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SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
H01L2224/00
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
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H01L2224/92225
the second connecting process involving a layer connector
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last 30 patents
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Patent Grant
Integrated circuit package and method of forming same
Patent number
12,294,002
Issue date
May 6, 2025
Taiwan Semiconductor Manufacturing Co., Ltd
Shang-Yun Hou
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
High density interconnection using fanout interposer chiplet
Patent number
12,283,549
Issue date
Apr 22, 2025
Apple Inc.
Jun Zhai
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Semiconductor device with enhanced thermal dissipation and method f...
Patent number
12,183,655
Issue date
Dec 31, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Yang-Che Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for manufacturing display panel, display panel, and display...
Patent number
12,176,334
Issue date
Dec 24, 2024
Shanghai Tianma Micro-Electronics Co., Ltd.
Canyuan Zhang
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Logic drive with brain-like elasticity and integrality based on sta...
Patent number
12,176,902
Issue date
Dec 24, 2024
iCometrue Company Ltd.
Jin-Yuan Lee
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Semiconductor devices and methods of manufacturing semiconductor de...
Patent number
12,159,863
Issue date
Dec 3, 2024
Amkor Technology Singapore Holding Pte Ltd.
Hyun Goo Cha
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Semiconductor device with a semiconductor die embedded between an e...
Patent number
12,107,035
Issue date
Oct 1, 2024
Amkor Technology Singapore Holdings Pte. Ltd.
Jae Yun Kim
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Method for manufacturing light emitting devices
Patent number
12,080,695
Issue date
Sep 3, 2024
Nichia Corporation
Kenji Ozeki
H01 - BASIC ELECTRIC ELEMENTS
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Logic drive using standard commodity programmable logic IC chips co...
Patent number
12,057,837
Issue date
Aug 6, 2024
iCometrue Company Ltd.
Jin-Yuan Lee
G11 - INFORMATION STORAGE
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Patent Grant
Chip package with redistribution structure having multiple chips
Patent number
12,046,548
Issue date
Jul 23, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Shin-Puu Jeng
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Semiconductor package having a through intervia through the molding...
Patent number
12,033,976
Issue date
Jul 9, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Chen-Hua Yu
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Integrated circuit package and method of forming same
Patent number
12,015,023
Issue date
Jun 18, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Shang-Yun Hou
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Heterogeneous antenna in fan-out package
Patent number
11,996,606
Issue date
May 28, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Po-Yao Chuang
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Fingerprint sensor and manufacturing method thereof
Patent number
11,990,435
Issue date
May 21, 2024
Amkor Technology Singapore Holding Pte Ltd.
Sung Sun Park
B81 - MICRO-STRUCTURAL TECHNOLOGY
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Patent Grant
Power amplifier modules including topside cooling interfaces and me...
Patent number
11,990,872
Issue date
May 21, 2024
NXP USA, INC.
Geoffrey Tucker
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
3DIC packaging with hot spot thermal management features
Patent number
11,961,779
Issue date
Apr 16, 2024
Taiwan Semiconductor Manufacturing Company, Ltd. (TSMC)
Wensen Hung
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Semiconductor package and fabricating method thereof
Patent number
11,961,797
Issue date
Apr 16, 2024
Amkor Technology Singapore Holding Pte Ltd.
Keun Soo Kim
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Package structure
Patent number
11,955,401
Issue date
Apr 9, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Shih-Hui Wang
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Thermal interface material having different thicknesses in packages
Patent number
11,916,023
Issue date
Feb 27, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Sung-Hui Huang
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Semiconductor devices and methods of manufacturing semiconductor de...
Patent number
11,830,860
Issue date
Nov 28, 2023
Amkor Technology Singapore Holding Pte Ltd.
Hyun Goo Cha
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Light emitting device
Patent number
11,791,324
Issue date
Oct 17, 2023
Nichia Corporation
Kenji Ozeki
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Method of manufacturing package-on-package device and bonding appar...
Patent number
11,776,946
Issue date
Oct 3, 2023
Samsung Electronics Co., Ltd.
Junho Cho
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Method for manufacturing display panel, display panel, and display...
