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the principal constituent melting at a temperature of less than 400°C

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  • CPC
  • H01L2224/85401
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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/85401the principal constituent melting at a temperature of less than 400°C
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Patents Grantslast 30 patents

  • Information Patent Grant

    Semiconductor device grid array package
    • Patent number 9,252,114
    • Issue date Feb 2, 2016
    • FREESCALE SEMICONDUCTOR, INC.
    • Zhijie Wang
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Stack type semiconductor package
    • Patent number 9,171,827
    • Issue date Oct 27, 2015
    • Samsung Electronics Co., Ltd.
    • Jin-Ho Lee
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Semiconductor package having optimized wire bond positioning
    • Patent number 6,812,580
    • Issue date Nov 2, 2004
    • FREESCALE SEMICONDUCTOR, INC.
    • Robert J. Wenzel
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    3672047
    • Patent number 3,672,047
    • Issue date Jun 27, 1972
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents