the second connecting process involving a wire connector

Industry

CPC
H01L2224/92127

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/92127the second connecting process involving a wire connector

Industries

Please log in for detailed analytics

Patents Grantslast 30 patents

Information Patent Grant
Light-emitting device with metal inlay and bottom contacts
- Patent number 12,051,685
- Issue date Jul 30, 2024
- Lumileds, LLC
- Tze Yang Hin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of manufacturing light-emitting devices with metal inlays a...
- Patent number 12,051,686
- Issue date Jul 30, 2024
- Lumileds, LLC
- Tze Yang Hin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light-emitting diode lighting system with wirebonded hybridized device
- Patent number 11,756,947
- Issue date Sep 12, 2023
- Lumileds LLC
- Wan-Ying Sau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of manufacturing light-emitting devices with metal inlays a...
- Patent number 11,373,991
- Issue date Jun 28, 2022
- Lumileds LLC
- Tze Yang Hin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package structure and manufacturing method thereof
- Patent number 11,362,057
- Issue date Jun 14, 2022
- Unimicron Technology Corp.
- Pu-Ju Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package
- Patent number 10,672,696
- Issue date Jun 2, 2020
- Advanced Semiconductor Engineering, Inc.
- Jen-Kuang Fang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and packages and methods of forming semicondu...
- Patent number 10,083,937
- Issue date Sep 25, 2018
- Micron Technology, Inc.
- Anthony D. Veches
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device with periphery contact pads surrounding central c...
- Patent number 9,859,196
- Issue date Jan 2, 2018
- STMicroelectronics (Shenzhen) R&D Co., Ltd.
- Jing-En Luan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked structure of semiconductor chips having via holes and metal...
- Patent number 9,704,829
- Issue date Jul 11, 2017
- Win Semiconductor Corp.
- Chang-Hwang Hua
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit chip using top post-passivation technology and b...
- Patent number 9,612,615
- Issue date Apr 4, 2017
- QUALCOMM Incorporated
- Mou-Shiung Lin
- G11 - INFORMATION STORAGE
Information Patent Grant
Articles including bonded metal structures and methods of preparing...
- Patent number 9,570,430
- Issue date Feb 14, 2017
- GLOBALFOUNDRIES, INC.
- Frank Kuechenmeister
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device with first and second contact pads and related me...
- Patent number 9,466,557
- Issue date Oct 11, 2016
- STMicroelectronics (Shenzhen) R&D Co. Ltd.
- Jing-En Luan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 9,443,793
- Issue date Sep 13, 2016
- Panasonic Corporation
- Hiroki Yamashita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of fabricating the same
- Patent number 9,437,586
- Issue date Sep 6, 2016
- Samsung Electronics Co., Ltd.
- Min gi Hong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Land grid array semiconductor device packages
- Patent number 9,355,992
- Issue date May 31, 2016
- Micron Technology, Inc.
- Lee Choon Kuan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sensor and method for manufacturing sensor
- Patent number 9,255,940
- Issue date Feb 9, 2016
- Seiko Epson Corporation
- Satoshi Nakajima
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor device with stacked power converter
- Patent number 9,177,944
- Issue date Nov 3, 2015
- Xilinx, Inc.
- Bernard J. New
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Land grid array semiconductor device packages
- Patent number 8,796,836
- Issue date Aug 5, 2014
- Micron Technology, Inc.
- Choon Kuan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Face-to-face (F2F) hybrid structure for an integrated circuit
- Patent number 8,637,983
- Issue date Jan 28, 2014
- ATI Technologies ULC
- Liane Martinez
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Multi-chip package with pillar connection
- Patent number 8,637,984
- Issue date Jan 28, 2014
- MOSAID Technologies Incorporated
- Roland Schuetz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit (IC) package stacking and IC packages formed by...
- Patent number 8,581,381
- Issue date Nov 12, 2013
- Broadcom Corporation
- Sam Ziqun Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical assembly
- Patent number 8,508,952
- Issue date Aug 13, 2013
- Gemalto SA
- Beatrice Bonvalot
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Process to allow electrical and mechanical connection of an electri...
- Patent number 8,429,813
- Issue date Apr 30, 2013
- Gemalto SA
- Beatrice Bonvalot
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Semiconductor module having discrete components and method for prod...