Patent number
11,776,942
Issue date
Oct 3, 2023
Shanghai Tianma Micro-Electronics Co., Ltd.
Canyuan Zhang
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Semiconductor package having a sidewall connection
Patent number
11,749,627
Issue date
Sep 5, 2023
STMicroelectronics Ltd.
Endruw Jahja
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Semiconductor package having a stiffener ring
Patent number
11,728,232
Issue date
Aug 15, 2023
Mediatek Inc.
Chi-Wen Pan
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Logic drive using standard commodity programmable logic IC chips co...
Patent number
11,711,082
Issue date
Jul 25, 2023
iCometrue Company Ltd.
Mou-Shiung Lin
G11 - INFORMATION STORAGE
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Patent Grant
Chip package with redistribution structure having multiple chips
Patent number
11,670,577
Issue date
Jun 6, 2023
Taiwan Semiconductor Manufacturing Company, Ltd
Shin-Puu Jeng
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Methods of manufacturing semiconductor packaging device and heat di...
Patent number
11,658,091
Issue date
May 23, 2023
Global Unichip Corporation
Jia-Liang Chen
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Semiconductor package having a through intervia through the molding...
Patent number
11,637,084
Issue date
Apr 25, 2023
Taiwan Semiconductor Manufacturing Company, Ltd.
Chen-Hua Yu
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Package structure
Patent number
11,626,341
Issue date
Apr 11, 2023
Taiwan Semiconductor Manufacturing Company, Ltd
Shih-Hui Wang
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
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Patent Application
INTEGRATED CIRCUIT PACKAGE AND METHOD OF FORMING SAME
Publication number
20250233119
Publication date
Jul 17, 2025
Taiwan Semiconductor Manufacturing Co., Ltd.
Shang-Yun Hou
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
STRUCTURE AND FORMATION METHOD OF PACKAGE WITH INTERPOSER CHIP
Publication number
20250210610
Publication date
Jun 26, 2025
Taiwan Semiconductor Manufacturing Co., Ltd.
Po-Yu Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DE...
Publication number
20250174612
Publication date
May 29, 2025
Amkor Technology Singapore Holding Pte. Ltd.
Hyun Goo Cha
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
HIGH DENSITY INTERCONNECTION USING FANOUT INTERPOSER CHIPLET
Publication number
20250157939
Publication date
May 15, 2025
Apple Inc.
Jun Zhai
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
ELECTRONIC DEVICES AND A METHODS OF MANUFACTURING ELECTRONIC DEVICES
Publication number
20250132220
Publication date
Apr 24, 2025
Amkor Technology Singapore Holding Pte. Ltd.
Dong Hyeon Park
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
Publication number
20250132214
Publication date
Apr 24, 2025
Taiwan Semiconductor Manufacturing Company, Ltd.
Hsien-Wei Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE WITH ENHANCED THERMAL DISSIPATION AND METHOD F...
Publication number
20250087553
Publication date
Mar 13, 2025
Taiwan Semiconductor Manufacturing Company, Ltd.
Yang-Che CHEN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE WITH A SEMICONDUCTOR DIE EMBEDDED BETWEEN AN E...
Publication number
20250022784
Publication date
Jan 16, 2025
Amkor Technology Singapore Holding Pte. Ltd.
Jae Yun Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
Publication number
20240429188
Publication date
Dec 26, 2024
KIOXIA Corporation
Jun TANAKA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
LIGHT EMITTING DEVICE
Publication number
20240395786
Publication date
Nov 28, 2024
Nichia Corporation.
Kenji OZEKI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
LOGIC DRIVE USING STANDARD COMMODITY PROGRAMMABLE LOGIC IC CHIPS CO...
Publication number
20240380401
Publication date
Nov 14, 2024
iCometrue Company Ltd.
Jin-Yuan Lee
G11 - INFORMATION STORAGE
Information
Patent Application
Semiconductor Device and Method of Controlling Distribution of Liqu...
Publication number
20240371719
Publication date
Nov 7, 2024
STATS ChipPAC Pte Ltd.
