the second connecting process involving a bump connector

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H01L2224/92143

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/92143the second connecting process involving a bump connector

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Patents Grantslast 30 patents

Information Patent Grant
Close butted collocated variable technology imaging arrays on a sin...
- Patent number 12,051,712
- Issue date Jul 30, 2024
- Raytheon Company
- Sean P. Kilcoyne
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including mold layer and manufacturing method...
- Patent number 11,923,340
- Issue date Mar 5, 2024
- Samsung Electronics Co., Ltd.
- Yeongkwon Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure and method of manufacturing the same
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- Issue date Jan 2, 2024
- Advanced Semiconductor Engineering, Inc.
- Mark Gerber
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solderless interconnect for semiconductor device assembly
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- Issue date Nov 7, 2023
- Micron Technology, Inc.
- Jungbae Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Close butted collocated variable technology imaging arrays on a sin...
- Patent number 11,705,471
- Issue date Jul 18, 2023
- Raytheon Company
- Sean P. Kilcoyne
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 11,502,057
- Issue date Nov 15, 2022
- Kioxia Corporation
- Soichi Homma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device and method for reworking flip chip components
- Patent number 11,330,746
- Issue date May 10, 2022
- Raytheon Company
- James A. Robbins
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including offset stack of semiconductor dies...
- Patent number 11,158,608
- Issue date Oct 26, 2021
- Powertech Technology Inc.
- Kuang-Jen Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solderless interconnect for semiconductor device assembly
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- Issue date Aug 17, 2021
- Micron Technology, Inc.
- Jungbae Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device packaging facility and method, and device processing apparat...
- Patent number 10,937,757
- Issue date Mar 2, 2021
- Semigear, Inc.
- Jian Zhang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing semiconductor device, and mounting device
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- Issue date Jan 19, 2021
- Shinkawa Ltd.
- Tomonori Nakamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of producing optoelectronic component with integrated protec...
- Patent number 10,586,788
- Issue date Mar 10, 2020
- OSRAM OLED GmbH
- Jürgen Moosburger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor apparatus, method for manufa...
- Patent number 10,416,557
- Issue date Sep 17, 2019
- Shin-Etsu Chemical Co., Ltd.
- Kyoko Soga
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Device packaging facility and method, and device processing apparat...
- Patent number 10,283,481
- Issue date May 7, 2019
- Semigear, Inc.
- Jian Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electric component mounting method
- Patent number 10,034,389
- Issue date Jul 24, 2018
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Hideki Eifuku
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic element with bond elements to encapsulation surface
- Patent number 10,008,477
- Issue date Jun 26, 2018
- Invensas Corporation
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing wafer level packaging including through enc...
- Patent number 9,905,551
- Issue date Feb 27, 2018
- STS Semiconductor & Telecommunications Co., Ltd.
- Eun Dong Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Laser die backside film removal for integrated circuit (IC) packaging
- Patent number 9,859,248
- Issue date Jan 2, 2018
- Intel Corporation
- Danish Faruqui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging solutions for devices and systems comprising lateral GaN...
- Patent number 9,824,949
- Issue date Nov 21, 2017
- GaN Systems Inc.
- Cameron McKnight-MacNeil
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device packaging facility and method, and device processing apparat...
- Patent number 9,824,998
- Issue date Nov 21, 2017
- Semigear, Inc.
- Jian Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including semiconductor chips stacked over sub...
- Patent number 9,748,204
- Issue date Aug 29, 2017
- Micron Technology, Inc.
- Sensho Usami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device packaging facility and method, and device processing apparat...
- Patent number 9,741,683
- Issue date Aug 22, 2017
- Semigear, Inc.
- Jian Zhang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Optoelectronic component with integrated protection diode and metho...
- Patent number 9,653,440
- Issue date May 16, 2017
- Osram Opto Semiconductors GmbH
- Jürgen Moosburger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging solutions for devices and systems comprising lateral GaN...
- Patent number 9,589,868
- Issue date Mar 7, 2017
- GaN Systems Inc.
- Cameron McKnight-MacNeil
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging solutions for devices and systems comprising lateral GaN...
- Patent number 9,589,869
- Issue date Mar 7, 2017
- GaN Systems Inc.
- Cameron McKnight-MacNeil
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of fabrication and testing of three-dimensional stacked int...
- Patent number 9,570,429
- Issue date Feb 14, 2017
- SHANGHAI JADIC OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Jianhong Mao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fluxing-encapsulant material for microelectronic packages assembled...
- Patent number 9,504,168
- Issue date Nov 22, 2016
- Intel Corporation
- Sivakumar Nagarajan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device packaging facility and method, and device processing apparat...
- Patent number 9,472,531
- Issue date Oct 18, 2016
- Semigear, Inc.
- Jian Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device including grinding sem...
- Patent number 9,425,177