- Patent number 7,795,727
- Issue date Sep 14, 2010
- Infineon Technologies AG
- Michael Bauer
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Integrated circuit packaging system with stacked device and method...
- Patent number 7,691,674
- Issue date Apr 6, 2010
- Stats Chippac Ltd.
- Henry Descalzo Bathan
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD FOR ARRANGING REDISTRIBUTION LAY...
- Publication number 20240395762
- Publication date Nov 28, 2024
- NANYA TECHNOLOGY CORPORATION
- Wu-Der Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD FOR ARRANGING REDISTRIBUTION LAY...
- Publication number 20240395763
- Publication date Nov 28, 2024
- NANYA TECHNOLOGY CORPORATION
- Wu-Der Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF MANUFACTURING LIGHT-EMITTING DEVICES WITH METAL INLAYS A...
- Publication number 20220285335
- Publication date Sep 8, 2022
- Lumileds LLC
- Tze Yang HIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT-EMITTING DIODE LIGHTING SYSTEM WITH WIREBONDED HYBRIDIZED DEVICE
- Publication number 20210249395
- Publication date Aug 12, 2021
- Lumileds LLC
- Wan-Ying SAU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF MANUFACTURING LIGHT-EMITTING DEVICES WITH METAL INLAYS A...
- Publication number 20210249398
- Publication date Aug 12, 2021
- Lumileds LLC
- Tze Yang HIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20210118839
- Publication date Apr 22, 2021
- Unimicron Technology Corp.
- Pu-Ju Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND PACKAGES AND METHODS OF FORMING SEMICONDU...
- Publication number 20170069603
- Publication date Mar 9, 2017
- Micron Technology, Inc.
- Anthony D. Veches
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Circuit Device With Wire Bond Connections
- Publication number 20160035652
- Publication date Feb 4, 2016
- TEXAS INSTRUMENTS INCORPORATED
- Genki Yano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LAND GRID ARRAY SEMICONDUCTOR DEVICE PACKAGES
- Publication number 20140342476
- Publication date Nov 20, 2014
- Lee Choon Kuan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FCoC (Flip Chip on Chip) Package and Manufacturing Method thereof
- Publication number 20140302640
- Publication date Oct 9, 2014
- Fei Qin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE OF A SEMICONDUCTOR CHIP WITH SUBSTRATE VIA HOLES AND META...
- Publication number 20140252602
- Publication date Sep 11, 2014
- WIN SEMICONDUCTORS CORP.
- Chang-Hwang HUA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SENSOR AND METHOD FOR MANUFACTURING SENSOR
- Publication number 20140204552
- Publication date Jul 24, 2014
- SEIKO EPSON CORPORATION
- Satoshi Nakajima
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MULTI-CHIP PACKAGE WITH PILLAR CONNECTION
- Publication number 20140141566
- Publication date May 22, 2014
- MOSAID TECHNOLOGIES INCORPORATED
- Roland SCHUETZ
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20140103504
- Publication date Apr 17, 2014
- PANASONIC CORPORATION
- HIROKI YAMASHITA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH STACKED POWER CONVERTER
- Publication number 20120139103
- Publication date Jun 7, 2012
- Xilinx, Inc.
- Bernard J. New
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-CHIP PACKAGE WITH PILLAR CONNECTION
- Publication number 20110298128
- Publication date Dec 8, 2011
- MOSAID TECHNOLOGIES INCORPORATED
- Roland SCHUETZ
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Process to Allow Electrical and Mechanical Connection of an Electri...
- Publication number 20100157555
- Publication date Jun 24, 2010
- Beatrice BONVALOT
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FACE-TO-FACE (F2F) HYBRID STRUCTURE FOR AN INTEGRATED CIRCUIT
- Publication number 20100155938
- Publication date Jun 24, 2010
- ATI Technologies ULC
- Liane Martinez
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Integrated circuit (IC) package stacking and IC packages formed by...
- Publication number 20070290376
- Publication date Dec 20, 2007
- BROADCOM CORPORATION
- Sam Ziqun Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE HAVINGDISCRETE COMPONENTS AND METHOD FOR PRODU...
- Publication number 20070235865
- Publication date Oct 11, 2007
- Infineon Technologies AG
- Michael Bauer
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Land grid array semiconductor device packages, assemblies including...
- Publication number 20070045818
- Publication date Mar 1, 2007
- Lee Choon Kuan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Process to allow electrical and mechanical connection of an electri...
- Publication number 20050034303
- Publication date Feb 17, 2005
- Schlumberger Systemes
- Beatrice Bonvalot
- H01 - BASIC ELECTRIC ELEMENTS

the second connecting process involving a wire connector

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Light-emitting device with metal inlay and bottom contacts

Methods of manufacturing light-emitting devices with metal inlays a...

Light-emitting diode lighting system with wirebonded hybridized device

Methods of manufacturing light-emitting devices with metal inlays a...

Chip package structure and manufacturing method thereof

Semiconductor device package

Semiconductor devices and packages and methods of forming semicondu...

Electronic device with periphery contact pads surrounding central c...

Stacked structure of semiconductor chips having via holes and metal...

Integrated circuit chip using top post-passivation technology and b...

Articles including bonded metal structures and methods of preparing...

Electronic device with first and second contact pads and related me...

Semiconductor device

Semiconductor package and method of fabricating the same

Land grid array semiconductor device packages

Sensor and method for manufacturing sensor

Semiconductor device with stacked power converter

Land grid array semiconductor device packages

Face-to-face (F2F) hybrid structure for an integrated circuit

Multi-chip package with pillar connection

Integrated circuit (IC) package stacking and IC packages formed by...

Electrical assembly

Process to allow electrical and mechanical connection of an electri...

Semiconductor module having discrete components and method for prod...

Integrated circuit packaging system with stacked device and method...

Patents Applicationslast 30 patents

SEMICONDUCTOR STRUCTURE AND METHOD FOR ARRANGING REDISTRIBUTION LAY...

SEMICONDUCTOR STRUCTURE AND METHOD FOR ARRANGING REDISTRIBUTION LAY...

METHODS OF MANUFACTURING LIGHT-EMITTING DEVICES WITH METAL INLAYS A...

LIGHT-EMITTING DIODE LIGHTING SYSTEM WITH WIREBONDED HYBRIDIZED DEVICE

METHODS OF MANUFACTURING LIGHT-EMITTING DEVICES WITH METAL INLAYS A...

CHIP PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICES AND PACKAGES AND METHODS OF FORMING SEMICONDU...

Integrated Circuit Device With Wire Bond Connections

LAND GRID ARRAY SEMICONDUCTOR DEVICE PACKAGES

FCoC (Flip Chip on Chip) Package and Manufacturing Method thereof

STRUCTURE OF A SEMICONDUCTOR CHIP WITH SUBSTRATE VIA HOLES AND META...

SENSOR AND METHOD FOR MANUFACTURING SENSOR

MULTI-CHIP PACKAGE WITH PILLAR CONNECTION

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE WITH STACKED POWER CONVERTER

MULTI-CHIP PACKAGE WITH PILLAR CONNECTION

Process to Allow Electrical and Mechanical Connection of an Electri...

FACE-TO-FACE (F2F) HYBRID STRUCTURE FOR AN INTEGRATED CIRCUIT

Integrated circuit (IC) package stacking and IC packages formed by...

SEMICONDUCTOR MODULE HAVINGDISCRETE COMPONENTS AND METHOD FOR PRODU...

Land grid array semiconductor device packages, assemblies including...

Process to allow electrical and mechanical connection of an electri...