the second connecting process involving a wire connector

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H01L2224/92147

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/92147the second connecting process involving a wire connector

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Power die package
- Patent number 11,515,238
- Issue date Nov 29, 2022
- NXP USA, INC.
- You Ge
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-die package with bridge layer
- Patent number 11,476,125
- Issue date Oct 18, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei Sen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting device and method of manufacturing the light emittin...
- Patent number 11,315,913
- Issue date Apr 26, 2022
- Nichia Corporation
- Hiroaki Ukawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic devices, stacked microelectronic devices, and metho...
- Patent number 11,239,128
- Issue date Feb 1, 2022
- Micron Technology, Inc.
- Seng Kim Dalson Ye
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structures and methods for shielding magnetically sensitive components
- Patent number 11,088,317
- Issue date Aug 10, 2021
- EVERSPIN TECHNOLOGIES, INC.
- Wenchin Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pressure sensor, in particular a microphone with improved layout
- Patent number 10,822,227
- Issue date Nov 3, 2020
- Commissariat a l'Energie Atomique et Aux Energies Alternatives
- Philippe Robert
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Wafer level flat no-lead semiconductor packages and methods of manu...
- Patent number 10,770,333
- Issue date Sep 8, 2020
- Semiconductor Components Industries, LLC
- Darrell D. Truhitte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level flat no-lead semiconductor packages and methods of manu...
- Patent number 10,770,332
- Issue date Sep 8, 2020
- Semiconductor Components Industries, LLC
- Darrell D. Truhitte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 10,727,163
- Issue date Jul 28, 2020
- Mitsubishi Electric Corporation
- Junji Fujino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level flat no-lead semiconductor packages and methods of manu...
- Patent number 10,707,111
- Issue date Jul 7, 2020
- Semiconductor Components Industries, LLC
- Darrell D. Truhitte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for making multi-die package with bridge layer
- Patent number 10,643,861
- Issue date May 5, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei Sen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure of fingerprint identification chip
- Patent number 10,445,553
- Issue date Oct 15, 2019
- Primax Electronics Ltd.
- Tsung-Yi Lu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Light emitting device and method of manufacturing the light emittin...
- Patent number 10,431,572
- Issue date Oct 1, 2019
- Nichia Corporation
- Hiroaki Ukawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic devices, stacked microelectronic devices, and metho...
- Patent number 10,431,513
- Issue date Oct 1, 2019
- Micron Technology, Inc.
- Seng Kim Dalson Ye
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Shielded magnetoresistive random access memory devices and methods...
- Patent number 10,431,732
- Issue date Oct 1, 2019
- GLOBALFOUNDRIES Singapore Pte. Ltd.
- Bhushan Bharat
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 10,410,945
- Issue date Sep 10, 2019
- Hitachi, Ltd.
- Akitoyo Konno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level flat no-lead semiconductor packages and methods of manu...
- Patent number 10,269,609
- Issue date Apr 23, 2019
- Semiconductor Components Industries, LLC
- Darrell D. Truhitte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming an embedded SoP fan-out...
- Patent number 10,217,702
- Issue date Feb 26, 2019
- STATS ChipPAC Pte. Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire bonded electronic devices to round wire
- Patent number 10,172,240
- Issue date Jan 1, 2019
- Automated Assembly Corporation
- Robert Neuman
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor arrangement, semiconductor system and method of formi...
- Patent number 10,115,646
- Issue date Oct 30, 2018
- Infineon Technologies AG
- Juergen Hoegerl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Support member, wiring substrate, method for manufacturing wiring s...
- Patent number 9,997,441
- Issue date Jun 12, 2018
- Shinko Electric Industries Co., Ltd.
- Tomohiro Suzuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 9,997,499
- Issue date Jun 12, 2018
- Renesas Electronics Corporation
- Hiroshi Kuroda
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Semiconductor device
- Patent number 9,978,701
- Issue date May 22, 2018
- Fuji Electric Co., Ltd.
- Takashi Saito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structures and methods for shielding magnetically sensitive components
- Patent number 9,954,163
- Issue date Apr 24, 2018
- EVERSPIN TECHNOLOGIES, INC.
- Wenchin Lin
- G11 - INFORMATION STORAGE
Information Patent Grant
Wafer level flat no-lead semiconductor packages and methods of manu...
- Patent number 9,892,952
- Issue date Feb 13, 2018
- Semiconductor Components Industries, LLC
- Darrell Truhitte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic package with stacked microelectronic units and meth...
- Patent number 9,876,002
- Issue date Jan 23, 2018
- Invensas Corporation
- Terrence Caskey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package and method for forming the same
- Patent number 9,865,526
- Issue date Jan 9, 2018
- Xintec Inc.
- Yu-Lung Huang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor device, semiconductor package, and method for manufac...
- Patent number 9,754,916
- Issue date Sep 5, 2017
- STMicroelectronics Pte Ltd
- Jing-En Luan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 9,754,919
- Issue date Sep 5, 2017
- Renesas Electronics Corporation
