the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C

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H01L2224/05638

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/05638the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C

Industries

Patents Grantslast 30 patents

Information Patent Grant
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Information Patent Grant
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Information Patent Grant
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Information Patent Grant
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- Chia-Pao Shu
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Information Patent Grant
Package systems having an opening in a substrate thereof and manufa...
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- Chia-Pao Shu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Chip package and fabrication method thereof
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Information Patent Grant
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Information Patent Grant
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Information Patent Grant
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- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
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Methods for directly bonding together semiconductor structures, and...
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- H01 - BASIC ELECTRIC ELEMENTS
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- Issue date Jul 30, 2013
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- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
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- Joon Su Kim
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Information Patent Grant
Metallization with tailorable coefficient of thermal expansion
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- Issue date Mar 27, 2012
- Medtronic, Inc.
- David A. Ruben
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE

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the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device

Semiconductor structure and manufacturing method thereof

Palladium-coated copper bonding wire, wire bonding structure, semic...

Semiconductor package for improving bonding reliability

Method and apparatus for creating a bond between objects based on f...

Micro-pillar assisted semiconductor bonding

Double-sided vertical semiconductor device with thinned substrate

Wafer-level flip chip device packages and related methods

Semiconductor chip, semiconductor package and fabricating method th...

Package systems

Method of stacking a plurality of dies to form a stacked semiconduc...

Multi-wafer pair anodic bonding apparatus and method

Wafer-level flip chip device packages and related methods

Methods of fabricating wafer-level flip chip device packages

Double-sided vertical semiconductor device with thinned substrate

Package-in-packages and methods of formation thereof

Package systems and manufacturing methods thereof

Package systems having an opening in a substrate thereof and manufa...

Chip package and fabrication method thereof

Methods of fabricating wafer-level flip chip device packages

Methods for directly bonding together semiconductor structures, and...

Chip package with heavily doped region and fabrication method thereof

Package systems having a eutectic bonding material and manufacturin...

Fastening device

Substrate bonding with metal germanium silicon material

Semiconductor gas sensor

Methods for directly bonding together semiconductor structures, and...

Chip package with heavily doped regions and fabrication method thereof

Semiconductor device and fabricating method thereof

Metallization with tailorable coefficient of thermal expansion

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE

SEMICONDUCTOR ELEMENT WITH BONDING LAYER HAVING LOW-K DIELECTRIC MA...

ELECTRONIC COMPONENT AND APPARATUS

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DIE HAVING AN OPTICAL DETECTION MARKER AND METHOD OF...

METAL FILM AND MANUFACTURING METHOD OF THE METAL FILM, AND SEMICOND...

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND SEMICONDUCTOR MODULE

SEMICONDUCTOR PACKAGE INCLUDING UNDERFILL AND METHOD OF FORMING THE...

PHASE CHANGE INTERCONNECTS AND METHODS FOR FORMING THE SAME

DISPLAY DEVICE

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR PACKAGE FOR IMPROVING BONDING RELIABILITY

PALLADIUM-COATED COPPER BONDING WIRE, WIRE BONDING STRUCTURE, SEMIC...

METHOD AND APPARATUS FOR CREATING A BOND BETWEEN OBJECTS BASED ON F...

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE HAVING NON-CIRCULAR CONNECTORS

MULTI-WAFER PAIR ANODIC BONDING APPARATUS AND METHOD

Integrated High Voltage Isolation Using Low Value Capacitors

METHOD OF FABRICATING SEMICONDUCTOR PACKAGE

PACKAGE SYSTEMS AND MANUFACTURING METHODS THEREOF

Package-In-Packages and Methods of Formation Thereof

METHODS OF FABRICATING WAFER-LEVEL FLIP CHIP DEVICE PACKAGES

WAFER-LEVEL FLIP CHIP DEVICE PACKAGES AND RELATED METHODS

Vertical Semiconductor Device with Thinned Substrate

FASTENING DEVICE

SEMICONDUCTOR GAS SENSOR

CHIP PACKAGE AND FABRICATION METHOD THEREOF