the removal being a chemical etching step

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H01L21/31055

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

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H01L21/31055the removal being a chemical etching step

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Patents Grantslast 30 patents

Information Patent Grant
Embedded metal insulator metal structure
- Patent number 12,170,241
- Issue date Dec 17, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Feng-Wei Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 12,142,485
- Issue date Nov 12, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hung-Pin Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device structure with dielectric stressor
- Patent number 12,132,115
- Issue date Oct 29, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shi-Ning Ju
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for planarizing a substrate using a combined wet etch and c...
- Patent number 12,100,598
- Issue date Sep 24, 2024
- Tokyo Electron Limited
- Shan Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fin field-effect transistor with void and method of forming the same
- Patent number 12,068,398
- Issue date Aug 20, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsu Ming Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate processing apparatus, substrate processing system, and su...
- Patent number 12,062,563
- Issue date Aug 13, 2024
- Ebara Corporation
- Itsuki Kobata
- B24 - GRINDING POLISHING
Information Patent Grant
Planar passivation layers
- Patent number 12,046,527
- Issue date Jul 23, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Po-Shu Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of reducing parasitic capacitance in semiconductor devices
- Patent number 12,009,263
- Issue date Jun 11, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Kai-Hsuan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for metal gate cut and structure thereof
- Patent number 11,996,293
- Issue date May 28, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Pei-Yu Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
CMP system and method of use
- Patent number 11,984,323
- Issue date May 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Te-Chien Hou
- B24 - GRINDING POLISHING
Information Patent Grant
Method for selectively manufacturing material layer and target pattern
- Patent number 11,976,364
- Issue date May 7, 2024
- Industry-University Cooperation Foundation Hanyang University Erica Campus
- Tae Joo Park
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Semiconductor device and method for preparing semiconductor device
- Patent number 11,955,371
- Issue date Apr 9, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Jingwen Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor memory and method of manufacturing the same
- Patent number 11,937,437
- Issue date Mar 19, 2024
- Kioxia Corporation
- Masahiro Kiyotoshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Two dimension material fin sidewall
- Patent number 11,929,286
- Issue date Mar 12, 2024
- TESSERA LLC
- Sami Rosenblatt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Via connection to a partially filled trench
- Patent number 11,929,258
- Issue date Mar 12, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shih-Ming Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vertical device having a protrusion source
- Patent number 11,916,131
- Issue date Feb 27, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- De-Fang Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact formation method and related structure
- Patent number 11,915,971
- Issue date Feb 27, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chao-Hsun Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Replacement gate methods that include treating spacers to widen gate
- Patent number 11,908,695
- Issue date Feb 20, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shu-Han Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor manufacturing apparatus
- Patent number 11,897,077
- Issue date Feb 13, 2024
- Kioxia Corporation
- Tsutomu Miki
- B24 - GRINDING POLISHING
Information Patent Grant
Polishing pad, semiconductor fabricating device and fabricating met...
- Patent number 11,883,926
- Issue date Jan 30, 2024
- Kioxia Corporation
- Takahiko Kawasaki
- B24 - GRINDING POLISHING
Information Patent Grant
Spacer etching process for integrated circuit design
- Patent number 11,854,820
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ru-Gun Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for improving planarity using selective atomic...
- Patent number 11,823,910
- Issue date Nov 21, 2023
- Tokyo Electron Limited
- David O'Meara
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Polishing liquid, polishing liquid set, and polishing method
- Patent number 11,767,448
- Issue date Sep 26, 2023
- Resonac Corporation
- Takaaki Matsumoto
- B24 - GRINDING POLISHING
Information Patent Grant
Method of manufacturing semiconductor device
- Patent number 11,764,285
- Issue date Sep 19, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yi-Chuan Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit structure
- Patent number 11,749,679
- Issue date Sep 5, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yi-Juei Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of semiconductor integrated circuit fabrication
- Patent number 11,735,477
- Issue date Aug 22, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ming-Feng Shieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Endpoint detection for chemical mechanical polishing based on spect...
- Patent number 11,715,672
- Issue date Aug 1, 2023
- Applied Materials, Inc.
- Dominic J. Benvegnu
- B24 - GRINDING POLISHING
Information Patent Grant
Slurry
- Patent number 11,688,607
- Issue date Jun 27, 2023
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chun-Hung Liao
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for metal gate cut and structure thereof
- Patent number 11,676,819
- Issue date Jun 13, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Pei-Yu Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
FinFET with dummy fins and methods of making the same
- Patent number 11,677,014
