14, 2017
International Business Machines Corporation
William E. BREINER
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CAPACITIVE INTERCONNECT IN A SEMICONDUCTOR PACKAGE
Publication number
20170359893
Publication date
Dec 14, 2017
Intel Corporation
Eng Huat Goh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGING SUBSTRATE AND METHOD OF FABRICATING THE SAME
Publication number
20170338174
Publication date
Nov 23, 2017
PHOENIX PIONEER TECHNOLOGY CO., LTD
CHU-CHIN HU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DIE ASSEMBLIES WITH HEAT SINK AND ASSOCIATED SYSTEMS...
Publication number
20170323802
Publication date
Nov 9, 2017
Micron Technology, Inc.
Wei Zhou
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MODULE WITH EXTERNAL SHIELD AND BACK-SPILL BARRIER FOR PROTECTING C...
Publication number
20170280561
Publication date
Sep 28, 2017
Avago Technologies General IP (Singapore) PTE. LTD.
Sarah Haney
H01 - BASIC ELECTRIC ELEMENTS