the principal constituent melting at a temperature of less than 400°C

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/29101the principal constituent melting at a temperature of less than 400°C

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Patents Grantslast 30 patents

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the principal constituent melting at a temperature of less than 400°C

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Package with different types of semiconductor dies attached to a fl...

Method of forming a packaged semiconductor device having enhanced w...

Electronic device with multi-layer contact and system

Semiconductor device

Semiconductor device

Methods for attachment and devices produced using the methods

Power module package and method of manufacturing the same

Semiconductor device

Method of forming a packaged semiconductor device having enhanced w...

Component and method of manufacturing a component using an ultrathi...

Semiconductor device manufacturing method and soldering support jig

Semiconductor device

Semiconductor device

Power module package

Package with different types of semiconductor dies attached to a fl...

Encapsulated leadless package having an at least partially exposed...

Power module and power convertor

Semiconductor device packaging assembly, lead frame strip and unit...

Power module and power convertor

Method and apparatus for creating a bond between objects based on f...

Methods for attachment and devices produced using the methods

Semiconductor device and method of forming interposer frame over se...

Wire bonding apparatus

Semiconductor device including sensor and driving terminals spaced...

Semiconductor device and method of manufacturing the same

Electronics package with improved thermal performance

Method of forming a packaged semiconductor device having enhanced w...

Semiconductor device

Method of manufacturing semiconductor device and semiconductor device

Semiconductor module

Patents Applicationslast 30 patents

CIRCUIT BOARD

PHASE CHANGING THERMAL INTERFACE MATERIAL ALLOY CREATED IN-SITU

LIQUID METAL WELLS FOR INTERCONNECT ARCHITECTURES

METHOD OF FORMING A PACKAGED SEMICONDUCTOR DEVICE HAVING ENHANCED W...

ELECTRONIC DEVICE WITH MULTI-LAYER CONTACT AND SYSTEM

SEMICONDUCTOR DEVICE

METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE, SEMICONDUCTOR PACKAG...

SEMICONDUCTOR DEVICE

METHOD OF FORMING A PACKAGED SEMICONDUCTOR DEVICE HAVING ENHANCED W...

SEMICONDUCTOR DEVICE

METHODS FOR ATTACHMENT AND DEVICES PRODUCED USING THE METHODS

PACKAGE WITH DIFFERENT TYPES OF SEMICONDUCTOR DIES ATTACHED TO A FL...

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THEREOF

METHOD AND APPARATUS FOR CREATING A BOND BETWEEN OBJECTS BASED ON F...

METHOD OF FORMING A PACKAGED SEMICONDUCTOR DEVICE HAVING ENHANCED W...

SEMICONDUCTOR DEVICE

METHOD OF FORMING A PACKAGED SEMICONDUCTOR DEVICE HAVING ENHANCED W...

SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND SOLDERING SUPPORT JIG

Electronic Device with Multi-Layer Contact and System

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

Component and Method of Manufacturing a Component Using an Ultrathi...

Method for Producing Electronic Device With Multi-Layer Contact

SEMICONDUCTOR DEVICE

Method Of Fabricating Low-Profile Footed Power Package

FLIP-CHIP, FACE-UP AND FACE-DOWN CENTERBOND MEMORY WIREBOND ASSEMBLIES

BONDING STRUCTURE AND METHOD

FILM, METHOD FOR ITS PRODUCTION, AND METHOD FOR PRODUCING SEMICONDU...

Directly Cooled Substrates for Semiconductor Modules