the second connecting process involving a layer connector

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H01L2224/92225

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/92225the second connecting process involving a layer connector

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor devices and methods of manufacturing semiconductor de...
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- Amkor Technology Singapore Holding Pte Ltd.
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- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with a semiconductor die embedded between an e...
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Method for manufacturing light emitting devices
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Information Patent Grant
Chip package with redistribution structure having multiple chips
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Information Patent Grant
Semiconductor package having a through intervia through the molding...
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- Taiwan Semiconductor Manufacturing Company, Ltd.
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Information Patent Grant
Integrated circuit package and method of forming same
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Information Patent Grant
Heterogeneous antenna in fan-out package
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3DIC packaging with hot spot thermal management features
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Information Patent Grant
Semiconductor package and fabricating method thereof
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Information Patent Grant
Package structure
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Information Patent Grant
Thermal interface material having different thicknesses in packages
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Information Patent Grant
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Method of manufacturing package-on-package device and bonding appar...
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Method for manufacturing display panel, display panel, and display...
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Information Patent Grant
Semiconductor package having a sidewall connection
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Semiconductor package having a stiffener ring
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- Mou-Shiung Lin
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Chip package with redistribution structure having multiple chips
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Methods of manufacturing semiconductor packaging device and heat di...
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Information Patent Grant
Semiconductor package having a through intervia through the molding...
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Information Patent Grant
Package structure
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Information Patent Grant
Semiconductor device with enhanced thermal dissipation and method f...
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Information Patent Grant
Thin bonded interposer package
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- Christopher J. Berry
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Information Patent Grant
Structure and formation method of chip package with conductive supp...
- Patent number 11,600,573
- Issue date Mar 7, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Po-Hao Tsai
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Information Patent Grant
High density interconnection using fanout interposer chiplet
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- Issue date Feb 28, 2023
- Apple Inc.
- Jun Zhai
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Information Patent Grant
Method for forming board assembly with chemical vapor deposition di...
- Patent number 11,538,732
- Issue date Dec 27, 2022
- Microchip Technology Caldicot Limited
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- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

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CHIP PACKAGE HAVING MULTIPLE CHIPS
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SEMICONDUCTOR PACKAGE AND FABRICATING METHOD THEREOF
- Publication number 20240347442
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THREE-DIMENSIONAL PACKAGE STRUCTURE AND METHOD FOR FORMING SAME
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FINGERPRINT SENSOR AND MANUFACTURING METHOD THEREOF
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INTEGRATED CIRCUIT PACKAGE AND METHOD OF FORMING SAME
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Heterogeneous Antenna in Fan-Out Package
- Publication number 20240297432
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- Taiwan Semiconductor Manufacturing Co., Ltd.
- Po-Yao Chuang
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Information Patent Application
POWER AMPLIFIER MODULES INCLUDING TOPSIDE COOLING INTERFACES AND ME...
- Publication number 20240291439
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3DIC PACKAGING WITH HOT SPOT THERMAL MANAGEMENT FEATURES
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THERMAL EXPANSION MATCHED CHIP MODULE WITH INTEGRATED LIQUID COOLING
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THERMAL INTERFACE MATERIAL HAVING DIFFERENT THICKNESSES IN PACKAGES
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- Taiwan Semiconductor Manufacturing Co., Ltd.
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- H01 - BASIC ELECTRIC ELEMENTS
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SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DE...
- Publication number 20240088114
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LOGIC DRIVE USING STANDARD COMMODITY PROGRAMMABLE LOGIC IC CHIPS CO...
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METHODS AND APPARATUS FOR STACKED DIE WARPAGE CONTROL DURING MASS R...
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- Ting Yi Lin
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CHIP PACKAGE WITH REDISTRIBUTION STRUCTURE HAVING MULTIPLE CHIPS
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HIGH DENSITY INTERCONNECTION USING FANOUT INTERPOSER CHIPLET
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- Jun Zhai
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PACKAGE STRUCTURE WITH ADHESIVE ELEMENT OVER SEMICONDUCTOR CHIP
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- Publication number 20230117132
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- SHANGHAI TIANMA MICRO-ELECTRONICS CO., LTD.
- Canyuan ZHANG
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SEMICONDUCTOR DEVICE WITH A SEMICONDUCTOR DIE EMBEDDED BETWEEN AN E...
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- Amkor Technology Singapore Holding Pte. Ltd.
- Jae Yun Kim
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SEMICONDUCTOR DEVICE
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- Publication date Dec 8, 2022
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- TAKUYA KADOGUCHI
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METHODS OF MANUFACTURING SEMICONDUCTOR PACKAGING DEVICE AND HEAT DI...
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- Global Unichip Corporation
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- Publication date Nov 17, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yang-Che CHEN
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Information Patent Application
LIGHT EMITTING DEVICE
- Publication number 20220302098
- Publication date Sep 22, 2022
- Nichia Corporation.
- Kenji OZEKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT DISSIPATION STRUCTURE, SEMICONDUCTOR PACKAGING DEVICE, AND MAN...
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- Global Unichip Corporation
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- Publication date Jul 28, 2022
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- Cheng Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE
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- Publication date Jul 7, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shih-Hui Wang
- H01 - BASIC ELECTRIC ELEMENTS

the second connecting process involving a layer connector

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor devices and methods of manufacturing semiconductor de...