- Issue date Jun 13, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chun-Hao Hsu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
FINFET WITH DUMMY FINS AND METHODS OF MAKING THE SAME
- Publication number 20240395910
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Co., LTD
- Chun-Hao Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE WITH DIELECTRIC STRESSOR
- Publication number 20240387740
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shi-Ning JU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240379374
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hung-Pin Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Fin Field-Effect Transistor With Void and Method of Forming The Same
- Publication number 20240371980
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsu Ming Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED METAL INSULATOR METAL STRUCTURE
- Publication number 20240363505
- Publication date Oct 31, 2024
- TAIWAN SEMICONDUTOR MANUFACTURING COMPANY, LTD.
- Feng-Wei KUO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLANAR PASSIVATION LAYERS
- Publication number 20240355695
- Publication date Oct 24, 2024
- Taiwan Semiconductor Manufacturing Co., LTD
- Po-Shu WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF REDUCING PARASITIC CAPACITANCE IN SEMICONDUTOR DEVICES
- Publication number 20240332084
- Publication date Oct 3, 2024
- Taiwan Semiconductor Manufacturing Co., LTD
- Kai-Hsuan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR METAL GATE CUT AND STRUCTURE THEREOF
- Publication number 20240332022
- Publication date Oct 3, 2024
- Taiwan Semiconductor Manufacturing Co., LTD
- Pei-Yu Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CMP System and Method of Use
- Publication number 20240274440
- Publication date Aug 15, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Te-Chien Hou
- B24 - GRINDING POLISHING
Information Patent Application
VIA CONNECTION TO A PARTIALLY FILLED TRENCH
- Publication number 20240213034
- Publication date Jun 27, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shih-Ming Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GRAPHENE DEVICE AND METHOD OF FABRICATING A GRAPHENE DEVICE
- Publication number 20240213351
- Publication date Jun 27, 2024
- Graphenea Semiconductor S.L.U.
- Elías Torres Alonso
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTACT FORMATION METHOD AND RELATED STRUCTURE
- Publication number 20240194520
- Publication date Jun 13, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chao-Hsun WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Forming a Vertical Device
- Publication number 20240186400
- Publication date Jun 6, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- DE-FANG CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MEMORY AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240188307
- Publication date Jun 6, 2024
- KIOXIA Corporation
- Masahiro KIYOTOSHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING RAISED STRIP-SHAPED ACTIVE AREAS
- Publication number 20240170292
- Publication date May 23, 2024
- Shanghai Huali Integrated Circuit Corporation
- Yang HE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Replacement Gate Methods That Include Treating Spacers to Widen Gate
- Publication number 20240145250
- Publication date May 2, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shu-Han Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR PLANARIZING A SUBSTRATE USING A COMBINED WET ETCH AND C...
- Publication number 20240087907
- Publication date Mar 14, 2024
- TOKYO ELECTRON LIMITED
- Shan Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR IMPROVING PLANARITY USING SELECTIVE ATOMIC...
- Publication number 20240047218
- Publication date Feb 8, 2024
- TOKYO ELECTRON LIMITED
- David O'Meara
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
LAYER DEPOSITION METHOD AND LAYER DEPOSITION APPARATUS
- Publication number 20240030024
- Publication date Jan 25, 2024
- Samsung Electronics Co., Ltd.
- Intak Jeon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE HAVING ISLAND STRUCTURE
- Publication number 20230420264
- Publication date Dec 28, 2023
- NANYA TECHNOLOGY CORPORATION
- CHEN-CHENG CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE, TEST STRUCTURE, MANUFACTURING METHOD AND T...
- Publication number 20230378064
- Publication date Nov 23, 2023
- Changxin Memory Technologies, Inc.
- Deyuan XIAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS
- Publication number 20230377953
- Publication date Nov 23, 2023
- Tokyo Electron Limited
- Hiroki MURAKAMI
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE WITH BARRIER LAYER AND METHOD FOR FO...
- Publication number 20230369226
- Publication date Nov 16, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cai-Ling WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHEMICAL MECHANICAL POLISHING METHOD AND METHOD FOR FABRICATING SEM...
- Publication number 20230352310
- Publication date Nov 2, 2023
- SAMSUNG ELECTRONICS., LTD.
- Yearin Byun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Finfet With Dummy Fins And Methods Of Making The Same
- Publication number 20230327005
- Publication date Oct 12, 2023
- Taiwan Semiconductor Manufacturing Co., LTD
- Chun-Hao Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATING SEMICONDUCTOR STRUCTURE, AND SEMICONDUCTOR S...
- Publication number 20230326760
- Publication date Oct 12, 2023
- Changxin Memory Technologies, Inc.
- Chenming XU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING A SEMICONDUCTOR USING SLURRY
- Publication number 20230290641
- Publication date Sep 14, 2023
- Taiwan Semiconductor Manufacturing company Ltd.
- CHUN-HUNG LIAO
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Fin Field-Effect Transistor With Void and Method of Forming The Same
- Publication number 20230268427
- Publication date Aug 24, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsu Ming Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING DEEP TRENCH STRUCTURE AND METHOD OF MAN...
- Publication number 20230207394
- Publication date Jun 29, 2023
- KEY FOUNDRY CO., LTD.
- Yang Beom KANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20230197464
- Publication date Jun 22, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hung-Pin Chang
- H01 - BASIC ELECTRIC ELEMENTS

