the second connecting process involving a wire connector

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H01L2224/92227

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/92227the second connecting process involving a wire connector

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Patents Grantslast 30 patents

Information Patent Grant
Camera module, and photosensitive assembly and manufacturing method...
- Patent number 12,211,864
- Issue date Jan 28, 2025
- NINGBO SUNNY OPOTECH CO., LTD.
- Zhongyu Luan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Molded proximity sensor
- Patent number 11,988,743
- Issue date May 21, 2024
- STMicroelectronics Pte Ltd
- Jing-En Luan
- G01 - MEASURING TESTING
Information Patent Grant
Integrated circuit (IC) package with stacked die wire bond connecti...
- Patent number 11,676,905
- Issue date Jun 13, 2023
- QUALCOMM Incorporated
- Kuiwon Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory devices with controllers under memory packages and associate...
- Patent number 11,658,154
- Issue date May 23, 2023
- Micron Technology, Inc.
- Seng Kim Ye
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Molded proximity sensor
- Patent number 11,513,220
- Issue date Nov 29, 2022
- STMicroelectronics Pte Ltd
- Jing-En Luan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level flat no-lead semiconductor packages and methods of manu...
- Patent number 10,770,333
- Issue date Sep 8, 2020
- Semiconductor Components Industries, LLC
- Darrell D. Truhitte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level flat no-lead semiconductor packages and methods of manu...
- Patent number 10,770,332
- Issue date Sep 8, 2020
- Semiconductor Components Industries, LLC
- Darrell D. Truhitte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for electromagnetic interference shielding
- Patent number 10,763,220
- Issue date Sep 1, 2020
- Intel Corporation
- Rajendra C. Dias
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory devices with controllers under memory packages and associate...
- Patent number 10,727,206
- Issue date Jul 28, 2020
- Micron Technology, Inc.
- Seng Kim Ye
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Wafer level flat no-lead semiconductor packages and methods of manu...
- Patent number 10,707,111
- Issue date Jul 7, 2020
- Semiconductor Components Industries, LLC
- Darrell D. Truhitte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interchip backside connection
- Patent number 10,700,017
- Issue date Jun 30, 2020
- International Business Machines Corporation
- Effendi Leobandung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Molded proximity sensor
- Patent number 10,429,509
- Issue date Oct 1, 2019
- STMicroelectronics Pte Ltd
- Jing-En Luan
- G01 - MEASURING TESTING
Information Patent Grant
Wafer level flat no-lead semiconductor packages and methods of manu...
- Patent number 10,269,609
- Issue date Apr 23, 2019
- Semiconductor Components Industries, LLC
- Darrell D. Truhitte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for electromagnetic interference shielding
- Patent number 10,229,887
- Issue date Mar 12, 2019
- Intel Corporation
- Rajendra C. Dias
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die attachment for packaged semiconductor device
- Patent number 10,217,698
- Issue date Feb 26, 2019
- NXP USA, INC.
- Akhilesh K. Singh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory devices with controllers under memory packages and associate...
- Patent number 10,128,217
- Issue date Nov 13, 2018
- Micron Technology, Inc.
- Seng Kim Ye
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Multilayer semiconductor integrated circuit device
- Patent number 9,978,717
- Issue date May 22, 2018
- THRUCHIP JAPAN INC.
- Tadahiro Kuroda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level flat no-lead semiconductor packages and methods of manu...
- Patent number 9,892,952
- Issue date Feb 13, 2018
- Semiconductor Components Industries, LLC
- Darrell Truhitte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including barrier members and method of manuf...
- Patent number 9,741,633
- Issue date Aug 22, 2017
- Samsung Electronics Co., Ltd.
- Jian Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory devices with controllers under memory packages and associate...
- Patent number 9,627,367
- Issue date Apr 18, 2017
- Micron Technology, Inc.
- Seng Kim Ye
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Wafer level packaging for proximity sensor
- Patent number 9,583,666
- Issue date Feb 28, 2017
- STMicroelectronics Pte Ltd
- Jing-En Luan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die attachment for packaged semiconductor device
- Patent number 9,559,077
- Issue date Jan 31, 2017
- NXP USA, INC.
- Akhilesh K. Singh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including semiconductor chips stacked via rela...
- Patent number 9,508,670
- Issue date Nov 29, 2016
- Shinko Electric Industries Co., Ltd.
- Koji Hara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D device packaging using through-substrate pillars
- Patent number 9,508,701
- Issue date Nov 29, 2016
- FREESCALE SEMICONDUCTOR, INC.
- Douglas M. Reber
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for mounting a chip and chip package
- Patent number 9,378,986
- Issue date Jun 28, 2016
- Point Engineering Co., Inc.
- Bum Mo Ahn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages having through electrodes and methods for fa...
- Patent number 9,245,771
- Issue date Jan 26, 2016
- Samsung Electronics Co., Ltd.
- Hyunsoo Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with stacked power converter
- Patent number 9,177,944
- Issue date Nov 3, 2015
- Xilinx, Inc.
- Bernard J. New
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 8,803,304
- Issue date Aug 12, 2014
- Shinko Electric Industries Co., Ltd.
- Yohei Igarashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packaging system with stiffener and method of ma...
- Patent number 8,492,888
- Issue date Jul 23, 2013
- Stats Chippac Ltd.
- HeeJo Chi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method of a semiconductor de...
- Patent number 8,354,298
- Issue date Jan 15, 2013
- NEC Corporation
- Shinji Tanaka
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
MOLDED PROXIMITY SENSOR
- Publication number 20230071048
- Publication date Mar 9, 2023
- STMicroelectronics Pte Ltd
- Jing-En LUAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT (IC) PACKAGE WITH STACKED DIE WIRE BOND CONNECTI...
- Publication number 20220037257
- Publication date Feb 3, 2022
- QUALCOMM Incorporated
- Kuiwon Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LASER ABLATION SURFACE TREATMENT FOR MICROELECTRONIC ASSEMBLY
- Publication number 20200273720
- Publication date Aug 27, 2020
- TEXAS INSTRUMENTS INCORPORATED
- Leon Stiborek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR ELECTROMAGNETIC INTERFERENCE SHIELDING
- Publication number 20190157215
- Publication date May 23, 2019
- Intel Corporation
- Rajendra C. Dias
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER LEVEL FLAT NO-LEAD SEMICONDUCTOR PACKAGES AND METHODS OF MANU...
- Publication number 20180174881
- Publication date Jun 21, 2018
- Semiconductor Components Industries, LLC
- Darrell D. TRUHITTE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Flat No-Leads Package With Improved Contact Pins
- Publication number 20170294367
- Publication date Oct 12, 2017
- MICROCHIP TECHNOLOGY INCORPORATED
- Rangsun Kitnarong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR ELECTROMAGNETIC INTERFERENCE SHIELDING
- Publication number 20170287846
- Publication date Oct 5, 2017
- Intel Corporation
- Rajendra C. Dias
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Mounting a Chip and Chip Package
- Publication number 20150102486
- Publication date Apr 16, 2015
- Point Engineering Co., Ltd.
- Bum Mo Ahn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20140374901
- Publication date Dec 25, 2014
- Samsung Electronics Co., Ltd.
- Ma Huishu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES HAVING THROUGH ELECTRODES AND METHODS FOR FA...
- Publication number 20140377909
- Publication date Dec 25, 2014
- Hyunsoo CHUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH STIFFENER AND METHOD OF MA...
- Publication number 20130056863
- Publication date Mar 7, 2013
- HeeJo Chi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH STACKED POWER CONVERTER
- Publication number 20120139103
- Publication date Jun 7, 2012
- Xilinx, Inc.
- Bernard J. New
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF A SEMICONDUCTOR DE...
- Publication number 20120135568
- Publication date May 31, 2012
- Shinji Tanaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20110316172
- Publication date Dec 29, 2011
- Shinko Electric Industries Co., Ltd.
- Yohei Igarashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF A SEMICONDUCTOR DE...
- Publication number 20100072601
- Publication date Mar 25, 2010
- Shinji Tanaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE
- Publication number 20080197503
- Publication date Aug 21, 2008
- VIA TECHNOLOGIES, INC.
- Chi-Hsing Hsu
- H01 - BASIC ELECTRIC ELEMENTS