- Hiroshi Kuroda
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Packaging structure for thin die and method for manufacturing the same
- Patent number 9,646,937
- Issue date May 9, 2017
- Dawning Leading Technology Inc.
- Diann-Fang Lin
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
- Publication number 20240312976
- Publication date Sep 19, 2024
- KIOXIA Corporation
- Keiichi NIWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROMECHANICAL COMPONENT
- Publication number 20240300807
- Publication date Sep 12, 2024
- ROBERT BOSCH GmbH
- Jan Stiedl
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
POWER MODULE FOR A VEHICLE
- Publication number 20240194576
- Publication date Jun 13, 2024
- ROBERT BOSCH GmbH
- Juergen Zipprich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240164118
- Publication date May 16, 2024
- RENESAS ELECTRONICS CORPORATION
- Kazuaki TSUCHIYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240105561
- Publication date Mar 28, 2024
- Kabushiki Kaisha Toshiba
- Fumiyoshi KAWASHIRO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...
- Publication number 20240023346
- Publication date Jan 18, 2024
- Samsung Electronics Co., Ltd.
- Younghun CHEONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE WITH SUBSTRATE FOR EL...
- Publication number 20230369306
- Publication date Nov 16, 2023
- NANYA TECHNOLOGY CORPORATION
- Wu-Der Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING WINDOW BALL GRID ARRAY (WBGA) PACKAGE
- Publication number 20230361073
- Publication date Nov 9, 2023
- NANYA TECHNOLOGY CORPORATION
- Wu-Der Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATING AN ELECTRONIC DEVICE
- Publication number 20210125957
- Publication date Apr 29, 2021
- Commissariat A L'Energie Atomique et Aux Energies Alternatives
- Jean BRUN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods for Making Multi-Die Package With Bridge Layer
- Publication number 20200266074
- Publication date Aug 20, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei Sen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20180277518
- Publication date Sep 27, 2018
- RENESAS ELECTRONICS CORPORATION
- Tetsuya IIDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURES AND METHODS FOR SHIELDING MAGNETICALLY SENSITIVE COMPONENTS
- Publication number 20180205005
- Publication date Jul 19, 2018
- EVERSPIN TECHNOLOGIES, INC.
- Wenchin LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER LEVEL FLAT NO-LEAD SEMICONDUCTOR PACKAGES AND METHODS OF MANU...
- Publication number 20180174881
- Publication date Jun 21, 2018
- Semiconductor Components Industries, LLC
- Darrell D. TRUHITTE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20170330864
- Publication date Nov 16, 2017
- Renesas Electronics Corporation
- Hiroshi KURODA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRE BONDED ELECTRONIC DEVICES TO ROUND WIRE
- Publication number 20170200694
- Publication date Jul 13, 2017
- AUTOMATED ASSEMBLY CORPORATION
- Robert Neuman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC CONNECTION STRUCTURE FOR COUPLING PINS OF CHIP WITH WIRI...
- Publication number 20160293570
- Publication date Oct 6, 2016
- HON HAI PRECISION INDUSTRY CO., LTD.
- CHIH-FANG CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, SEMICONDUCTOR PACKAGE, AND METHOD FOR MANUFAC...
- Publication number 20160190097
- Publication date Jun 30, 2016
- STMicroelectronics Pte Ltd
- Jing-En Luan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20160148859
- Publication date May 26, 2016
- Renesas Electronics Corporation
- Akira MUTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Single Layer Coreless Substrate
- Publication number 20140377914
- Publication date Dec 25, 2014
- Zhuhai Advanced Chip Carriers & Electronic Substrate Solutions Technologies C...
- Dror Hurwitz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STACKS AND METHODS OF MANUFACTURING THE SAME
- Publication number 20140342501
- Publication date Nov 20, 2014
- Il-Ho KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURE OF FACE-DOWN MICROELECTRONIC PACKAGES
- Publication number 20140273346
- Publication date Sep 18, 2014
- Richard Dewitt Crisp
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20140252613
- Publication date Sep 11, 2014
- Yoshinori IWAMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC PACKAGE WITH STACKED MICROELECTRONIC UNITS AND METH...
- Publication number 20140212996
- Publication date Jul 31, 2014
- Invensas Corporation
- Terrence Caskey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COPPER WIRE BONDING STRUCTURE IN SEMICONDUCTOR DEVICE AND FABRICATI...
- Publication number 20140175628
- Publication date Jun 26, 2014
- Hua Pan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BALL GRID ARRAY SEMICONDUCTOR DEVICE AND ITS MANUFACTURE
- Publication number 20140170814
- Publication date Jun 19, 2014
- FUJITSU SEMICONDUCTOR LIMITED
- Hayato OKUDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Single Layer Coreless Substrate
- Publication number 20140167234
- Publication date Jun 19, 2014
- Zhuhai Advanced Chip Carriers & Electronic Substrate Technologies Co. Ltd.
- Dror Hurwitz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20140011453
- Publication date Jan 9, 2014
- Hiroshi Kuroda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE AND METHODS FOR MANUFACTURING A CHIP PACKAGE
- Publication number 20140001634
- Publication date Jan 2, 2014
- INFINEON TECHNOLOGIES AG
- Holger Torwesten
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming an Embedded SOP Fan-Out...
- Publication number 20130341784
- Publication date Dec 26, 2013
- STATS ChipPAC, Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADHESIVE COMPOSITION AND SEMICONDUCTOR DEVICE USING SAME
- Publication number 20130302603
- Publication date Nov 14, 2013
- HITACHI CHEMICAL COMPANY, LTD.
- Kaoru Konno
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...

