the principal constituent melting at a temperature of less than 400°C

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/13101the principal constituent melting at a temperature of less than 400°C

Industries

Patents Grantslast 30 patents

Information Patent Grant
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- Micron Technology, Inc.
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- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
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Information Patent Grant
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- Tahoe Research, LTD.
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Information Patent Grant
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Information Patent Grant
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- Amkor Technology Singapore Holding Pte Ltd.
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Information Patent Grant
Method for manufacturing package structure
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Information Patent Grant
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Information Patent Grant
Ultra small molded module integrated with die by module-on-wafer as...
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Information Patent Grant
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Information Patent Grant
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Information Patent Grant
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Information Patent Grant
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Information Patent Grant
Package structure for heat dissipation
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- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
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Information Patent Grant
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- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
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- Junho Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Surface treatment method and apparatus for semiconductor packaging
- Patent number 11,776,880
- Issue date Oct 3, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Horng Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Elastic wave device
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- Masatoshi Nakagawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder removal from semiconductor devices
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- Issue date Sep 5, 2023
- Micron Technology, Inc.
- Mark E. Tuttle
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
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- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low warpage high density trench capacitor
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Information Patent Grant
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Information Patent Grant
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Information Patent Grant
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- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having a high reliability
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- Issue date May 30, 2023
- Samsung Electronics Co., Ltd.
- Ji-Hwan Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High density interconnect device and method
- Patent number 11,664,320
- Issue date May 30, 2023
- Tahoe Research, LTD.
- Mihir K Roy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
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- Issue date May 23, 2023
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- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Uniform pressure gang bonding method
- Patent number 11,637,082
- Issue date Apr 25, 2023
- eLux, Inc.
- Wei-Yuan Ma
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
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- H01 - BASIC ELECTRIC ELEMENTS
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- H01 - BASIC ELECTRIC ELEMENTS
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- LG Innotek Co., Ltd.
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- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES AND METHODS OF FORMING SAME
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- Taiwan Semiconductor Manufacturing Co., Ltd.
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LAND STRUCTURE FOR SEMICONDUCTOR PACKAGE AND METHOD THEREFOR
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LIQUID METAL SHIELD FOR FINE PITCH INTERCONNECTS
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- Bok Eng CHEAH
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Low Warpage High Density Trench Capacitor
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Information Patent Application
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- Mihir K. ROY
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3D INTEGRATED CIRCUIT (3DIC) STRUCTURE
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Semiconductor Package
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- Chengwei Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING PACKAGE STRUCTURE
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- Yi-Da TSAI
- H01 - BASIC ELECTRIC ELEMENTS
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SEMICONDUCTOR DEVICE WITH OPTICALLY-TRANSMISSIVE LAYER AND MANUFACT...
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- Amkor Technology Singapore Holding Pte. Ltd.
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- H01 - BASIC ELECTRIC ELEMENTS
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3D HETEROGENEOUS INTEGRATIONS AND METHODS OF MAKING THEREOF
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PACKAGE STRUCTURE
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- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chung-Shi Liu
- H01 - BASIC ELECTRIC ELEMENTS

the principal constituent melting at a temperature of less than 400°C

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device assembly with die support structures

Semiconductor packages and methods of forming same

High density interconnect device and method

Integrated circuit package with electro-optical interconnect circuitry

Semiconductor device and manufacturing method thereof

Method for manufacturing package structure

Semiconductor package and manufacturing method of the same

Ultra small molded module integrated with die by module-on-wafer as...

Semiconductor device with transmissive layer and manufacturing meth...

Land structure for semiconductor package and method therefor

Semiconductor package having a high reliability

Semiconductor device encapsulated by molding material attached to r...

Fan-out semiconductor package

Method of forming a packaged semiconductor device having enhanced w...

Package structure for heat dissipation

Semiconductor package with layer structures, antenna layer and elec...

Semiconductor chip

Method of manufacturing package-on-package device and bonding appar...

Surface treatment method and apparatus for semiconductor packaging

Elastic wave device

Solder removal from semiconductor devices

Method of manufacturing semiconductor package structure

Low warpage high density trench capacitor

Light-emitting device package including a lead frame

Semiconductor chip

Method for solder bridging elimination for bulk solder C2S intercon...

Semiconductor package having a high reliability

High density interconnect device and method

Semiconductor package

Uniform pressure gang bonding method

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE WITH TRANSMISSIVE LAYER AND MANUFACTURING METH...

SEMICONDUCTOR PACKAGES AND METHODS OF FORMING SAME

CIRCUIT BOARD

SEMICONDUCTOR PACKAGES AND METHODS OF FORMING SAME

ULTRA SMALL MOLDED MODULE INTEGRATED WITH DIE BY MODULE-ON-WAFER AS...

METHOD OF FORMING A PACKAGED SEMICONDUCTOR DEVICE HAVING ENHANCED W...

LAND STRUCTURE FOR SEMICONDUCTOR PACKAGE AND METHOD THEREFOR

LIQUID METAL SHIELD FOR FINE PITCH INTERCONNECTS

Low Warpage High Density Trench Capacitor

HIGH DENSITY INTERCONNECT DEVICE AND METHOD

3D INTEGRATED CIRCUIT (3DIC) STRUCTURE

Semiconductor Package

METHOD FOR MANUFACTURING PACKAGE STRUCTURE

SEMICONDUCTOR DEVICE WITH OPTICALLY-TRANSMISSIVE LAYER AND MANUFACT...

3D HETEROGENEOUS INTEGRATIONS AND METHODS OF MAKING THEREOF

PACKAGE STRUCTURE

ENHANCED SEMICONDUCTOR STRUCTURES

METHOD OF FORMING A PACKAGED SEMICONDUCTOR DEVICE HAVING ENHANCED W...

ULTRA SMALL MOLDED MODULE INTEGRATED WITH DIE BY MODULE-ON-WAFER AS...

SEMICONDUCTOR DEVICE HAVING A REDISTRIBUTION LINE

SECURE SEMICONDUCTOR INTEGRATION AND METHOD FOR MAKING THEREOF

INTEGRATED CIRCUIT PACKAGE WITH ELECTRO-OPTICAL INTERCONNECT CIRCUITRY

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD OF THE SAME

3D INTEGRATED CIRCUIT (3DIC) STRUCTURE

FLIP-CHIP ON LEADFRAME HAVING PARTIALLY ETCHED LANDING SITES

QUANTUM COMPUTING ASSEMBLIES

SEMICONDUCTOR CHIP

HIGH DENSITY INTERCONNECT DEVICE AND METHOD

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR PACKAGES AND METHODS OF FORMING SAME