the second connecting process involving a wire connector

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Camera module, and photosensitive assembly and manufacturing method...

Molded proximity sensor

Integrated circuit (IC) package with stacked die wire bond connecti...

Memory devices with controllers under memory packages and associate...

Molded proximity sensor

Wafer level flat no-lead semiconductor packages and methods of manu...

Wafer level flat no-lead semiconductor packages and methods of manu...

Systems and methods for electromagnetic interference shielding

Memory devices with controllers under memory packages and associate...

Wafer level flat no-lead semiconductor packages and methods of manu...

Interchip backside connection

Molded proximity sensor

Wafer level flat no-lead semiconductor packages and methods of manu...

Systems and methods for electromagnetic interference shielding

Die attachment for packaged semiconductor device

Memory devices with controllers under memory packages and associate...

Multilayer semiconductor integrated circuit device

Wafer level flat no-lead semiconductor packages and methods of manu...

Semiconductor package including barrier members and method of manuf...

Memory devices with controllers under memory packages and associate...

Wafer level packaging for proximity sensor

Die attachment for packaged semiconductor device

Semiconductor device including semiconductor chips stacked via rela...

3D device packaging using through-substrate pillars

Method for mounting a chip and chip package

Semiconductor packages having through electrodes and methods for fa...

Semiconductor device with stacked power converter

Semiconductor package and manufacturing method thereof

Integrated circuit packaging system with stiffener and method of ma...

Semiconductor device and manufacturing method of a semiconductor de...

Patents Applicationslast 30 patents

MOLDED PROXIMITY SENSOR

INTEGRATED CIRCUIT (IC) PACKAGE WITH STACKED DIE WIRE BOND CONNECTI...

LASER ABLATION SURFACE TREATMENT FOR MICROELECTRONIC ASSEMBLY

SYSTEMS AND METHODS FOR ELECTROMAGNETIC INTERFERENCE SHIELDING

WAFER LEVEL FLAT NO-LEAD SEMICONDUCTOR PACKAGES AND METHODS OF MANU...

Flat No-Leads Package With Improved Contact Pins

SYSTEMS AND METHODS FOR ELECTROMAGNETIC INTERFERENCE SHIELDING

Method for Mounting a Chip and Chip Package

SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME

SEMICONDUCTOR PACKAGES HAVING THROUGH ELECTRODES AND METHODS FOR FA...

INTEGRATED CIRCUIT PACKAGING SYSTEM WITH STIFFENER AND METHOD OF MA...

SEMICONDUCTOR DEVICE WITH STACKED POWER CONVERTER

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF A SEMICONDUCTOR DE...

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF A SEMICONDUCTOR DE...

CHIP PACKAGE