JongChan Park
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CHIP PACKAGE HAVING MULTIPLE CHIPS
Publication number
20240347439
Publication date
Oct 17, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Shin-Puu JENG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE AND FABRICATING METHOD THEREOF
Publication number
20240347442
Publication date
Oct 17, 2024
Amkor Technology Singapore Holding Pte. Ltd.
Keun Soo Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
THREE-DIMENSIONAL PACKAGE STRUCTURE AND METHOD FOR FORMING SAME
Publication number
20240312861
Publication date
Sep 19, 2024
JCET Group Co. Ltd.
Chen XU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
FINGERPRINT SENSOR AND MANUFACTURING METHOD THEREOF
Publication number
20240304577
Publication date
Sep 12, 2024
Amkor Technology Singapore Holding Pte. Ltd.
Sung Sun Park
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Application
INTEGRATED CIRCUIT PACKAGE AND METHOD OF FORMING SAME
Publication number
20240297166
Publication date
Sep 5, 2024
Taiwan Semiconductor Manufacturing Co., Ltd.
Shang-Yun Hou
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Heterogeneous Antenna in Fan-Out Package
Publication number
20240297432
Publication date
Sep 5, 2024
Taiwan Semiconductor Manufacturing Co., Ltd.
Po-Yao Chuang
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
POWER AMPLIFIER MODULES INCLUDING TOPSIDE COOLING INTERFACES AND ME...
Publication number
20240291439
Publication date
Aug 29, 2024
NXP USA, Inc.
Geoffrey Tucker
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
3DIC PACKAGING WITH HOT SPOT THERMAL MANAGEMENT FEATURES
Publication number
20240222218
Publication date
Jul 4, 2024
Taiwan Semiconductor Manufacturing Co, LTD.
Wensen Hung
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
THERMAL EXPANSION MATCHED CHIP MODULE WITH INTEGRATED LIQUID COOLING
Publication number
20240203822
Publication date
Jun 20, 2024
International Business Machines Corporation
Evan Colgan
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
THERMAL INTERFACE MATERIAL HAVING DIFFERENT THICKNESSES IN PACKAGES
Publication number
20240162166
Publication date
May 16, 2024
Taiwan Semiconductor Manufacturing Co., Ltd.
Sung-Hui Huang
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DE...
Publication number
20240088114
Publication date
Mar 14, 2024
Amkor Technology Singapore Holding Pte. Ltd.
Hyun Goo Cha
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
METHOD FOR MANUFACTURING LIGHT EMITTING DEVICES
Publication number
20230420435
Publication date
Dec 28, 2023
Nichia Corporation.
Kenji OZEKI
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
METHOD FOR MANUFACTURING DISPLAY PANEL, DISPLAY PANEL, AND DISPLAY...
Publication number
20230402442
Publication date
Dec 14, 2023
SHANGHAI TIANMA MICRO-ELECTRONICS CO., LTD.
Canyuan ZHANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
LOGIC DRIVE USING STANDARD COMMODITY PROGRAMMABLE LOGIC IC CHIPS CO...
Publication number
20230299774
Publication date
Sep 21, 2023
iCometrue Company Ltd.
Mou-Shiung LIN
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
METHODS AND APPARATUS FOR STACKED DIE WARPAGE CONTROL DURING MASS R...
Publication number
20230282607
Publication date
Sep 7, 2023
Micron Technology, Inc.
Ting Yi Lin
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
CHIP PACKAGE WITH REDISTRIBUTION STRUCTURE HAVING MULTIPLE CHIPS
Publication number
20230260890
Publication date
Aug 17, 2023
Taiwan Semiconductor Manufacturing Company, Ltd.
Shin-Puu JENG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
HIGH DENSITY INTERCONNECTION USING FANOUT INTERPOSER CHIPLET
Publication number
20230223348
Publication date
Jul 13, 2023
Apple Inc.
Jun Zhai
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE STRUCTURE WITH ADHESIVE ELEMENT OVER SEMICONDUCTOR CHIP
Publication number
20230207476
Publication date
Jun 29, 2023
Taiwan Semiconductor Manufacturing Company, Ltd.
Po-Hao TSAI
H01 - BASIC ELECTRIC ELEMENTS