the removal being a chemical etching step

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Embedded metal insulator metal structure

Semiconductor structure and manufacturing method thereof

Semiconductor device structure with dielectric stressor

Methods for planarizing a substrate using a combined wet etch and c...

Fin field-effect transistor with void and method of forming the same

Substrate processing apparatus, substrate processing system, and su...

Planar passivation layers

Methods of reducing parasitic capacitance in semiconductor devices

Method for metal gate cut and structure thereof

CMP system and method of use

Method for selectively manufacturing material layer and target pattern

Semiconductor device and method for preparing semiconductor device

Semiconductor memory and method of manufacturing the same

Two dimension material fin sidewall

Via connection to a partially filled trench

Vertical device having a protrusion source

Contact formation method and related structure

Replacement gate methods that include treating spacers to widen gate

Semiconductor manufacturing apparatus

Polishing pad, semiconductor fabricating device and fabricating met...

Spacer etching process for integrated circuit design

Systems and methods for improving planarity using selective atomic...

Polishing liquid, polishing liquid set, and polishing method

Method of manufacturing semiconductor device

Integrated circuit structure

Method of semiconductor integrated circuit fabrication

Endpoint detection for chemical mechanical polishing based on spect...

Slurry

Method for metal gate cut and structure thereof

FinFET with dummy fins and methods of making the same

Patents Applicationslast 30 patents

FINFET WITH DUMMY FINS AND METHODS OF MAKING THE SAME

SEMICONDUCTOR DEVICE STRUCTURE WITH DIELECTRIC STRESSOR

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

Fin Field-Effect Transistor With Void and Method of Forming The Same

EMBEDDED METAL INSULATOR METAL STRUCTURE

PLANAR PASSIVATION LAYERS

METHODS OF REDUCING PARASITIC CAPACITANCE IN SEMICONDUTOR DEVICES

METHOD FOR METAL GATE CUT AND STRUCTURE THEREOF

CMP System and Method of Use

VIA CONNECTION TO A PARTIALLY FILLED TRENCH

GRAPHENE DEVICE AND METHOD OF FABRICATING A GRAPHENE DEVICE

CONTACT FORMATION METHOD AND RELATED STRUCTURE

Method of Forming a Vertical Device

SEMICONDUCTOR MEMORY AND METHOD OF MANUFACTURING THE SAME

METHOD FOR MANUFACTURING RAISED STRIP-SHAPED ACTIVE AREAS

Replacement Gate Methods That Include Treating Spacers to Widen Gate

METHODS FOR PLANARIZING A SUBSTRATE USING A COMBINED WET ETCH AND C...

SYSTEMS AND METHODS FOR IMPROVING PLANARITY USING SELECTIVE ATOMIC...

LAYER DEPOSITION METHOD AND LAYER DEPOSITION APPARATUS

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE HAVING ISLAND STRUCTURE

SEMICONDUCTOR STRUCTURE, TEST STRUCTURE, MANUFACTURING METHOD AND T...

SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS

SEMICONDUCTOR DEVICE STRUCTURE WITH BARRIER LAYER AND METHOD FOR FO...

CHEMICAL MECHANICAL POLISHING METHOD AND METHOD FOR FABRICATING SEM...

Finfet With Dummy Fins And Methods Of Making The Same

METHOD FOR FABRICATING SEMICONDUCTOR STRUCTURE, AND SEMICONDUCTOR S...

METHOD FOR MANUFACTURING A SEMICONDUCTOR USING SLURRY

Fin Field-Effect Transistor With Void and Method of Forming The Same

SEMICONDUCTOR DEVICE HAVING DEEP TRENCH STRUCTURE AND METHOD OF MAN...

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF