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the second connecting process involving a layer connector
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ELECTRICITY
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Electric elements
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SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
H01L2224/00
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
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H01L2224/92225
the second connecting process involving a layer connector
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last 30 patents
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3DIC packaging with hot spot thermal management features
Patent number
11,961,779
Issue date
Apr 16, 2024
Taiwan Semiconductor Manufacturing Company, Ltd. (TSMC)
Wensen Hung
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Semiconductor package and fabricating method thereof
Patent number
11,961,797
Issue date
Apr 16, 2024
Amkor Technology Singapore Holding Pte Ltd.
Keun Soo Kim
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Package structure
Patent number
11,955,401
Issue date
Apr 9, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Shih-Hui Wang
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Thermal interface material having different thicknesses in packages
Patent number
11,916,023
Issue date
Feb 27, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Sung-Hui Huang
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Semiconductor devices and methods of manufacturing semiconductor de...
Patent number
11,830,860
Issue date
Nov 28, 2023
Amkor Technology Singapore Holding Pte Ltd.
Hyun Goo Cha
H01 - BASIC ELECTRIC ELEMENTS
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Light emitting device
Patent number
11,791,324
Issue date
Oct 17, 2023
Nichia Corporation
Kenji Ozeki
H01 - BASIC ELECTRIC ELEMENTS
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Method of manufacturing package-on-package device and bonding appar...
Patent number
11,776,946
Issue date
Oct 3, 2023
Samsung Electronics Co., Ltd.
Junho Cho
H01 - BASIC ELECTRIC ELEMENTS
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Method for manufacturing display panel, display panel, and display...
Patent number
11,776,942
Issue date
Oct 3, 2023
Shanghai Tianma Micro-Electronics Co., Ltd.
Canyuan Zhang
H01 - BASIC ELECTRIC ELEMENTS
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Semiconductor package having a sidewall connection
Patent number
11,749,627
Issue date
Sep 5, 2023
STMicroelectronics Ltd.
Endruw Jahja
H01 - BASIC ELECTRIC ELEMENTS
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Semiconductor package having a stiffener ring
Patent number
11,728,232
Issue date
Aug 15, 2023
Mediatek Inc.
Chi-Wen Pan
H01 - BASIC ELECTRIC ELEMENTS
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Logic drive using standard commodity programmable logic IC chips co...
Patent number
11,711,082
Issue date
Jul 25, 2023
iCometrue Company Ltd.
Mou-Shiung Lin
G11 - INFORMATION STORAGE
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Chip package with redistribution structure having multiple chips
Patent number
11,670,577
Issue date
Jun 6, 2023
Taiwan Semiconductor Manufacturing Company, Ltd
Shin-Puu Jeng
H01 - BASIC ELECTRIC ELEMENTS
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Methods of manufacturing semiconductor packaging device and heat di...
Patent number
11,658,091
Issue date
May 23, 2023
Global Unichip Corporation
Jia-Liang Chen
H01 - BASIC ELECTRIC ELEMENTS
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Semiconductor package having a through intervia through the molding...
Patent number
11,637,084
Issue date
Apr 25, 2023
Taiwan Semiconductor Manufacturing Company, Ltd.
Chen-Hua Yu
H01 - BASIC ELECTRIC ELEMENTS
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Package structure
Patent number
11,626,341
Issue date
Apr 11, 2023
Taiwan Semiconductor Manufacturing Company, Ltd
Shih-Hui Wang
H01 - BASIC ELECTRIC ELEMENTS
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Semiconductor device with enhanced thermal dissipation and method f...
Patent number
11,626,343
Issue date
Apr 11, 2023
Taiwan Semiconductor Manufacturing Co., Ltd
Yang-Che Chen
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Thin bonded interposer package
Patent number
11,621,243
Issue date
Apr 4, 2023
Amkor Technology Singapore Holding Pte Ltd.
Christopher J. Berry
H01 - BASIC ELECTRIC ELEMENTS
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Structure and formation method of chip package with conductive supp...
Patent number
11,600,573
Issue date
Mar 7, 2023
Taiwan Semiconductor Manufacturing Co., Ltd
Po-Hao Tsai
H01 - BASIC ELECTRIC ELEMENTS
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High density interconnection using fanout interposer chiplet
Patent number
11,594,494
Issue date
Feb 28, 2023
Apple Inc.
Jun Zhai
H01 - BASIC ELECTRIC ELEMENTS
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Method for forming board assembly with chemical vapor deposition di...