Semiconductor device with a semiconductor die embedded between an e...

Method for manufacturing light emitting devices

Logic drive using standard commodity programmable logic IC chips co...

Chip package with redistribution structure having multiple chips

Semiconductor package having a through intervia through the molding...

Integrated circuit package and method of forming same

Heterogeneous antenna in fan-out package

Fingerprint sensor and manufacturing method thereof

Power amplifier modules including topside cooling interfaces and me...

3DIC packaging with hot spot thermal management features

Semiconductor package and fabricating method thereof

Package structure

Thermal interface material having different thicknesses in packages

Semiconductor devices and methods of manufacturing semiconductor de...

Light emitting device

Method of manufacturing package-on-package device and bonding appar...

Method for manufacturing display panel, display panel, and display...

Semiconductor package having a sidewall connection

Semiconductor package having a stiffener ring

Logic drive using standard commodity programmable logic IC chips co...

Chip package with redistribution structure having multiple chips

Methods of manufacturing semiconductor packaging device and heat di...

Semiconductor package having a through intervia through the molding...

Package structure

Semiconductor device with enhanced thermal dissipation and method f...

Thin bonded interposer package

Structure and formation method of chip package with conductive supp...

High density interconnection using fanout interposer chiplet

Method for forming board assembly with chemical vapor deposition di...

Patents Applicationslast 30 patents

LIGHT EMITTING DEVICE

LOGIC DRIVE USING STANDARD COMMODITY PROGRAMMABLE LOGIC IC CHIPS CO...

Semiconductor Device and Method of Controlling Distribution of Liqu...

CHIP PACKAGE HAVING MULTIPLE CHIPS

SEMICONDUCTOR PACKAGE AND FABRICATING METHOD THEREOF

THREE-DIMENSIONAL PACKAGE STRUCTURE AND METHOD FOR FORMING SAME

FINGERPRINT SENSOR AND MANUFACTURING METHOD THEREOF

INTEGRATED CIRCUIT PACKAGE AND METHOD OF FORMING SAME

Heterogeneous Antenna in Fan-Out Package

POWER AMPLIFIER MODULES INCLUDING TOPSIDE COOLING INTERFACES AND ME...

3DIC PACKAGING WITH HOT SPOT THERMAL MANAGEMENT FEATURES

THERMAL EXPANSION MATCHED CHIP MODULE WITH INTEGRATED LIQUID COOLING

THERMAL INTERFACE MATERIAL HAVING DIFFERENT THICKNESSES IN PACKAGES

SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DE...

METHOD FOR MANUFACTURING LIGHT EMITTING DEVICES

METHOD FOR MANUFACTURING DISPLAY PANEL, DISPLAY PANEL, AND DISPLAY...

LOGIC DRIVE USING STANDARD COMMODITY PROGRAMMABLE LOGIC IC CHIPS CO...

METHODS AND APPARATUS FOR STACKED DIE WARPAGE CONTROL DURING MASS R...

CHIP PACKAGE WITH REDISTRIBUTION STRUCTURE HAVING MULTIPLE CHIPS

HIGH DENSITY INTERCONNECTION USING FANOUT INTERPOSER CHIPLET

PACKAGE STRUCTURE WITH ADHESIVE ELEMENT OVER SEMICONDUCTOR CHIP

METHOD FOR MANUFACTURING DISPLAY PANEL, DISPLAY PANEL, AND DISPLAY...

SEMICONDUCTOR DEVICE WITH A SEMICONDUCTOR DIE EMBEDDED BETWEEN AN E...

SEMICONDUCTOR DEVICE

METHODS OF MANUFACTURING SEMICONDUCTOR PACKAGING DEVICE AND HEAT DI...

SEMICONDUCTOR DEVICE WITH ENHANCED THERMAL DISSIPATION AND METHOD F...

LIGHT EMITTING DEVICE

HEAT DISSIPATION STRUCTURE, SEMICONDUCTOR PACKAGING DEVICE, AND MAN...

EMBEDDED COPPER STRUCTURE FOR MICROELECTRONICS PACKAGE

PACKAGE STRUCTURE