the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/05138the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C

Industries

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Information Patent Grant
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Information Patent Grant
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- Hitachi, Ltd.
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the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Advanced device assembly structures and methods

Array substrate and method for manufacturing the same, and display...

Semiconductor device and method of manufacturing the same

Method for manufacturing semiconductor device with metallization st...

Hermetically sealed MEMS device and its fabrication

Bond rings in semiconductor devices and methods of forming same

Bond rings in semiconductor devices and methods of forming same

Semiconductor devices having through electrodes, methods of fabrica...

Power semiconductor devices

Advanced device assembly structures and methods

Structures, architectures, systems, methods, algorithms and softwar...

Pad structure for semiconductor devices

Semiconductor gas sensor

Structures, architectures, systems, methods, algorithms and softwar...

Structures, architectures, systems, methods, algorithms and softwar...

Structures, architectures, systems, methods, algorithms and softwar...

Semiconductor device with passivation layer covering wiring layer

Semiconductor device having an electrode pad, a bump provided above...

Structures, architectures, systems, methods, algorithms and softwar...

Testable electrostatic discharge protection circuits

Manufacturing and testing of electrostatic discharge protection cir...

Bonding pad structure and method of forming the same

Testable electrostatic discharge protection circuits

Release resistant electrical interconnections for MEMS devices

Bonding pad

Microcap wafer-level package with vias

Extended bond pads with a plurality of perforations

Semiconductor integrated circuit device having a gate array with a...

Semiconductor integrated circuit device

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE, POWER CONVERSION DEVICE, AND METHOD OF MANUFA...

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE, POWER CONVERSION DEVICE, AND METHOD OF MANUFA...

ALUMINUM BONDING WIRE FOR POWER SEMICONDUCTOR

METHOD OF FABRICATING DISPLAY PANEL

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

REWORKABLE INTER-SUBSTRATE BOND STRUCTURE

ELECTRONIC COMPONENT

DISPLAY DEVICE AND MANUFACTURING METHOD OF THE SAME

DISPLAY DEVICE AND TILE-SHAPED DISPLAY DEVICE INCLUDING THE SAME

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE

DISPLAY DEVICE

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

DISPLAY DEVICE

ARRAY SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME, AND DISPLAY...

SEMICONDUCTOR DEVICES AND DATA STORAGE SYSTEMS INCLUDING THE SAME

Advanced Device Assembly Structures And Methods

METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE WITH METALLIZATION ST...

Bond Rings in Semiconductor Devices and Methods of Forming Same

BOND RINGS IN SEMICONDUCTOR DEVICES AND METHODS OF FORMING SAME

GRAPHENE-BASED METAL DIFFUSION BARRIER

METHOD OF FABRICATING SEMICONDUCTOR PACKAGE

POWER SEMICONDUCTOR DEVICES

ADVANCED DEVICE ASSEMBLY STRUCTURES AND METHODS

SEMICONDUCTOR GAS SENSOR

PAD STRUCTURE FOR SEMICONDUCTOR DEVICES

Maskless Process for Solder Bump Production

Maskless Process for Solder Bumps Production

Semiconductor device and manufacturing method of the same

Nitride-based semiconductor light-emitting device and method of man...