the principal constituent melting at a temperature of less than 400°C

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/13101the principal constituent melting at a temperature of less than 400°C

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- G02 - OPTICS

the principal constituent melting at a temperature of less than 400°C

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Light emitting diodes and methods

Package structure

Method of forming a packaged semiconductor device having enhanced w...

Low warpage high density trench capacitor

Secure semiconductor integration and method for making thereof

Semiconductor package and method manufacturing the same

Circuit board with bridge chiplets

Semiconductor device and manufacturing method thereof

Package structure for heat dissipation

Semiconductor package having a high reliability

Semiconductor device

Semiconductor package and method manufacturing the same

Semiconductor device assembly with die support structures

Semiconductor packages and methods of forming same

High density interconnect device and method

Integrated circuit package with electro-optical interconnect circuitry

Semiconductor device and manufacturing method thereof

Method for manufacturing package structure

Semiconductor package and manufacturing method of the same

Ultra small molded module integrated with die by module-on-wafer as...

Semiconductor device with transmissive layer and manufacturing meth...

Land structure for semiconductor package and method therefor

Semiconductor package having a high reliability

Semiconductor device encapsulated by molding material attached to r...

Fan-out semiconductor package

Method of forming a packaged semiconductor device having enhanced w...

Package structure for heat dissipation

Semiconductor package with layer structures, antenna layer and elec...

Semiconductor chip

Method of manufacturing package-on-package device and bonding appar...

Patents Applicationslast 30 patents

LOW WARPAGE HIGH DENSITY TRENCH CAPACITOR

METHOD OF FORMING A PACKAGED SEMICONDUCTOR DEVICE HAVING ENHANCED W...

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SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE ASSEMBLY WITH DIE SUPPORT STRUCTURES

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

INTEGRATED CIRCUIT PACKAGE WITH ELECTRO-OPTICAL INTERCONNECT CIRCUITRY

HIGH DENSITY INTERCONNECT DEVICE AND METHOD

SEMICONDUCTOR DEVICE WITH TRANSMISSIVE LAYER AND MANUFACTURING METH...

SEMICONDUCTOR PACKAGES AND METHODS OF FORMING SAME

CIRCUIT BOARD

SEMICONDUCTOR PACKAGES AND METHODS OF FORMING SAME

ULTRA SMALL MOLDED MODULE INTEGRATED WITH DIE BY MODULE-ON-WAFER AS...

METHOD OF FORMING A PACKAGED SEMICONDUCTOR DEVICE HAVING ENHANCED W...

LAND STRUCTURE FOR SEMICONDUCTOR PACKAGE AND METHOD THEREFOR

LIQUID METAL SHIELD FOR FINE PITCH INTERCONNECTS

Low Warpage High Density Trench Capacitor

HIGH DENSITY INTERCONNECT DEVICE AND METHOD

3D INTEGRATED CIRCUIT (3DIC) STRUCTURE

Semiconductor Package

METHOD FOR MANUFACTURING PACKAGE STRUCTURE

SEMICONDUCTOR DEVICE WITH OPTICALLY-TRANSMISSIVE LAYER AND MANUFACT...

3D HETEROGENEOUS INTEGRATIONS AND METHODS OF MAKING THEREOF

PACKAGE STRUCTURE

ENHANCED SEMICONDUCTOR STRUCTURES

METHOD OF FORMING A PACKAGED SEMICONDUCTOR DEVICE HAVING ENHANCED W...

ULTRA SMALL MOLDED MODULE INTEGRATED WITH DIE BY MODULE-ON-WAFER AS...

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