- Issue date Aug 23, 2016
- Micron Technology, Inc.
- Tadashi Koyanagi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Laser die backside film removal for integrated circuit (IC) packaging
- Patent number 9,412,702
- Issue date Aug 9, 2016
- Intel Corporation
- Danish Faruqui
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING MOLD LAYER AND MANUFACTURING METHOD...
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- Publication date Jun 20, 2024
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- YEONGKWON KO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CLOSE BUTTED COLLOCATED VARIABLE TECHNOLOGY IMAGING ARRAYS ON A SIN...
- Publication number 20230282665
- Publication date Sep 7, 2023
- Raytheon Company
- Sean P. Kilcoyne
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR PACKAGE AND SYSTEM HAVING THE SAME
- Publication number 20230085734
- Publication date Mar 23, 2023
- Samsung Electronics Co., Ltd.
- Sunjae KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW COST WAFER LEVEL PACKAGES AND SILICON
- Publication number 20230032887
- Publication date Feb 2, 2023
- STMicroelectronics Pte Ltd
- Jing-En LUAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CLOSE BUTTED COLLOCATED VARIABLE TECHNOLOGY IMAGING ARRAYS ON A SIN...
- Publication number 20220130883
- Publication date Apr 28, 2022
- Raytheon Company
- Sean P. Kilcoyne
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDERLESS INTERCONNECT FOR SEMICONDUCTOR DEVICE ASSEMBLY
- Publication number 20210375822
- Publication date Dec 2, 2021
- Micron Technology, Inc.
- Jungbae Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20210257332
- Publication date Aug 19, 2021
- KIOXIA Corporation
- Soichi HOMMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDERLESS INTERCONNECT FOR SEMICONDUCTOR DEVICE ASSEMBLY
- Publication number 20210183811
- Publication date Jun 17, 2021
- Micron Technology, Inc.
- Jungbae Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20210091043
- Publication date Mar 25, 2021
- Powertech Technology Inc.
- Kuang-Jen Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20210028134
- Publication date Jan 28, 2021
- Advanced Semiconductor Engineering, Inc.
- Mark GERBER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, AND MOUNTING DEVICE
- Publication number 20190312020
- Publication date Oct 10, 2019
- SHINKAWA LTD.
- Tomonori NAKAMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND FABRICATING METHOD OF THE SAME
- Publication number 20190287939
- Publication date Sep 19, 2019
- Toshiba Memory Corporation
- Yasuo TAKEMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE PACKAGING FACILITY AND METHOD, AND DEVICE PROCESSING APPARAT...
- Publication number 20190229086
- Publication date Jul 25, 2019
- Semigear, Inc.
- Jian ZHANG
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
DEVICE PACKAGING FACILITY AND METHOD, AND DEVICE PROCESSING APPARAT...
- Publication number 20180033766
- Publication date Feb 1, 2018
- SEMlgear, Inc.
- Jian ZHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLUXING-ENCAPSULANT MATERIAL FOR MICROELECTRONIC PACKAGES ASSEMBLED...
- Publication number 20170042043
- Publication date Feb 9, 2017
- SIVAKUMAR NAGARAJAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20160358892
- Publication date Dec 8, 2016
- ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
- Haksun LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE PACKAGING FACILITY AND METHOD, AND DEVICE PROCESSING APPARAT...
- Publication number 20160336293
- Publication date Nov 17, 2016
- Semigear, Inc.
- Jian ZHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING SOLUTIONS FOR DEVICES AND SYSTEMS COMPRISING LATERAL GaN...
- Publication number 20160268185
- Publication date Sep 15, 2016
- GAN SYSTEMS INC.
- Cameron MCKNIGHT-MACNEIL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID INTERCONNECT FOR LOW TEMPERATURE ATTACH
- Publication number 20160260679
- Publication date Sep 8, 2016
- Intel Corporation
- Kabirkumar J. Mirpuri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE PACKAGING FACILITY AND METHOD, AND DEVICE PROCESSING APPARAT...
- Publication number 20160233191
- Publication date Aug 11, 2016
- Semigear, Inc.
- Jian ZHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING SEMICONDUCTOR CHIPS STACKED OVER SUB...
- Publication number 20160064358
- Publication date Mar 3, 2016
- Micron Technology, Inc.
- Sensho Usami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE INCLUDING GRINDING SEM...
- Publication number 20140377886
- Publication date Dec 25, 2014
- Tadashi Koyanagi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LASER DIE BACKSIDE FILM REMOVAL FOR INTEGRATED CIRCUIT (IC) PACKAGING
- Publication number 20140264951
- Publication date Sep 18, 2014
- Danish Faruqui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BUFFER FILM FOR MULTI-CHIP PACKAGING
- Publication number 20140248477
- Publication date Sep 4, 2014
- DEXERIALS CORPORATION
- Akira Ishigami
- B32 - LAYERED PRODUCTS
Information Patent Application
ELECTRONIC DEVICE PACKAGE AND FABRICATION METHOD THEREOF
- Publication number 20140193950
- Publication date Jul 10, 2014
- Xintec Inc.
- Shu-Ming CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING CHIP-STACKED SEMICONDUCTOR PACKAGE
- Publication number 20140154839
- Publication date Jun 5, 2014
- Jung-seok Ahn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FORMING THE SAME
- Publication number 20140124910
- Publication date May 8, 2014
- Byung-Woo LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE AND METHODS FOR MANUFACTURING A CHIP PACKAGE
- Publication number 20140001634
- Publication date Jan 2, 2014
- INFINEON TECHNOLOGIES AG
- Holger Torwesten
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLUXING-ENCAPSULANT MATERIAL FOR MICROELECTRONIC PACKAGES ASSEMBLED...
- Publication number 20130263446
- Publication date Oct 10, 2013
- Intel Corporation
- Sivakumar Nagarajan
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
STACKED SEMICONDUCTOR COMPONENTS WITH UNIVERSAL INTERCONNECT FOOTPRINT
- Publication number 20130256895
- Publication date Oct 3, 2013
- Michael Su
- H01 - BASIC ELECTRIC ELEMENTS