Patent number
11,538,732
Issue date
Dec 27, 2022
Microchip Technology Caldicot Limited
Philip Andrew Swire
H01 - BASIC ELECTRIC ELEMENTS
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Heterogeneous antenna in fan-out package
Patent number
11,532,867
Issue date
Dec 20, 2022
Taiwan Semiconductor Manufacturing Company, Ltd
Po-Yao Chuang
H01 - BASIC ELECTRIC ELEMENTS
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Package structures and methods of forming the same
Patent number
11,527,454
Issue date
Dec 13, 2022
Taiwan Semiconductor Manufacturing Company, Ltd
Chen-Hua Yu
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Heat dissipation structure, semiconductor packaging device, and man...
Patent number
11,450,586
Issue date
Sep 20, 2022
Global Unichip Corporation
Jia-Liang Chen
H01 - BASIC ELECTRIC ELEMENTS
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Semiconductor package and electronic device having the same
Patent number
11,437,295
Issue date
Sep 6, 2022
SAMSUNG ELECTRO-MECHANICS CO., LTD.
Tae Hyun Kim
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Semiconductor device with a semiconductor die embedded between an e...
Patent number
11,430,723
Issue date
Aug 30, 2022
Amkor Technology Singapore Holding Pte Ltd.
Jae Yun Kim
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Package structures and methods of forming the same
Patent number
11,417,580
Issue date
Aug 16, 2022
Taiwan Semiconductor Manufacturing Company, Ltd
Chen-Hua Yu
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Fingerprint sensor and manufacturing method thereof
Patent number
11,393,734
Issue date
Jul 19, 2022
Amkor Technology Singapore Holding Pte Ltd.
Sung Sun Park
B81 - MICRO-STRUCTURAL TECHNOLOGY
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Light emitting device
Patent number
11,393,803
Issue date
Jul 19, 2022
Nichia Corporation
Kenji Ozeki
H01 - BASIC ELECTRIC ELEMENTS
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Logic drive with brain-like elasticity and integrality based on sta...
Patent number
11,368,157
Issue date
Jun 21, 2022
iCometrue Company Ltd.
Jin-Yuan Lee
H01 - BASIC ELECTRIC ELEMENTS
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Semiconductor device and method of manufacture
Patent number
11,328,971
Issue date
May 10, 2022
Taiwan Semiconductor Manufacturing Company, Ltd.
Shu-Shen Yeh
H01 - BASIC ELECTRIC ELEMENTS
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last 30 patents
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Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DE...
Publication number
20240088114
Publication date
Mar 14, 2024
Amkor Technology Singapore Holding Pte. Ltd.
Hyun Goo Cha
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
METHOD FOR MANUFACTURING LIGHT EMITTING DEVICES
Publication number
20230420435
Publication date
Dec 28, 2023
Nichia Corporation.
Kenji OZEKI
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
METHOD FOR MANUFACTURING DISPLAY PANEL, DISPLAY PANEL, AND DISPLAY...
Publication number
20230402442
Publication date
Dec 14, 2023
SHANGHAI TIANMA MICRO-ELECTRONICS CO., LTD.
Canyuan ZHANG
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
LOGIC DRIVE USING STANDARD COMMODITY PROGRAMMABLE LOGIC IC CHIPS CO...
Publication number
20230299774
Publication date
Sep 21, 2023
iCometrue Company Ltd.
Mou-Shiung LIN
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
METHODS AND APPARATUS FOR STACKED DIE WARPAGE CONTROL DURING MASS R...
Publication number
20230282607
Publication date
Sep 7, 2023
Micron Technology, Inc.
Ting Yi Lin
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
CHIP PACKAGE WITH REDISTRIBUTION STRUCTURE HAVING MULTIPLE CHIPS
Publication number
20230260890
Publication date
Aug 17, 2023
Taiwan Semiconductor Manufacturing Company, Ltd.
Shin-Puu JENG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
HIGH DENSITY INTERCONNECTION USING FANOUT INTERPOSER CHIPLET
Publication number
20230223348
Publication date
Jul 13, 2023
Apple Inc.
Jun Zhai
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
PACKAGE STRUCTURE WITH ADHESIVE ELEMENT OVER SEMICONDUCTOR CHIP
Publication number
20230207476
Publication date
Jun 29, 2023
Taiwan Semiconductor Manufacturing Company, Ltd.
Po-Hao TSAI
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
METHOD FOR MANUFACTURING DISPLAY PANEL, DISPLAY PANEL, AND DISPLAY...
Publication number
20230117132
Publication date
Apr 20, 2023
SHANGHAI TIANMA MICRO-ELECTRONICS CO., LTD.
Canyuan ZHANG
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
SEMICONDUCTOR DEVICE WITH A SEMICONDUCTOR DIE EMBEDDED BETWEEN AN E...
