3672047

Information

• Patent Grant
• 3672047

• References
• Source

• Patent Number

  3,672,047

• Date Filed

  Not available

• Date Issued

  Tuesday, June 27, 1972
  52 years ago

• CPC

  • H01L24/85 - using a wire connector
  • B23K20/005 - Capillary welding
  • B23K20/007 - Ball bonding
  • H01L21/4853 - Connection or disconnection of other leads to or from a metallisation
  • H01L24/03 - Manufacturing methods
  • H01L24/05 - of an individual bonding area
  • H01L24/48 - of an individual wire connector
  • B23K2201/38 - Conductors
  • B23K2201/40 - Semiconductor devices
  • H01L24/45 - of an individual wire connector
  • H01L24/78 - Apparatus for connecting with wire connectors
  • H01L2224/04042 - Bonding areas specifically adapted for wire connectors
  • H01L2224/05624 - Aluminium [Al] as principal constituent
  • H01L2224/45015 - being circular
  • H01L2224/45139 - Silver (Ag) as principal constituent
  • H01L2224/45144 - Gold (Au) as principal constituent
  • H01L2224/48463 - the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
  • H01L2224/4847 - the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
  • H01L2224/48601 - the principal constituent melting at a temperature of less than 400°C
  • H01L2224/48624 - Aluminium (Al) as principal constituent
  • H01L2224/78301 - Capillary
  • H01L2224/85099 - Ambient temperature
  • H01L2224/85203 - Thermocompression bonding
  • H01L2224/85205 - Ultrasonic bonding
  • H01L2224/85365 - Shape
  • H01L2224/85401 - the principal constituent melting at a temperature of less than 400°C
  • H01L2224/85801 - Soldering or alloying
  • H01L2224/85815 - Reflow soldering
  • H01L2224/8592 - Applying permanent coating
  • H01L2924/01005 - Boron [B]
  • H01L2924/01006 - Carbon [C]
  • H01L2924/01013 - Aluminum [Al]
  • H01L2924/01019 - Potassium [K]
  • H01L2924/01027 - Cobalt [Co]
  • H01L2924/01028 - Nickel [Ni]
  • H01L2924/01033 - Arsenic [As]
  • H01L2924/01039 - Yttrium [Y]
  • H01L2924/01047 - Silver [Ag]
  • H01L2924/0105 - Tin [Sn]
  • H01L2924/01057 - Lanthanum [La]
  • H01L2924/01074 - Tungsten [W]
  • H01L2924/01078 - Platinum [Pt]
  • H01L2924/01079 - Gold [Au]
  • H01L2924/01082 - Lead [Pb]
  • H01L2924/01322 - Eutectic Alloys
  • H01L2924/014 - Solder alloys
  • H01L2924/14 - Integrated circuits
  • H01L2924/15787 - Ceramics
  • H01L2924/2076 - equal to or larger than 100 microns
  • Y10T29/49169 - Assembling electrical component directly to terminal or elongated conductor

• US Classifications

  • 029 - Metal working
  • 228 - Metal fusion bonding
  • 257 - Active solid-state devices