the second connecting process involving a wire connector

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Power die package

Multi-die package with bridge layer

Light emitting device and method of manufacturing the light emittin...

Microelectronic devices, stacked microelectronic devices, and metho...

Structures and methods for shielding magnetically sensitive components

Pressure sensor, in particular a microphone with improved layout

Wafer level flat no-lead semiconductor packages and methods of manu...

Wafer level flat no-lead semiconductor packages and methods of manu...

Semiconductor device

Wafer level flat no-lead semiconductor packages and methods of manu...

Methods for making multi-die package with bridge layer

Package structure of fingerprint identification chip

Light emitting device and method of manufacturing the light emittin...

Microelectronic devices, stacked microelectronic devices, and metho...

Shielded magnetoresistive random access memory devices and methods...

Semiconductor device

Wafer level flat no-lead semiconductor packages and methods of manu...

Semiconductor device and method of forming an embedded SoP fan-out...

Wire bonded electronic devices to round wire

Semiconductor arrangement, semiconductor system and method of formi...

Support member, wiring substrate, method for manufacturing wiring s...

Semiconductor device and method of manufacturing the same

Semiconductor device

Structures and methods for shielding magnetically sensitive components

Wafer level flat no-lead semiconductor packages and methods of manu...

Microelectronic package with stacked microelectronic units and meth...

Chip package and method for forming the same

Semiconductor device, semiconductor package, and method for manufac...

Semiconductor device and method of manufacturing the same

Packaging structure for thin die and method for manufacturing the same

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE

MICROMECHANICAL COMPONENT

POWER MODULE FOR A VEHICLE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...

METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE WITH SUBSTRATE FOR EL...

METHOD FOR MANUFACTURING WINDOW BALL GRID ARRAY (WBGA) PACKAGE

METHOD FOR FABRICATING AN ELECTRONIC DEVICE

Methods for Making Multi-Die Package With Bridge Layer

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

STRUCTURES AND METHODS FOR SHIELDING MAGNETICALLY SENSITIVE COMPONENTS

WAFER LEVEL FLAT NO-LEAD SEMICONDUCTOR PACKAGES AND METHODS OF MANU...

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

WIRE BONDED ELECTRONIC DEVICES TO ROUND WIRE

ELECTRONIC CONNECTION STRUCTURE FOR COUPLING PINS OF CHIP WITH WIRI...

SEMICONDUCTOR DEVICE, SEMICONDUCTOR PACKAGE, AND METHOD FOR MANUFAC...

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

Single Layer Coreless Substrate

PACKAGE STACKS AND METHODS OF MANUFACTURING THE SAME

MANUFACTURE OF FACE-DOWN MICROELECTRONIC PACKAGES

SEMICONDUCTOR DEVICE

MICROELECTRONIC PACKAGE WITH STACKED MICROELECTRONIC UNITS AND METH...

COPPER WIRE BONDING STRUCTURE IN SEMICONDUCTOR DEVICE AND FABRICATI...

BALL GRID ARRAY SEMICONDUCTOR DEVICE AND ITS MANUFACTURE

Single Layer Coreless Substrate

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

CHIP PACKAGE AND METHODS FOR MANUFACTURING A CHIP PACKAGE

Semiconductor Device and Method of Forming an Embedded SOP Fan-Out...

ADHESIVE COMPOSITION AND SEMICONDUCTOR DEVICE USING SAME