Publication number
20220415769
Publication date
Dec 29, 2022
Amkor Technology Singapore Holding Pte. Ltd.
Jae Yun Kim
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
SEMICONDUCTOR DEVICE
Publication number
20220392834
Publication date
Dec 8, 2022
DENSO CORPORATION
TAKUYA KADOGUCHI
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
METHODS OF MANUFACTURING SEMICONDUCTOR PACKAGING DEVICE AND HEAT DI...
Publication number
20220367313
Publication date
Nov 17, 2022
Global Unichip Corporation
Jia-Liang CHEN
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
SEMICONDUCTOR DEVICE WITH ENHANCED THERMAL DISSIPATION AND METHOD F...
Publication number
20220367318
Publication date
Nov 17, 2022
Taiwan Semiconductor Manufacturing Company, Ltd.
Yang-Che CHEN
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
LIGHT EMITTING DEVICE
Publication number
20220302098
Publication date
Sep 22, 2022
Nichia Corporation.
Kenji OZEKI
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
HEAT DISSIPATION STRUCTURE, SEMICONDUCTOR PACKAGING DEVICE, AND MAN...
Publication number
20220262701
Publication date
Aug 18, 2022
Global Unichip Corporation
Jia-Liang CHEN
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
EMBEDDED COPPER STRUCTURE FOR MICROELECTRONICS PACKAGE
Publication number
20220238482
Publication date
Jul 28, 2022
Flex Ltd.
Cheng Yang
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
PACKAGE STRUCTURE
Publication number
20220216123
Publication date
Jul 7, 2022
Taiwan Semiconductor Manufacturing Company, Ltd.
Shih-Hui Wang
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
SEMICONDUCTOR PACKAGE AND FABRICATING METHOD THEREOF
Publication number
20220130752
Publication date
Apr 28, 2022
Amkor Technology Singapore Holding Pte. Ltd.
Keun Soo Kim
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DE...
Publication number
20220093576
Publication date
Mar 24, 2022
Amkor Technology Singapore Holding Pte. Ltd.
Hyun Goo Cha
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
SEMICONDUCTOR PACKAGE HAVING A SIDEWALL CONNECTION
Publication number
20220051998
Publication date
Feb 17, 2022
STMICROELECTRONICS LTD.
Endruw JAHJA
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
Method for forming Board Assembly with Chemical Vapor Deposition Di...
Publication number
20220028753
Publication date
Jan 27, 2022
Microchip Technology Caldicot Limited
Philip Andrew Swire
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
LOGIC DRIVE USING STANDARD COMMODITY PROGRAMMABLE LOGIC IC CHIPS CO...
Publication number
20220029626
Publication date
Jan 27, 2022
iCometrue Company Ltd.
Mou-Shiung LIN
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
LOGIC DRIVE USING STANDARD COMMODITY PROGRAMMABLE LOGIC IC CHIPS CO...
Publication number
20220014198
Publication date
Jan 13, 2022
iCometrue Company Ltd.
Jin-Yuan LEE
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
POWER AMPLIFIER MODULES INCLUDING TOPSIDE COOLING INTERFACES AND ME...
Publication number
20210328552
Publication date
Oct 21, 2021
NXP USA, Inc.
Geoffrey Tucker
H03 - BASIC ELECTRONIC CIRCUITRY
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Patent Application
CHIP PACKAGE WITH REDISTRIBUTION STRUCTURE
Publication number
20210242122
Publication date
Aug 5, 2021
Taiwan Semiconductor Manufacturing Company, Ltd.
Shin-Puu JENG
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
METHOD OF MANUFACTURING PACKAGE-ON-PACKAGE DEVICE AND BONDING APPAR...
Publication number
20210225829
Publication date
Jul 22, 2021
Samsung Electronics Co., Ltd.
JUNHO CHO
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
Publication number
20210202336
Publication date
Jul 1, 2021
Advanced Semiconductor Engineering, Inc.
Yung-Shun CHANG
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
EMBEDDED COPPER STRUCTURE FOR MICROELECTRONICS PACKAGE
Publication number
20210125958
Publication date
Apr 29, 2021
Flex Ltd.
Cheng Yang
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
THIN BONDED INTERPOSER PACKAGE
Publication number
20210111151
Publication date
Apr 15, 2021
Amkor Technology Singapore Holding Pte. Ltd.
Christopher J. Berry
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
Publication number
20210098330
Publication date
Apr 1, 2021
Taiwan Semiconductor Manufacturing Co., Ltd.
Shih-Hui Wang
H01 - BASIC ELECTRIC ELEMENTS