the second connecting process involving a bump connector

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Close butted collocated variable technology imaging arrays on a sin...

Semiconductor package including mold layer and manufacturing method...

Semiconductor package structure and method of manufacturing the same

Solderless interconnect for semiconductor device assembly

Close butted collocated variable technology imaging arrays on a sin...

Semiconductor device and manufacturing method thereof

Device and method for reworking flip chip components

Semiconductor package including offset stack of semiconductor dies...

Solderless interconnect for semiconductor device assembly

Device packaging facility and method, and device processing apparat...

Method of manufacturing semiconductor device, and mounting device

Method of producing optoelectronic component with integrated protec...

Method for manufacturing semiconductor apparatus, method for manufa...

Device packaging facility and method, and device processing apparat...

Electric component mounting method

Microelectronic element with bond elements to encapsulation surface

Method of manufacturing wafer level packaging including through enc...

Laser die backside film removal for integrated circuit (IC) packaging

Packaging solutions for devices and systems comprising lateral GaN...

Device packaging facility and method, and device processing apparat...

Semiconductor device including semiconductor chips stacked over sub...

Device packaging facility and method, and device processing apparat...

Optoelectronic component with integrated protection diode and metho...

Packaging solutions for devices and systems comprising lateral GaN...

Packaging solutions for devices and systems comprising lateral GaN...

Methods of fabrication and testing of three-dimensional stacked int...

Fluxing-encapsulant material for microelectronic packages assembled...

Device packaging facility and method, and device processing apparat...

Method of manufacturing semiconductor device including grinding sem...

Laser die backside film removal for integrated circuit (IC) packaging

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE INCLUDING MOLD LAYER AND MANUFACTURING METHOD...

CLOSE BUTTED COLLOCATED VARIABLE TECHNOLOGY IMAGING ARRAYS ON A SIN...

IMAGE SENSOR PACKAGE AND SYSTEM HAVING THE SAME

LOW COST WAFER LEVEL PACKAGES AND SILICON

CLOSE BUTTED COLLOCATED VARIABLE TECHNOLOGY IMAGING ARRAYS ON A SIN...

SOLDERLESS INTERCONNECT FOR SEMICONDUCTOR DEVICE ASSEMBLY

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

SOLDERLESS INTERCONNECT FOR SEMICONDUCTOR DEVICE ASSEMBLY

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME

METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, AND MOUNTING DEVICE

SEMICONDUCTOR DEVICE AND FABRICATING METHOD OF THE SAME

DEVICE PACKAGING FACILITY AND METHOD, AND DEVICE PROCESSING APPARAT...

DEVICE PACKAGING FACILITY AND METHOD, AND DEVICE PROCESSING APPARAT...

FLUXING-ENCAPSULANT MATERIAL FOR MICROELECTRONIC PACKAGES ASSEMBLED...

SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME

DEVICE PACKAGING FACILITY AND METHOD, AND DEVICE PROCESSING APPARAT...

PACKAGING SOLUTIONS FOR DEVICES AND SYSTEMS COMPRISING LATERAL GaN...

HYBRID INTERCONNECT FOR LOW TEMPERATURE ATTACH

DEVICE PACKAGING FACILITY AND METHOD, AND DEVICE PROCESSING APPARAT...

SEMICONDUCTOR DEVICE INCLUDING SEMICONDUCTOR CHIPS STACKED OVER SUB...

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE INCLUDING GRINDING SEM...

LASER DIE BACKSIDE FILM REMOVAL FOR INTEGRATED CIRCUIT (IC) PACKAGING

BUFFER FILM FOR MULTI-CHIP PACKAGING

ELECTRONIC DEVICE PACKAGE AND FABRICATION METHOD THEREOF

METHOD OF MANUFACTURING CHIP-STACKED SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE AND METHOD OF FORMING THE SAME

CHIP PACKAGE AND METHODS FOR MANUFACTURING A CHIP PACKAGE

FLUXING-ENCAPSULANT MATERIAL FOR MICROELECTRONIC PACKAGES ASSEMBLED...

STACKED SEMICONDUCTOR COMPONENTS WITH UNIVERSAL INTERCONNECT FOOTPRINT